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1. 发明申请

US20090065905A1 Conductive metal structure applied to a module IC and method of manufacturing the same 审中-公开
标题翻译：应用于模块IC的导电金属结构及其制造方法
公开(公告)号：US20090065905A1
公开(公告)日：2009-03-12
申请号：US12076966
申请日：2008-03-26
申请人： Chung-Er Huang , Shih-Meng Luo , Sheng-Wen Chen
发明人： Chung-Er Huang , Shih-Meng Luo , Sheng-Wen Chen
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H01L24/94 , H01L23/481 , H01L24/11 , H01L24/12 , H01L2224/0231 , H01L2224/0401 , H01L2224/13099 , H01L2224/274 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/14
摘要： A conductive metal structure applied to a module IC includes a wafer, a first insulating unit, and a first conductive unit. The wafer has a main body and a through hole passing through the main body. The first insulating unit has a first inner insulating layer formed on an inner surface of the through hole and a first outer insulating layer that is extended from the first inner insulating layer and is formed on a first bottom surface of the main body. The first conductive unit has a first inner conductive layer formed on the first inner insulating layer and at least one first conductive pad formed on the first outer insulating layer. The present invention integrates semiconductor technologies of etching and deposition and combines them with the development of the module IC in order to provide a conductive metal structure that has lower cost and is manufactured easily.
摘要翻译：施加到模块IC的导电金属结构包括晶片，第一绝缘单元和第一导电单元。晶片具有穿过主体的主体和通孔。第一绝缘单元具有形成在通孔的内表面上的第一内绝缘层和从第一内绝缘层延伸并形成在主体的第一底表面上的第一外绝缘层。第一导电单元具有形成在第一内部绝缘层上的第一内部导电层和形成在第一外部绝缘层上的至少一个第一导电焊盘。本发明集成了蚀刻和沉积的半导体技术，并且将它们与模块IC的开发相结合，以提供具有较低成本且容易制造的导电金属结构。

2. 发明申请

US20090137217A1 Communication transmission system and power detection method thereof 审中-公开
标题翻译：通信传输系统及其功率检测方法
公开(公告)号：US20090137217A1
公开(公告)日：2009-05-28
申请号：US11987026
申请日：2007-11-27
申请人： Chung-Er Huang , Sheng-Wen Chen
发明人： Chung-Er Huang , Sheng-Wen Chen
IPC分类号： H04B1/04
CPC分类号： H03F3/24 , H03F2200/465 , H04B2001/0416
摘要： A communication transmission system is applied to an application device and includes a power detection circuit, and a radio frequency module. The power detection circuit is used for detecting the power on the output port of the communication transmission system, and for producing a feedback signal. The radio frequency module is connected to the power detection circuit for receiving the feedback signal so as to adjust its output power. In addition, the power detection circuit is built to be independent of the RF module for directly detecting the power on the output port of the communication transmission system which represents the actual power of the application device, thereby achieving the purpose of outputting a more stable and accurate output power through the RF module.
摘要翻译：通信传输系统应用于应用设备，并且包括功率检测电路和射频模块。功率检测电路用于检测通信传输系统的输出端口的电力，并用于产生反馈信号。射频模块连接到功率检测电路，用于接收反馈信号，以调整其输出功率。此外，功率检测电路被构建为独立于RF模块，用于直接检测表示应用设备的实际功率的通信传输系统的输出端口上的电源，从而实现输出更稳定和通过RF模块精确输出功率。

3. 发明授权

US07953375B2 Communication module with dual systems and method for defining operating mode thereof 有权
标题翻译：具有双重系统的通信模块和用于定义其操作模式的方法
公开(公告)号：US07953375B2
公开(公告)日：2011-05-31
申请号：US12149411
申请日：2008-05-01
申请人： Chung-Er Huang , Sheng-Wen Chen
发明人： Chung-Er Huang , Sheng-Wen Chen
IPC分类号： H04B1/44
CPC分类号： H01Q1/243 , H01Q21/30
摘要： A communication module with dual systems for processing a first RF signal and a second RF signal that belong to different communication systems is provided. The communication module includes a first connection port and a signal distribution circuit. The first connection port is coupled to an external circuit, and the signal distribution circuit is coupled to the first connection port and between a first system path and a second system path inside the communication module. Regardless whether the external circuit is composed by an dual-band antenna or two uni-band antenna, the signal distribution circuit controls the first RF signal transmitting along the path between the first connection port and the first system path and controls the second RF signal transmitting along the path between the path between the first connection port and the second system path.
摘要翻译：提供了一种具有用于处理第一RF信号的双重系统和属于不同通信系统的第二RF信号的通信模块。通信模块包括第一连接端口和信号分配电路。第一连接端口耦合到外部电路，并且信号分配电路耦合到第一连接端口，并且在通信模块内部的第一系统路径和第二系统路径之间。无论外部电路是由双频天线还是由两个单频天线组成，信号分配电路控制沿着第一连接端口和第一系统路径之间的路径传输的第一RF信号，并控制第二RF信号发送沿着第一连接端口和第二系统路径之间的路径之间的路径。

