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1. 发明授权

US07119636B2 Micromechanical resonator device having a desired mode shape 有权
标题翻译：具有期望的模式形状的微机械谐振器装置
公开(公告)号：US07119636B2
公开(公告)日：2006-10-10
申请号：US10990785
申请日：2004-11-17
申请人： Clark T. -C. Nguyen , Yuan Xie
发明人： Clark T. -C. Nguyen , Yuan Xie
IPC分类号： H03H9/02 , H03H9/46 , H03H9/48
CPC分类号： H03H9/2431 , H03H3/0072 , H03H9/2436 , H03H2009/02354 , H03H2009/02503
摘要： A micromechanical resonate device having an extensional wine-glass mode shape is described herein. Different embodiments of the device may employ vibrating polysilicon micromechanical ring resonators, utilizing a unique extensional wine-glass mode shape to achieve lower impedance than previous UHF resonators at frequencies as high as 1.2-GHz with a Q of 3,700, and 1.47-GHz (highest to date for polysilicon micromechanical resonators) with a Q of 2,300. The 1.2-GHz resonator exhibits a measured motional resistance of 560 kΩ with a dc-bias voltage of 20V, which is 6× lower than measured on radial contour mode disk counterparts at the same frequency, and which can be driven down as low as 2 kΩ when a dc-bias voltage of 100V and electrode-to-resonator gap spacing of 460 Å are used. The above high Q and low impedance advantages, together with the multiple frequency, on-chip integration advantages afforded by electrostatically-transduced μmechanical resonators, may be utilized in the front-end RF filtering and oscillator functions needed by wireless communication devices.
摘要翻译：本文描述了具有延伸葡萄酒玻璃模式形状的微机械谐振装置。器件的不同实施例可采用振动多晶硅微机械环谐振器，利用独特的拉伸葡萄酒玻璃模式形状来实现比先前在频率高达1.2GHz的UHF谐振器更低的阻抗，Q为3,700和1.47GHz（最高到目前为止多晶硅微机械谐振器），Q为2,300。 1.2GHz谐振器表现出560 kOmega的测量运动电阻，其直流偏置电压为20V，比相同频率下的径向轮廓模式盘对应器测得的低6倍，可以低至2 kOmega 当使用100V的直流偏置电压和460A的电极到谐振器间隙间隔时。上述高Q和低阻抗优点以及由静电转换的机械谐振器提供的多频率片上集成优点可以用于无线通信设备所需的前端RF滤波和振荡器功能。

2. 发明授权

US06593831B2 Method and apparatus for filtering signals in a subsystem including a power amplifier utilizing a bank of vibrating micromechanical apparatus 有权
公开(公告)号：US06593831B2
公开(公告)日：2003-07-15
申请号：US09839101
申请日：2001-04-20
申请人： Clark T. -C. Nguyen
发明人： Clark T. -C. Nguyen
IPC分类号： H03H946
CPC分类号： H03H9/462 , H01H59/0009 , H03H3/0078 , H03H9/02409 , H03H9/24 , H03H9/2452 , H03H9/465 , H03H9/505 , H03H2009/02511 , H03H2009/02519 , H03H2009/02527
摘要： Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. Apparatus is provided for selecting at least one desired passband or channel in an RF transmitter subsystem utilizing a bank of vibrating micromechanical devices. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.

