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1. 发明授权

US08368613B2 Wireless communication system 有权
标题翻译：无线通信系统
公开(公告)号：US08368613B2
公开(公告)日：2013-02-05
申请号：US12776790
申请日：2010-05-10
申请人： Craig Warren Hornung
发明人： Craig Warren Hornung
IPC分类号： H01Q1/50
CPC分类号： H01Q1/38 , H01Q1/1207 , H01Q9/42 , H01R9/0515 , H01R12/69 , H01R2103/00 , H01R2201/02
摘要： An antenna includes a flexible film substrate having a signal element and a ground element. A signal contact is mounted to the flexible film substrate. The signal contact is electrically connected to the signal element by a compression connection and the signal contact includes a wire termination configured to be terminated to a center conductor of a coaxial cable. A ground contact is mounted to the flexible film substrate. The ground contact is electrically connected to the ground element by a compression connection and includes a wire termination configured to be terminated to a cable braid of the coaxial cable.
摘要翻译：天线包括具有信号元件和接地元件的柔性膜基片。信号触点安装到柔性膜基底上。信号触点通过压缩连接电连接到信号元件，并且信号触点包括被配置为端接到同轴电缆的中心导体的电线端子。接地触头安装到柔性薄膜基片上。接地触头通过压缩连接电连接到接地元件，并且包括被配置为端接到同轴电缆的电缆编织物的导线端子。

2. 发明授权

US06898083B1 Heat sink integrated retention system 失效
标题翻译：散热片集成保留系统
公开(公告)号：US06898083B1
公开(公告)日：2005-05-24
申请号：US10705592
申请日：2003-11-10
申请人： Craig Warren Hornung
发明人： Craig Warren Hornung
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat base to the circuit board component. The frame includes an actuator that has a first post and a second post. Each post has an upper end, a lower end, and a shaft portion therebetween. The lower end includes a retention lug. A cross beam interconnects the shaft portions of the posts. The frame further includes a board lock and the cam includes a lever coupled to the cam. The cam engages the actuator to move the actuator relative to the frame from a first position to a second position to lock the heat sink base to the circuit board component. The heat sink remains in the locked position when the lever is rotated from the second position to the first position.
摘要翻译：提供了一种用于电路板部件的散热器组件。其包括散热器基座，联接到基座的框架和相对于基座定位的凸轮，以将热基座锁定到电路板部件。框架包括具有第一柱和第二柱的致动器。每个柱具有上端，下端和它们之间的轴部。下端包括保持凸耳。横梁将柱的轴部分互连。框架还包括板锁，并且凸轮包括联接到凸轮的杆。凸轮接合致动器，以使致动器相对于框架从第一位置移动到第二位置，以将散热器基座锁定到电路板部件。当杆从第二位置旋转到第一位置时，散热器保持在锁定位置。

3. 发明授权

US08911242B2 Electrical component having an array of electrical contacts 有权
标题翻译：具有电接触阵列的电气部件
公开(公告)号：US08911242B2
公开(公告)日：2014-12-16
申请号：US13411813
申请日：2012-03-05
申请人： Myoungsoo Jeon , Attalee Snarr Taylor , Craig Warren Hornung
发明人： Myoungsoo Jeon , Attalee Snarr Taylor , Craig Warren Hornung
IPC分类号： H01R12/00
CPC分类号： H01R13/2442 , H01R12/57 , H01R43/0221
摘要： An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.
摘要翻译：一种电气部件，包括具有相对的第一和第二侧面的基板和从第一侧延伸到基板中的多个通孔。衬底具有在第一侧上的电连接到相应通孔的第一导电焊盘。电气部件还包括沿着第一侧安装到基板的多个电触头。每个电触头包括接触脚跟和从相应的接触脚跟延伸并且至少部分地远离第一侧的接触梁。接触脚跟被激光焊接到相应的第一导电垫上。

4. 发明申请

US20130231009A1 ELECTRICAL COMPONENT HAVING AN ARRAY OF ELECTRICAL CONTACTS 有权
标题翻译：具有电气接触阵列的电气元件
公开(公告)号：US20130231009A1
公开(公告)日：2013-09-05
申请号：US13411813
申请日：2012-03-05
申请人： Myoungsoo Jeon , Attalee Snarr Taylor , Craig Warren Hornung
发明人： Myoungsoo Jeon , Attalee Snarr Taylor , Craig Warren Hornung
IPC分类号： H01R24/00
CPC分类号： H01R13/2442 , H01R12/57 , H01R43/0221
摘要： An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads.
摘要翻译：一种电气部件，包括具有相对的第一和第二侧面的基板和从第一侧延伸到基板中的多个通孔。衬底具有在第一侧上的电连接到相应通孔的第一导电焊盘。电气部件还包括沿着第一侧安装到基板的多个电触头。每个电触头包括接触脚跟和从相应的接触脚跟延伸并且至少部分地远离第一侧的接触梁。接触脚跟被激光焊接到相应的第一导电垫上。