4. 发明申请

US20090275296A1 Communication module with dual systems and method for defining operating mode thereof 有权
标题翻译：具有双重系统的通信模块和用于定义其操作模式的方法
公开(公告)号：US20090275296A1
公开(公告)日：2009-11-05
申请号：US12149411
申请日：2008-05-01
申请人： Chung-Er Huang , Sheng-Wen Chen
发明人： Chung-Er Huang , Sheng-Wen Chen
IPC分类号： H04B7/02
CPC分类号： H01Q1/243 , H01Q21/30
摘要： A communication module with dual systems for processing a first RF signal and a second RF signal that belong to different communication systems is provided. The communication module includes a first connection port and a signal distribution circuit. The first connection port is coupled to an external circuit, and the signal distribution circuit is coupled to the first connection port and between a first system path and a second system path inside the communication module. Regardless whether the external circuit is composed by an dual-band antenna or two uni-band antenna, the signal distribution circuit controls the first RF signal transmitting along the path between the first connection port and the first system path and controls the second RF signal transmitting along the path between the path between the first connection port and the second system path.
摘要翻译：提供了一种具有用于处理第一RF信号的双重系统和属于不同通信系统的第二RF信号的通信模块。通信模块包括第一连接端口和信号分配电路。第一连接端口耦合到外部电路，并且信号分配电路耦合到第一连接端口，并且在通信模块内部的第一系统路径和第二系统路径之间。无论外部电路是由双频天线还是由两个单频天线组成，信号分配电路控制沿着第一连接端口和第一系统路径之间的路径传输的第一RF信号，并控制第二RF信号发送沿着第一连接端口和第二系统路径之间的路径之间的路径。

5. 发明申请

US20100220450A1 PACKAGING STRUCTURE OF SIP AND A MANUFACTURING METHOD THEREOF 有权
标题翻译： SIP的包装结构及其制造方法
公开(公告)号：US20100220450A1
公开(公告)日：2010-09-02
申请号：US12778456
申请日：2010-05-12
申请人： Chung-Er Huang , Ming-Tai Kuo
发明人： Chung-Er Huang , Ming-Tai Kuo
IPC分类号： H05K1/00
CPC分类号： H01L23/3107 , H01L21/565 , H01L23/552 , H01L23/66 , H01L24/97 , H01L25/165 , H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.
摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。第一步是提供其上具有电子器件的衬底。第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。第三步是将集体电子模块分成多个单独的电子模块。第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。因此，为了形成SIP模块的屏蔽结构，优化制造方法。

6. 发明申请

US20090091907A1 Shielding structure for electronic components 审中-公开
标题翻译：电子元件屏蔽结构
公开(公告)号：US20090091907A1
公开(公告)日：2009-04-09
申请号：US11905993
申请日：2007-10-09
申请人： Chung-Er Huang , Chien-Yu Huang
发明人： Chung-Er Huang , Chien-Yu Huang
IPC分类号： H05K9/00 , C23C30/00
CPC分类号： C23C28/00 , H05K1/0218 , H05K1/181 , H05K3/284 , H05K9/003 , H05K9/0032 , H05K9/0084 , H05K2203/1476
摘要： A shielding structure for electronic components includes a circuit board, at least one electronic module disposed on the circuit board and electrically connected thereto, at least one first covering layer, at least one shielding layer, and one second covering layer. Each first covering layer covers one electronic module and each first covering layer is covered by the shielding layer. The second covering layer covers the shielding layers. In the above-mentioned structure, the shielding layer is formed by coating or printing on the first covering layer in order to shield the electromagnetic radiation emitted by the function module. The time and the costs required for the manufacture of the above invention are reduced compared to the prior art.
摘要翻译：一种用于电子部件的屏蔽结构，包括电路板，至少一个电子模块，设置在电路板上并电连接到其上，至少一个第一覆盖层，至少一个屏蔽层和一个第二覆盖层。每个第一覆盖层覆盖一个电子模块，并且每个第一覆盖层被屏蔽层覆盖。第二覆盖层覆盖屏蔽层。在上述结构中，屏蔽层通过在第一覆盖层上进行涂布或印刷而形成，以屏蔽由功能模块发射的电磁辐射。与现有技术相比，制造上述发明所需的时间和成本降低。

