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1. 发明申请

US20220181369A1 METHOD OF MANUFACTURING CONNECTION STRUCTURE, CONNECTION STRUCTURE, FILM STRUCTURE, AND METHOD OF MANUFACTURING FILM STRUCTURE 有权
公开(公告)号：US20220181369A1
公开(公告)日：2022-06-09
申请号：US17437350
申请日：2020-03-02
申请人： DEXERIALS CORPORATION
发明人： Yusuke TANAKA , Yusuke KAMATA , Hidetsugu NAMIKI , Manabu SUZUKI
IPC分类号： H01L27/146 , H04N5/369
摘要： A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

2. 发明申请

US20190244937A1 DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20190244937A1
公开(公告)日：2019-08-08
申请号：US16081673
申请日：2017-02-20
申请人： DEXERIALS CORPORATION
发明人： Keiji HONJO , Hidetsugu NAMIKI , Yasuyuki HIGUCHI
IPC分类号： H01L25/075
CPC分类号： H01L25/0753 , G02B5/20 , G09F9/00 , G09F9/33 , H01L33/50 , H01L33/62 , H01L2224/16225 , H01L2224/95
摘要： A display device which can achieve increased brightness and resolution and a method for manufacturing the same as well as a light-emitting device and a method for manufacturing the same are provided. The device includes a plurality of light-emitting elements having a first face, arranged in units of subpixels, and having at least one of a first electrically conducting electrode and second electrically conducting electrode on the first face, a substrate having an electrode corresponding to the electrode on the first face of the plurality of light-emitting elements, an anisotropic conductive film providing an anisotropic conductive connection between the electrode on the first face of the plurality of light-emitting elements and the electrode of the substrate, and a wavelength conversion member converting a wavelength of light from the light-emitting elements in units of subpixels.

3. 发明申请

US20190016930A1 ADHESIVE COMPOSITION 审中-公开
公开(公告)号：US20190016930A1
公开(公告)日：2019-01-17
申请号：US16068206
申请日：2016-12-19
申请人： DEXERIALS CORPORATION
发明人： Hidetsugu NAMIKI , Tomoyuki ISHIMATSU , Takashi MATSUMURA , Masaharu AOKI
IPC分类号： C09J9/02 , C09J11/04 , C09J11/08 , C09J11/06 , C09J163/00 , H01L33/62 , H01L33/60
摘要： An adhesive composition having excellent life properties is provided. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent, and a hindered amine compound. This is presumably because the aluminum chelating agent stably exists due to the coordination of the nitrogen atom of the hindered amine compound with aluminum of the aluminum chelating agent.

4. 发明申请

US20180171184A1 ADHESIVE COMPOSITION 审中-公开
公开(公告)号：US20180171184A1
公开(公告)日：2018-06-21
申请号：US15579050
申请日：2016-06-01
申请人： DEXERIALS CORPORATION
发明人： Masaharu AOKI , Hidetsugu NAMIKI
IPC分类号： C09J9/02 , C09J163/00 , C09J133/02 , C09J133/08 , C09J11/04 , C09J11/08 , H01L33/62 , C09J181/04
CPC分类号： C09J9/02 , C08G59/66 , C08G59/70 , C08K5/17 , C08L81/02 , C09J11/04 , C09J11/06 , C09J11/08 , C09J133/00 , C09J133/02 , C09J133/066 , C09J133/08 , C09J163/00 , C09J181/04 , C09J201/02 , H01L33/62 , H01L2224/16225 , H01L2224/73204 , C08L33/20
摘要： An adhesive composition, capable of achieving excellent life performance and a wide margin for mounting, includes a cationic polymerizable compound, an aluminum chelate/silanol-based curing catalyst, and a nucleophilic compound containing a sulfur atom having an unshared electron pair. The nucleophilic compound is a thiol compound or an episulfide compound. The aluminum chelate/silanol-based curing catalyst includes an aluminum chelate curing agent, and a silanol compound or a silane coupling agent. The aluminum chelate curing agent constitutes a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound.