5. 发明授权

US08382487B2 Land grid array interconnect 有权
标题翻译：土地格栅阵列互连
公开(公告)号：US08382487B2
公开(公告)日：2013-02-26
申请号：US12973071
申请日：2010-12-20
申请人： Myoungsoo Jeon , Attalee Snarr Taylor , Craig Warren Hornung
发明人： Myoungsoo Jeon , Attalee Snarr Taylor , Craig Warren Hornung
IPC分类号： H01R12/00
CPC分类号： H01R12/52 , H01R12/57
摘要： A land grid array interconnect has a substrate that has a first surface and a second surface. The substrate has a plurality of vias extending therethrough. The substrate has first pads on the first surface electrically connected to corresponding vias and has second pads on the second surface electrically connected to corresponding vias and corresponding first pads. A contact array is coupled to the first surface of the substrate. The contact array has a metal plate that defines a carrier and a plurality of contacts formed from the metal plate and held by the carrier. The contacts have contact heels and beams extending from corresponding contact heels. The contact heels are soldered to corresponding first pads. The contacts are singulated from the carrier after the contact heels are soldered to the first pads. The carrier is removed from the substrate after the contacts are singulated leaving the individual contacts soldered to corresponding first pads.
摘要翻译：地面阵列互连具有具有第一表面和第二表面的基底。衬底具有穿过其中延伸的多个通孔。衬底在第一表面上具有电连接到对应的通孔的第一焊盘，并且在第二表面上具有电连接到对应的通孔和对应的第一焊盘的第二焊盘。接触阵列耦合到衬底的第一表面。接触阵列具有限定载体的金属板和由金属板形成并由载体保持的多个触点。触点具有从相应的接触脚跟延伸的接触脚跟和梁。接触脚跟被焊接到相应的第一垫。在将接触脚跟焊接到第一衬垫之后，将触头从载体上分离出来。在将触点分开之后，将载体从基板上移除，使各个触点焊接到相应的第一焊盘。

6. 发明授权

US07362578B2 Heat sink fastening system 失效
标题翻译：散热片紧固系统
公开(公告)号：US07362578B2
公开(公告)日：2008-04-22
申请号：US11247018
申请日：2005-10-11
申请人： Craig Warren Hornung
发明人： Craig Warren Hornung
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for removing heat from an electronic component includes a retention clip having a central body and a securing member extending from the central member. The central member has an opening there through, and the securing member is configured to secure the retention clip relative to the electronic component. A heat sink has a base member received through the opening when the heat sink is mounted to the retention clip, and the base member has an engagement surface configured to engage a heat generating surface of the electronic component. A locking mechanism secures the heat sink to the retention clip. The locking mechanism includes a ramp member and a ramp engaging member, wherein the ramp member has a positive stop provided therein. The positive stop provides a tactual indication when the heat sink is fully secured to the retention clip.
摘要翻译：用于从电子部件移除热量的散热器组件包括具有中心体的保持夹和从中心构件延伸的固定构件。中心构件在其上具有开口，并且固定构件构造成相对于电子部件固定保持夹。当散热器安装到保持夹上时，散热器具有通过开口接收的基座构件，并且基座构件具有被配置为接合电子部件的发热表面的接合表面。锁定机构将散热器固定到固定夹。锁定机构包括斜坡构件和斜坡接合构件，其中斜坡构件具有设置在其中的正止动件。当散热器完全固定到固定夹上时，正极止动器提供触觉指示。

7. 发明授权

US07269015B2 Heat sink interface insert 失效
标题翻译：散热片接口插件
公开(公告)号：US07269015B2
公开(公告)日：2007-09-11
申请号：US11049545
申请日：2005-02-01
申请人： Craig Warren Hornung , John Thomas Larkin, Jr. , Ralph Edward Spayd, Jr.
发明人： Craig Warren Hornung , John Thomas Larkin, Jr. , Ralph Edward Spayd, Jr.
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.
摘要翻译：提供了用于冷却发热集成电路（IC）部件的散热器组件。组件包括邻近IC部件定位的散热器基座和位于散热器基座和IC部件之间的热接口部件。接口构件具有与散热器基座邻接接合的第一表面和与IC部件上的盖的外表面邻接接合的相对的第二表面。第一和第二表面各自包括多个突起，以增加界面构件和散热器底座之间以及界面构件与盖的外表面之间的接触点数量，以便于将热量从IC部件转移到散热器底座。