7. 发明授权

US07680615B2 Parallel testing system with shared golden calibration table and method thereof 失效
标题翻译：具有共享金色校准表的并行测试系统及其方法
公开(公告)号：US07680615B2
公开(公告)日：2010-03-16
申请号：US12010454
申请日：2008-01-25
申请人： Chung-Er Huang , Chih-Hao Liao
发明人： Chung-Er Huang , Chih-Hao Liao
IPC分类号： G01D18/00 , G06F7/38
CPC分类号： G01R31/2834 , G01R31/2822 , G01R31/3193
摘要： A parallel testing system with shared golden calibration table includes: a storage unit, multiple testing platforms, and a server. The storage unit is used for storing the golden calibration table, and the testing platforms are used to test a device under test (DUT) respectively by utilizing the golden calibration table. The server is connected to the storage unit and the testing platforms to send the golden calibration table to the testing platforms, and then, to cumulatively record calibration data produced after the testing platforms respectively test the DUTs, so that the server can further perform a weighted arithmetic operation to the calibration data so as to update the golden calibration table. Thereby, the purpose of accelerating the convergence speed of the golden calibration table can be achieved.
摘要翻译：具有共享金色校准表的并行测试系统包括：存储单元，多个测试平台和服务器。存储单元用于存储金色校准表，测试平台用于分别使用金色校准表来测试待测器件（DUT）。服务器连接到存储单元和测试平台，将黄金校准表发送到测试平台，然后累积记录测试平台后产生的校准数据，分别测试DUT，使服务器进一步执行加权对校准数据进行算术运算，以更新黄金校准表。因此，可以实现加速金色校准表的收敛速度的目的。

8. 发明申请

US20090179327A1 Packaging structure, method for manufacturing the same, and method for using the same 审中-公开
标题翻译：包装结构及其制造方法及其使用方法
公开(公告)号：US20090179327A1
公开(公告)日：2009-07-16
申请号：US12007716
申请日：2008-01-15
申请人： Chung-Er Huang , Chih-Hao Liao
发明人： Chung-Er Huang , Chih-Hao Liao
IPC分类号： H01L23/488 , H01L21/58
CPC分类号： H01L21/563 , H01L24/27 , H01L24/29 , H01L2224/16 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2224/83856 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/14
摘要： A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing.
摘要翻译：一种应用于表面安装工艺的包装结构，包括：具有包装表面的芯片模块; 以及形成在芯片模块的封装表面上的预固化层。如上所述，该结构用于保护晶片的外表面。预固化层通过对胶合材料进行预固化而形成，并且胶合材料均匀地填充在包装表面上的连接突起之间的空间。预固化后的是在将连接突起安装到基板上的连接过程中后固化，从而提高连接强度。此外，包装过程的速度也在增加。

9. 发明申请

US20090051044A1 Wafer-level packaged structure and method for making the same 审中-公开
标题翻译：晶圆级封装结构及其制作方法
公开(公告)号：US20090051044A1
公开(公告)日：2009-02-26
申请号：US11987147
申请日：2007-11-28
申请人： Chung-Er Huang , Yueh-Cheng Lee
发明人： Chung-Er Huang , Yueh-Cheng Lee
IPC分类号： H01L23/31 , H01L21/78
CPC分类号： H01L21/78 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L2221/68327 , H01L2221/68336 , H01L2924/0002 , H01L2924/00
摘要： A wafer-level packaging method is shown below: providing an un-cut wafer having a front side and a back side. A plurality of cutting lines is formed on the front side of the wafer so as to define the positions of each chip module such as a wireless module. The next step is providing an extendible film attached onto the back side of the wafer. Next is dicing the wafer along the cutting line to separate each chip module and expending the extendible film so that a gap is formed between each chip module. At last, filling a packaging compound onto the front side and the lateral side of the chip module produces a packaged structure. As mentioned above, the structure is employed for protecting the external surface of the chip.
摘要翻译：晶片级封装方法如下所示：提供具有正面和背面的未切割晶片。多个切割线形成在晶片的前侧，以便限定诸如无线模块的每个芯片模块的位置。下一步是提供附着在晶片背面的可延伸膜。接下来，沿着切割线切割晶片以分离每个芯片模块并且扩展可扩展膜，使得在每个芯片模块之间形成间隙。最后，将包装化合物填充到芯片模块的前侧和侧面产生封装结构。如上所述，该结构用于保护芯片的外表面。

10. 发明授权

US09031808B2 System of testing multiple RF modules and method thereof 有权
标题翻译：多个RF模块的测试系统及其方法
公开(公告)号：US09031808B2
公开(公告)日：2015-05-12
申请号：US13423215
申请日：2012-03-17
申请人： Shih-Feng Huang , Yueh-Cheng Lee , Chung-Er Huang
发明人： Shih-Feng Huang , Yueh-Cheng Lee , Chung-Er Huang
IPC分类号： G01R31/28
CPC分类号： G01R31/2822 , H04B17/20 , H04B17/29
摘要： This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.
摘要翻译：本发明提供一种测试多个RF模块的系统。该系统包括RF信号分析器，RF开关，控制模块和多个测试模块。 RF开关电耦合到RF信号分析器，并且RF开关的操作频带包括用于发射和接收RF信号的RF模块的操作频带。控制器模块控制RF信号分析仪和RF开关。测试模块电耦合到控制器模块并由控制器模块控制。每个测试模块都有一个存储单元，用于存储RF模块发送和接收RF信号的测试结果。 RF开关和测试模块用于电耦合每个RF模块。

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