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1. 发明授权

US06184608B2 Polymer microactuator array with macroscopic force and displacement 有权
公开(公告)号：US06184608B2
公开(公告)日：2001-02-06
申请号：US09223368
申请日：1998-12-29
申请人： Cleopatra Cabuz , Robert D. Horning , William R. Herb
发明人： Cleopatra Cabuz , Robert D. Horning , William R. Herb
IPC分类号： H02N100
CPC分类号： H02N1/006 , Y10T29/42
摘要： A microactuator array device, which includes a plurality of generally parallel thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrodes associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid during generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other. At least one of every pair of the sheets may be preformed into corrugations or into flaps to provide a predetermined mechanical bias between the pairs, or the sheets may form curved portions by an applied load to provide a displacement between the pairs. The sheets are preferably from about 1 &mgr;m to about 100 &mgr;m thick and the cells preferably have an individual displacement of from about 5 &mgr;m to about 200 &mgr;m.

2. 发明授权

US06255758B1 Polymer microactuator array with macroscopic force and displacement 失效
标题翻译：聚合物微致动器阵列具有宏观力和位移
公开(公告)号：US06255758B1
公开(公告)日：2001-07-03
申请号：US09609726
申请日：2000-07-03
申请人： Cleopatra Cabuz , Robert D. Horning , William R. Herb
发明人： Cleopatra Cabuz , Robert D. Horning , William R. Herb
IPC分类号： H02N100
CPC分类号： H02N1/006 , Y10T29/42
摘要： A microactuator array device, which includes a plurality of generally parallel thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrodes associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid during generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other. At least one of every pair of the sheets may be preformed into corrugations or into flaps to provide a predetermined mechanical bias between the pairs, or the sheets may form curved portions by an applied load to provide a displacement between the pairs. The sheets are preferably from about 1 &mgr;m to about 100 &mgr;m thick and the cells preferably have an individual displacement of from about 5 &mgr;m to about 200 &mgr;m.
摘要翻译：一种微致动器阵列装置，其包括以预定图案结合在一起以在至少一个层上形成单元电池阵列的多个大致平行的薄柔性聚合物片。薄片导电和介电薄膜沉积在薄片上以形成与单元阵列阵列相关联的多个电极。电位源可操作地连接电极，由此静电力最强烈地产生在板之间的间隙最小的点附近。每个细胞的入口和出口允许在产生静电力期间排出流体。在优选实施例中，多个片材形成一组单元阵列阵列。这些层被配置成使得双向激活由彼此相对工作的成对的致动器引起。每对片材中的至少一个可以被预成形为波纹或折片以在对之间提供预定的机械偏置，或者片材可以通过施加的载荷形成弯曲部分，以在对之间提供位移。片材优选为约1μm至约100μm厚，并且细胞优选具有约5μm至约200μm的单个位移。

3. 发明授权

US06946200B2 Methods for reducing the curvature in boron-doped silicon micromachined structures 失效
标题翻译：减少硼掺杂硅微加工结构中曲率的方法
公开(公告)号：US06946200B2
公开(公告)日：2005-09-20
申请号：US10334588
申请日：2002-12-30
申请人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
发明人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
IPC分类号： B81B3/00 , B81C1/00 , H01L21/308 , H01L29/84 , B32B9/00
CPC分类号： B81C1/00365 , B81C2201/0164 , Y10T428/21 , Y10T428/2495
摘要： Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.
摘要翻译：公开了具有减小的平面外曲率的硼掺杂硅层。这些层在顶部和底部表面附近具有基本相等的硼浓度。由于相反的浓度基本相等，所以层上的压缩应力基本平衡，从而导致具有减小的面外曲率的层。

4. 发明授权

US06544655B1 Methods for reducing the curvature in boron-doped silicon micromachined structures 失效
公开(公告)号：US06544655B1
公开(公告)日：2003-04-08
申请号：US09634932
申请日：2000-08-08
申请人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
发明人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
IPC分类号： B32B904
CPC分类号： B81C1/00365 , B81C2201/0164 , Y10T428/21 , Y10T428/2495
摘要： Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