5. 发明申请

US20160194531A1 ADHESIVE AND LIGHT-EMITTING DEVICE 有权
标题翻译：粘合和发光装置
公开(公告)号：US20160194531A1
公开(公告)日：2016-07-07
申请号：US14916490
申请日：2014-09-09
申请人： DEXERIALS CORPORATION
发明人： Masaharu AOKI , Shiyuki KANISAWA , Hidetsugu NAMIKI , Taichi KOYAMA , Akira ISHIGAMI
IPC分类号： C09J133/20 , C09J9/02 , H01L33/62
CPC分类号： C09J133/20 , C08F220/18 , C08L33/066 , C08L33/068 , C08L2205/22 , C09J9/02 , C09J133/066 , C09J163/00 , H01B1/22 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/62 , H01L2224/16227 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29393 , H01L2224/294 , H01L2224/32225 , H01L2224/81424 , H01L2224/81487 , H01L2224/81903 , H01L2224/83424 , H01L2224/83487 , H01L2224/83851 , H01L2224/83862 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2933/0066 , H01L2924/00 , H01L2924/00014 , H01L2924/0665 , H01L2924/0635 , H01L2924/01006 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , C08F2220/1825 , C08F2220/1808 , C08F220/44 , C08F220/06 , C08F220/20 , C08K5/151
摘要： This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.
摘要翻译：该粘合剂包含环氧化合物，阳离子催化剂和丙烯酸树脂，其包括丙烯酸和具有羟基的丙烯酸酯。丙烯酸树脂中的丙烯酸与环氧化合物反应，产生丙烯酸树脂岛部分和环氧化合物海部之间的连接，并通过使氧化膜的表面粗糙化来增强相对于环氧化合物海部的锚固效果。此外，由于羟基的极性，丙烯酸树脂中的含羟基的丙烯酸酯与布线成为静电粘合剂。通过将由丙烯酸树脂岛部和环氧化合物海部构成的整个固化物以这种方式粘附到氧化膜，可以获得良好的粘合强度。

6. 发明申请

US20140225144A1 LIGHT-REFLECTIVE CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE, AND LIGHT-EMITTING DEVICE 审中-公开
标题翻译：光反射导电颗粒，各向异性导电粘合剂和发光装置
公开(公告)号：US20140225144A1
公开(公告)日：2014-08-14
申请号：US14222249
申请日：2014-03-21
申请人： Dexerials Corporation
发明人： Hidetsugu NAMIKI , Shiyuki KANISAWA , Hideaki UMAKOSHI
IPC分类号： H01L33/62 , H01L23/00 , H01L33/60
CPC分类号： H01B1/02 , C08G59/42 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01B1/22 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/2939 , H01L2224/29393 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/00014 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998 , H01L2924/00012 , H01L2924/00 , H01L2924/05432 , H01L2924/05341 , H01L2924/05342 , H01L2224/81 , H01L2224/83 , H01L2224/05599
摘要： A light-reflective conductive particle for an anisotropic conductive adhesive used for connecting a light-emitting element to a wiring board by anisotropic conductive connection includes a core particle covered with a metal material and a light reflecting layer formed of a light-reflective inorganic particle having a refractive index of 1.52 or greater on the surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or greater include a titanium oxide particle, a zinc oxide particle, and an aluminum oxide particle. The coverage of the light reflecting layer on the surface of the core particle is 70% or more.
摘要翻译：用于通过各向异性导电连接将发光元件连接到布线板的用于各向异性导电粘合剂的光反射导电颗粒包括被金属材料覆盖的芯颗粒和由反光无机颗粒形成的光反射层，所述光反射层具有核心颗粒表面的折射率为1.52或更大。折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒和氧化铝颗粒。芯粒子表面的光反射层的覆盖率为70％以上。