3. 发明授权

US06917138B2 Method and subsystem for processing signals utilizing a plurality of vibrating micromechanical devices 有权
标题翻译：利用多个振动微机械装置处理信号的方法和子系统
公开(公告)号：US06917138B2
公开(公告)日：2005-07-12
申请号：US10625993
申请日：2003-07-24
申请人： Clark T. -C. Nguyen
发明人： Clark T. -C. Nguyen
IPC分类号： H01H59/00 , H03H3/007 , H03H9/02 , H03H9/24 , H03H9/46 , H03H9/50 , H03H9/205 , H03H9/70
CPC分类号： H03H3/0078 , H01H59/0009 , H01H2059/0072 , H03H9/02409 , H03H9/24 , H03H9/2452 , H03H9/462 , H03H9/465 , H03H9/505 , H03H2009/02511 , H03H2009/02519 , H03H2009/02527
摘要： Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. A method and subsystem are provided for processing RF signals utilizing a plurality of vibrating micromechanical devices typically in the form of an IF mixer-filter and an RF channel selector or an image-reject RF filter. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Also, such methods and circuits can eliminate the need for a low noise amplifier in a receiver or transceiver subsystem. Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.
摘要翻译：提供了几种利用电路中的振动微机械谐振器来实现滤波，混频，频率参考和放大功能的基于MEMS的方法和架构。提供了一种方法和子系统，用于利用通常以IF混频器滤波器和RF信道选择器或图像拒绝RF滤波器的形式的多个振动微机械装置来处理RF信号。使用这种架构的主要优点之一是通过为高选择性（即高Q）的交易功率节省了功耗。此外，这样的方法和电路可以消除对接收器或收发器子系统中的低噪声放大器的需要。因此，本发明依赖于在SSI网络中使用大量的微机械连接来实现基本上零直流功率消耗的信号处理功能。

4. 发明授权

US06569754B2 Method for making a module including a microplatform 有权
标题翻译：制造包含微平台的模块的方法
公开(公告)号：US06569754B2
公开(公告)日：2003-05-27
申请号：US09938359
申请日：2001-08-23
申请人： Ark-Chew Wong , Clark T. -C. Nguyen
发明人： Ark-Chew Wong , Clark T. -C. Nguyen
IPC分类号： H01L2144
CPC分类号： B81B7/007 , B81B2203/0361 , B81C1/00253 , B81C2203/019 , B81C2203/035 , B81C2203/038 , B81C2203/051 , H01L24/81 , H01L25/0657 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01057 , H01L2924/01059 , H01L2924/01072 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3011
摘要： A module bonded together at a microplatform and an improved method for making the module are provided. The method includes providing a micromechanical device including a first substrate, the microplatform, a first plurality of bonding sites on the microplatform, a micromechanical structure fabricated and supported on the microplatform and a support structure to suspend the microplatform above the first substrate. The method further includes providing a transistor circuit wafer including a second plurality of bonding sites thereon and integrated BiCMOS transistor circuits. The first and second plurality of bonding sites are aligned and compression bonded so that the microplatform is both electrically and mechanically coupled to the second substrate to form the module. The platform carrier wafer can be torn off, leaving bonded platforms behind on the substrate wafer. This allows small form factor merging of the two different technologies.
摘要翻译：提供了以微平台结合在一起的模块和用于制造模块的改进方法。该方法包括提供微机械装置，其包括第一基板，微平台，微平台上的第一多个结合位置，在微平台上制造和支撑的微机械结构以及将微平台悬置在第一基板上方的支撑结构。该方法还包括提供晶体管电路晶片，其上包括第二多个结合位置和集成的BiCMOS晶体管电路。第一和第二多个结合部位被对准并压接，使得微平台与第二基板电连接和机械耦合以形成模块。平台载体晶片可以被撕下，使粘结平台留在基片上。这允许两种不同技术的小尺寸合并。