5. 发明授权

US06969425B2 Methods for reducing the curvature in boron-doped silicon micromachined structures 失效
公开(公告)号：US06969425B2
公开(公告)日：2005-11-29
申请号：US10346887
申请日：2003-01-17
申请人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
发明人： Cleopatra Cabuz , Max C. Glenn , Francis M. Erdmann , Robert D. Horning
IPC分类号： B81B3/00 , B81C1/00 , H01L21/308 , H01L29/84 , C30B1/10
CPC分类号： B81C1/00365 , B81C2201/0164 , Y10T428/21 , Y10T428/2495
摘要： Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

6. 发明授权

US09171964B2 Systems and methods for a three-layer chip-scale MEMS device 有权
标题翻译：用于三层芯片级MEMS器件的系统和方法
公开(公告)号：US09171964B2
公开(公告)日：2015-10-27
申请号：US13296642
申请日：2011-11-15
申请人： Robert D. Horning , Ryan Supino
发明人： Robert D. Horning , Ryan Supino
IPC分类号： H01L29/84 , B81B7/00
CPC分类号： H01L29/84 , B81B7/0032 , B81B7/0038 , B81B7/0074 , B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81C2201/019 , H01L2224/48091 , H01L2924/00014
摘要： Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.
摘要翻译：提供了一种用于微机电系统（MEMS）装置的系统和方法。在一个实施例中，系统包括第一外层和包括第一组MEMS器件的第一器件层，其中第一器件层接合到第一外层。该系统还包括第二外层和包括第二组MEMS器件的第二器件层，其中第二器件层结合到第二外层。此外，该系统包括具有第一侧和与第一侧相反的第二侧的中心层，其中第一侧接合到第一器件层，第二侧接合到第二器件层。

7. 发明授权

US08078401B2 Method of personal navigation using stride vectoring 有权
标题翻译：使用步幅矢量的个人导航方法
公开(公告)号：US08078401B2
公开(公告)日：2011-12-13
申请号：US12019368
申请日：2008-01-24
申请人： Ryan Supino , Robert D. Horning
发明人： Ryan Supino , Robert D. Horning
IPC分类号： G01C25/00 , G01C17/38 , G01C21/00
CPC分类号： G01C21/16 , G01S1/72 , G01S5/186 , G01S5/26
摘要： A method of error compensation for an inertial measurement unit is provided. The method comprises providing a first object including an inertial measurement unit, providing a second object proximal to the first object, and determining an initial position and orientation of the first object. A motion update is triggered for the inertial measurement unit when the second object is stationary with respect to a ground surface. At least one position vector is measured between the first object and the second object when the first object is in motion and the second object is stationary. A distance, direction, and orientation of the second object with respect to the first object are calculated using the at least one position vector. An error correction is then determined for the inertial measurement unit from the calculated distance, direction, and orientation of the second object with respect to the first object.
摘要翻译：提供了惯性测量单元的误差补偿方法。该方法包括提供包括惯性测量单元的第一对象，提供靠近第一对象的第二对象，以及确定第一对象的初始位置和取向。当第二物体相对于地面静止时，对于惯性测量单元触发运动更新。当第一物体运动并且第二物体静止时，在第一物体和第二物体之间测量至少一个位置矢量。使用至少一个位置矢量来计算第二对象相对于第一对象的距离，方向和方向。然后根据计算出的第二物体相对于第一物体的距离，方向和取向来确定惯性测量单元的纠错。