7. 发明申请

US20140097463A1 ANISOTROPIC CONDUCTIVE ADHESIVE 审中-公开
标题翻译：各向异性导电粘合剂
公开(公告)号：US20140097463A1
公开(公告)日：2014-04-10
申请号：US14104320
申请日：2013-12-12
申请人： Dexerials Corporation
发明人： Hidetsugu NAMIKI , Shiyuki KANISAWA , Genki KATAYANAGI
IPC分类号： H01L23/00 , H01L33/62
CPC分类号： H01L24/29 , C09J9/02 , C09J163/00 , H01B1/22 , H01L24/83 , H01L33/62 , H01L2924/07811 , H01L2924/12041 , H05K3/323 , H01L2924/00
摘要： An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM35, EM55, EM95, and EM150, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM55-95 and ΔEM95-150, respectively, the following expressions (1) to (5) are satisfied 700 Mpa≦EM35≦3000 MPa (1) EM150
摘要翻译：各向异性导电粘合剂包括含有环氧化合物和固化剂的环氧粘合剂和分散在环氧粘合剂中的导电颗粒。在各向异性导电粘合剂的固化物的35℃，55℃，95℃，150℃下的弹性模量分别由EM35，EM55，EM95，EM150表示，变化率在55℃和95℃之间的弹性模量和95℃和150℃之间的弹性模量分别由＆Dgr; EM55-95和＆Dgr; EM95-150表示，下列表达式（1）至（ 5）满足700 Mpa＆nlE; EM35＆nlE; 3000 MPa（1）EM150

8. 发明申请

US20190157537A1 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：US20190157537A1
公开(公告)日：2019-05-23
申请号：US16306508
申请日：2017-05-02
申请人： DEXERIALS CORPORATION
发明人： Hidetsugu NAMIKI , Keiji HONJYO , Yasuyuki HIGUCHI
IPC分类号： H01L33/62 , H01L33/54 , H01L25/075
摘要： A light-emitting device and a method for manufacturing the same capable of suppressing connection defects of light-emitting elements and improving electrical connectivity. A substrate includes a first mounting region for mounting a first light-emitting element, a second mounting region for mounting a second light-emitting element, a first electrode connected to one electrode of the first light-emitting element and one electrode of the second light-emitting element, a second electrode formed in the first mounting region and connected to the other electrode of the first light-emitting element, and a third electrode formed in the second mounting region and connected to the other electrode of the second light-emitting element. In the first electrode, a groove is formed between the first mounting region and the second mounting region.

9. 发明申请

US20170114255A1 ADHESIVE AGENT AND CONNECTION STRUCTURE 审中-公开
公开(公告)号：US20170114255A1
公开(公告)日：2017-04-27
申请号：US15301836
申请日：2015-05-22
申请人： DEXERIALS CORPORATION
发明人： Masaharu AOKI , Shiyuki KANISAWA , Hidetsugu NAMIKI , Akira ISHIGAMI
IPC分类号： C09J163/00 , H05K3/38 , H05K1/18 , H05K1/02 , C09J11/04 , H05K1/11
CPC分类号： C09J163/00 , C09J11/04 , C09J11/06 , C09J133/00 , C09J133/04 , H01R11/01 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/32 , H05K3/34 , H05K3/386 , H05K2201/10106
摘要： An adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin and a sea of epoxy compound and roughen the surface of an oxide film to improve an anchor effect with the sea of epoxy compound; solder particles contained in the adhesive agent are melted to form metal bonding with an electrode, thereby enabling improvement in adhesive strength between the adhesive agent and the electrode and further improving heat dissipation from a surface of the metal bonding.

10. 发明申请

US20140248477A1 BUFFER FILM FOR MULTI-CHIP PACKAGING 审中-公开
标题翻译：多芯片包装的缓冲膜
公开(公告)号：US20140248477A1
公开(公告)日：2014-09-04
申请号：US14275460
申请日：2014-05-12
申请人： DEXERIALS CORPORATION
发明人： Akira ISHIGAMI , Shiyuki KANISAWA , Hidetsugu NAMIKI , Hideaki UMAKOSHI , Masaharu AOKI
IPC分类号： H01L23/00 , C08L83/04 , C08L79/08 , C08L67/00 , C08L27/06
摘要： A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.
摘要翻译：用于多芯片封装的缓冲膜在多芯片封装期间不会导致对准并且确保良好的连接可靠性具有这样的结构，其中线膨胀系数为80ppm /℃或更低的耐热树脂层并且层压由具有根据JIS K6253的肖氏A硬度为10至80的树脂材料制成的柔性树脂层。可以通过粘合剂对基板上的多个芯片装置进行临时粘合，在芯片装置之间设置用于多芯片封装的缓冲膜和接合头，从而制造多芯片模块，使得耐热树脂层位于芯片器件侧，并且通过利用接合头向衬底施加热和压力来将多个芯片器件与衬底连接。

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