8. 发明授权

US07251138B2 Thermal managed interconnect system for a circuit board 失效
标题翻译：用于电路板的热管理互连系统
公开(公告)号：US07251138B2
公开(公告)日：2007-07-31
申请号：US10925091
申请日：2004-08-24
申请人： Craig Warren Hornung , Ralph Edward Spayd, Jr. , Stephen Del Prete , Chong Sheng Wang
发明人： Craig Warren Hornung , Ralph Edward Spayd, Jr. , Stephen Del Prete , Chong Sheng Wang
IPC分类号： H05K7/20
CPC分类号： H01L23/4275 , H01L23/36 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.
摘要翻译：提供了一种用于安装在电路板上的IC器件的热管理系统。该系统包括插座壳体和设置在壳体内的电力触头阵列。电源触点向IC器件的下侧供电，并在IC器件的下侧产生热量。导热界面将IC从IC器件的下侧传递到位于IC器件上方的散热片。

9. 发明授权

US06977814B2 Dual material heat sink core assembly 失效
标题翻译：双材料散热芯组件
公开(公告)号：US06977814B2
公开(公告)日：2005-12-20
申请号：US10430537
申请日：2003-05-06
申请人： Craig Warren Hornung
发明人： Craig Warren Hornung
IPC分类号： H01L23/367 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L23/367 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink core assembly includes a base plate fabricated from a first material. The base plate comprises an opening therein, and the opening defines an insert engagement surface. An insert is fabricated from a second material different from the first material. The insert includes a base plate engagement surface and the insert is inserted into the opening. At least one of the insert engagement surface and the base plate engagement surface includes a curved portion. The curved portions oppose one another when the insert is engaged to the opening to produce a predetermined contact force in directions parallel and perpendicular to the opening in the base plate. When the opposed surfaces are crimped together, gaps or voids between the surfaces are avoided.
摘要翻译：散热芯组件包括由第一材料制成的基板。基板在其中包括开口，并且开口限定了插入物接合表面。插入物由不同于第一材料的第二材料制成。插入件包括基板接合表面，并且插入件插入开口中。插入接合表面和基板接合表面中的至少一个包括弯曲部分。当插入件接合到开口以在平行且垂直于基板中的开口的方向上产生预定的接触力时，弯曲部分彼此相对。当相对的表面被压接在一起时，表面之间的间隙或空隙被避免。

10. 发明授权

US08123532B2 Carrier system for an electrical connector assembly 有权
标题翻译：用于电连接器组件的载体系统
公开(公告)号：US08123532B2
公开(公告)日：2012-02-28
申请号：US12758083
申请日：2010-04-12
申请人： Andrew Charles Davison , Craig Warren Hornung , John Joseph Consoli
发明人： Andrew Charles Davison , Craig Warren Hornung , John Joseph Consoli
IPC分类号： H01R12/00
CPC分类号： H01R13/518 , H01R12/724
摘要： An electrical connector assembly includes a first connector module including pins configured to be terminated to a circuit board and a second connector module including pins configured to be terminated to the circuit board. The electrical connector assembly also includes a carrier system including an organizer having openings therethrough in a predetermined pattern. The organizer is coupled to the first and second connector modules such that at least some of the pins of the first connector module extend through the openings of the organizer and such that at least some of the pins of the second connector module extend through the openings of the organizer. The first connector module, the second connector module and the organizer are configured to be mounted to the circuit board as a bundled unit.
摘要翻译：电连接器组件包括第一连接器模块，该第一连接器模块包括被配置为端接到电路板的引脚，以及包括被配置为端接到电路板的引脚的第二连接器模块。电连接器组件还包括载体系统，其包括具有以预定图案穿过的开口的组织器。组织器耦合到第一和第二连接器模块，使得第一连接器模块的至少一些销延伸穿过组织器的开口，并且使得第二连接器模块的至少一些销延伸穿过组织者。第一连接器模块，第二连接器模块和组织器被配置为作为捆绑单元安装到电路板。

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