8. 发明申请

US20100320595A1 HYBRID HERMETIC INTERFACE CHIP 审中-公开
标题翻译：混合界面切片
公开(公告)号：US20100320595A1
公开(公告)日：2010-12-23
申请号：US12488847
申请日：2009-06-22
申请人： Robert D. Horning , Jeff A. Ridley
发明人： Robert D. Horning , Jeff A. Ridley
IPC分类号： H01L23/02 , H01L23/48 , H01L21/50
CPC分类号： B81B7/007 , B81C2203/019 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A hermetically sealed MEMS device package comprises a MEMS device platform, a hermetic interface chip, and an outer seal ring. The MEMS device platform includes a MEMS device surrounded by a continuous outer boundary wall with a top surface. The hermetic interface chip includes a glass substrate and at least one silicon mesa. The glass substrate includes at least one hole and has a lower surface with an inner portion surrounded by an outer portion. The at least one silicon mesa is bonded to the inner portion of the lower surface of the glass substrate, such that the at least one silicon mesa is aligned with the at least one hole in the glass substrate. The outer seal ring bonds the outer portion of the lower surface of the glass substrate to the top surface of the continuous outer boundary wall of the MEMS device platform.
摘要翻译：密封的MEMS器件封装包括MEMS器件平台，密封接口芯片和外部密封环。 MEMS器件平台包括由具有顶表面的连续外边界壁包围的MEMS器件。密封接口芯片包括玻璃基板和至少一个硅台面。玻璃基板包括至少一个孔，并且具有下表面，内部被外部包围。至少一个硅台面结合到玻璃基板的下表面的内部，使得至少一个硅台面与玻璃基板中的至少一个孔对准。外密封环将玻璃基板的下表面的外部部分结合到MEMS器件平台的连续外边界壁的顶表面。

9. 发明申请

US20100084752A1 SYSTEMS AND METHODS FOR IMPLEMENTING A WAFER LEVEL HERMETIC INTERFACE CHIP 审中-公开
标题翻译：实现水平线性界面芯片的系统和方法
公开(公告)号：US20100084752A1
公开(公告)日：2010-04-08
申请号：US12247368
申请日：2008-10-08
申请人： Robert D. Horning , David S. Willits
发明人： Robert D. Horning , David S. Willits
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： B81B7/007 , B81B7/0038
摘要： Systems and methods for enabling hermetic sealing at the wafer level during fabrication of a microelectromechanical sensor (MEMS) device. The MEMS device has a specialized hermetic interface chip (HIC) that facilitates a stable hermetic sealing process. The HIC includes a plurality of vias in a substrate layer, a plurality of mesas having etched portions, a seal ring, a plurality of conductive leads on a first side of the HIC, and a plurality of conductive leads on a second side of the HIC. The plurality of conductive leads on the first side of the HIC feeds from the etched portions of the plurality of mesas through the plurality of vias in the substrate layer to the plurality of conductive leads on the second side of the HIC. The conductive leads are capable of connecting an external circuit to the MEMS device.
摘要翻译：用于在制造微机电传感器（MEMS）器件期间在晶片级进行气密密封的系统和方法。 MEMS器件具有专门的密封接口芯片（HIC），有助于稳定的气密密封过程。 HIC在衬底层中包括多个通孔，具有蚀刻部分的多个台面，密封环，HIC的第一侧上的多个导电引线以及HIC的第二侧上的多个导电引线。 HIC的第一侧上的多个导电引线从多个台面的蚀刻部分通过衬底层中的多个通孔馈送到HIC的第二侧上的多个导电引线。导电引线能够将外部电路连接到MEMS器件。

10. 发明申请

US20090073045A1 ULTRASONIC MULTILATERATION SYSTEM FOR STRIDE VECTORING 有权
标题翻译：超声波多通道系统
公开(公告)号：US20090073045A1
公开(公告)日：2009-03-19
申请号：US12019380
申请日：2008-01-24
申请人： Ryan Supino , Robert D. Horning
发明人： Ryan Supino , Robert D. Horning
IPC分类号： G01S3/02 , G01C21/00
CPC分类号： G01C21/00 , G01S1/72 , G01S5/186 , G01S5/26
摘要： A lateration system comprising at least one transmitter attached to a first object and configured to emit pulses, three or more receivers attached to at least one second object and configured to receive the pulses emitted by the transmitter, and a processor configured to process information received from the three or more receivers, and to generate a vector based on lateration. Lateration is one of multilateration and trilateration. The vector is used by the processor to constrain error growth in a navigation solution.
摘要翻译：一种后置系统，包括附接到第一对象并被配置为发射脉冲的至少一个发射器，连接到至少一个第二对象并被配置为接收由发射器发射的脉冲的三个或更多个接收器，以及被配置为处理从三个或更多个接收器，并且基于后一个生成向量。背景是多边和三边形之一。处理器使用该向量来限制导航解决方案中的错误增长。

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