5. 发明授权

US06249073B1 Device including a micromechanical resonator having an operating frequency and method of extending same 有权
标题翻译：装置包括具有工作频率的微机械谐振器及其延伸方法
公开(公告)号：US06249073B1
公开(公告)日：2001-06-19
申请号：US09482670
申请日：2000-01-13
申请人： Clark T. -C. Nguyen , Michael McCorquodale , Kun Wang
发明人： Clark T. -C. Nguyen , Michael McCorquodale , Kun Wang
IPC分类号： H02N100
CPC分类号： H03H9/24 , H01H59/0009 , H01H2059/0072 , H03H3/0078 , H03H9/2452 , H03H9/462 , H03H9/465
摘要： A flexural-mode, micromechanical resonator utilizing a non-intrusive support structure to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz is manufactured using polysilicon surface micromachining technology. Also, a method for extending the operating frequency of the resonator as well as other types of micromechanical resonators is disclosed. One embodiment of the method is called a differential-signaling technique. The other embodiment of the method is called a dimple-down technique. The support structure includes one or more torsional-mode support springs in the form of beams that effectively isolate a resonator beam from its anchors via quarter-wavelength impedance transformations, minimizing anchor dissipation and allowing the resonator to achieve high Q with high stiffness in the VHF frequency range. The resonator also includes one or more spacers in the form of dimples formed on the flexural resonator beam or the substrate. In operation, the dimples determine a capacitive-transducer gap of the resonator. When a large DC-bias voltage is applied between a drive electrode and the resonator beam, the dimples provide a predetermined minimum distance between the flexural resonator beam and the drive electrode.
摘要翻译：使用多晶硅表面微机械加工技术制造了使用非侵入式支撑结构的挠曲模式微机械谐振器，以在30-90MHz的VHF频率下实现高达8,400的测量Q。此外，公开了一种用于扩展谐振器的工作频率以及其它类型的微机械谐振器的方法。该方法的一个实施例称为差分信号技术。该方法的另一个实施例称为凹陷技术。支撑结构包括一个或多个波束形式的扭转模式支撑弹簧，其通过四分之一波长阻抗变换有效地将谐振器束与其锚定器隔离，从而最小化锚固耗散，并允许谐振器在VHF中实现高刚度的高Q 频率范围。谐振器还包括形成在弯曲谐振器梁或衬底上的凹坑形式的一个或多个间隔物。在操作中，凹坑确定谐振器的电容 - 换能器间隙。当在驱动电极和谐振器光束之间施加大的直流偏置电压时，凹坑在弯曲谐振器光束和驱动电极之间提供预定的最小距离。

6. 发明授权

US06600252B2 Method and subsystem for processing signals utilizing a plurality of vibrating micromechanical devices 有权
标题翻译：利用多个振动微机械装置处理信号的方法和子系统
公开(公告)号：US06600252B2
公开(公告)日：2003-07-29
申请号：US09839036
申请日：2001-04-20
申请人： Clark T. -C. Nguyen
发明人： Clark T. -C. Nguyen
IPC分类号： H03H970
CPC分类号： H03H3/0078 , H01H59/0009 , H01H2059/0072 , H03H9/02409 , H03H9/24 , H03H9/2452 , H03H9/462 , H03H9/465 , H03H9/505 , H03H2009/02511 , H03H2009/02519 , H03H2009/02527
摘要： Several MEMS-based methods and architectures which utilize vibrating micromechanical resonators in circuits to implement filtering, mixing, frequency reference and amplifying functions are provided. A method and subsystem are provided for processing RF signals utilizing a plurality of vibrating micromechanical devices typically in the form of an IF mixer-filter and an RF channel selector or an image-reject RF filter. One of the primary benefits of the use of such architectures is a savings in power consumption by trading power for high selectivity (i.e., high Q). Also, such methods and circuits can eliminate the need for a low noise amplifier in a receiver or transceiver subsystem. Consequently, the present invention relies on the use of a large number of micromechanical links in SSI networks to implement signal processing functions with basically zero DC power consumption.
摘要翻译：提供了几种利用电路中的振动微机械谐振器来实现滤波，混频，频率参考和放大功能的基于MEMS的方法和架构。提供了一种方法和子系统，用于利用通常以IF混频器滤波器和RF信道选择器或图像拒绝RF滤波器的形式的多个振动微机械装置来处理RF信号。使用这种架构的主要优点之一是通过为高选择性（即高Q）的交易功率节省了功耗。此外，这样的方法和电路可以消除对接收器或收发器子系统中的低噪声放大器的需要。因此，本发明依赖于在SSI网络中使用大量的微机械连接来实现基本上零直流功率消耗的信号处理功能。

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