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    • 1. 发明授权
    • Neuron MOSFET with different interpolysilicon oxide
    • 具有不同的多晶硅氧化物的神经元MOSFET
    • US5633520A
    • 1997-05-27
    • US667609
    • 1996-06-21
    • Chung-Cheng WuMing-Tzong Yang
    • Chung-Cheng WuMing-Tzong Yang
    • H01L21/822H01L27/115H01L27/108H01L29/76H01L29/788
    • H01L27/115H01L21/8221H01L29/788Y10S148/116Y10S148/117Y10S148/163Y10S438/981
    • An MOSFET device is fabricated with a plurality of conductors capacitively coupled to a first electrode, forming a mask on the surface of the first electrode exposing a predetermined zone of the first electrode, doping the first electrode through the mask, removing the mask from the surface of the first electrode, oxidizing the first electrode to form a layer of oxide over the first electrode with a thicker layer of oxide over the predetermined zone and a thinner layer of oxide elsewhere, forming at least one electrode over the first electrode on the thinner layer of oxide outside of the zone and forming at least one other electrode over the first electrode on the thicker layer of oxide inside the zone, whereby the one electrode and the other electrode have substantially different capacitive coupling to the electrode.
    • 制造具有电容耦合到第一电极的多个导体的MOSFET器件,在第一电极的表面上形成掩模,暴露第一电极的预定区域,通过掩模掺杂第一电极,从表面去除掩模 在所述第一电极上氧化所述第一电极以在所述第一电极上形成氧化层以在所述预定区域上具有较厚的氧化物层,并且在其它地方形成更薄的氧化物层,在所述较薄层上的所述第一电极上形成至少一个电极 的氧化物,并且在所述区域内的更厚的氧化物层上在所述第一电极上方形成至少一个其它电极,由此所述一个电极和所述另一个电极具有与所述电极基本上不同的电容耦合。
    • 3. 发明授权
    • Method of forming neuron mosfet with different interpolysilicon oxide
thickness
    • 形成具有不同的多晶硅氧化物厚度的神经元mosfet的方法
    • US5554545A
    • 1996-09-10
    • US299266
    • 1994-09-01
    • Chung-Cheng WuMing-Tzong Yang
    • Chung-Cheng WuMing-Tzong Yang
    • H01L21/822H01L27/115H01L21/265
    • H01L27/115H01L21/8221H01L29/788Y10S148/116Y10S148/117Y10S148/163Y10S438/981
    • An MOSFET device is fabricated with a plurality of conductors capacitively coupled to a first electrode, forming a mask on the surface of the first electrode exposing a predetermined zone of the first electrode, doping the first electrode through the mask, removing the mask from the surface of the first electrode, oxidizing the first electrode to form a layer of oxide over the first electrode with a thicker layer of oxide over the predetermined zone and a thinner layer of oxide elsewhere, forming at least one electrode over the first electrode on the thinner layer of oxide outside of the zone and forming at least one other electrode over the first electrode on the thicker layer of oxide inside the zone, whereby the one electrode and the other electrode have substantially different capacitive coupling to the electrode.
    • 制造具有电容耦合到第一电极的多个导体的MOSFET器件,在第一电极的表面上形成掩模,暴露第一电极的预定区域,通过掩模掺杂第一电极,从表面去除掩模 在所述第一电极上氧化所述第一电极以在所述第一电极上形成氧化层以在所述预定区域上具有较厚的氧化物层,并且在其它地方形成更薄的氧化物层,在所述较薄层上的所述第一电极上形成至少一个电极 的氧化物,并且在所述区域内的更厚的氧化物层上在所述第一电极上方形成至少一个其它电极,由此所述一个电极和所述另一个电极具有与所述电极基本上不同的电容耦合。
    • 4. 发明授权
    • Method for fabricating semiconductor device isolation using double oxide
spacers
    • 使用双氧化物间隔物制造半导体器件隔离的方法
    • US5436190A
    • 1995-07-25
    • US344007
    • 1994-11-23
    • Ming-Tzong YangChung-Cheng Wu
    • Ming-Tzong YangChung-Cheng Wu
    • H01L21/763H01L21/76
    • H01L21/763
    • A method for fabricating a very narrow electrical isolation trench in a semiconductor substrate for isolating the individual field effect transistors (FETs) is achieved. This method eliminates the oxide encroachment into the device area associated with LOCOS techniques, thereby increasing device density. The method involves etching trenches, less than one half micrometer in width in the silicon substrate and forming sidewall spacer in the trench. The trench is filled with doped polysilicon and planarized, forming a trench which is planar with the device region. These isolation trenches are made in both N and P-wells for fabricating CMOS circuits having ULSI densities.
    • 实现了用于在用于隔离各个场效应晶体管(FET)的半导体衬底中制造非常窄的电隔离沟槽的方法。 该方法消除了与LOCOS技术相关的器件区域的氧化物侵蚀,从而增加器件密度。 该方法包括蚀刻在硅衬底中宽度小于半微米的沟槽,并在沟槽中形成侧壁间隔物。 沟槽填充有掺杂的多晶硅并且被平坦化,形成与器件区域平坦的沟槽。 这些隔离沟槽在N阱和P阱中制造,用于制造具有ULSI密度的CMOS电路。
    • 10. 发明申请
    • FREQUENCY JITTER GENERATOR AND PWM CONTROLLER
    • 频率抖动发生器和PWM控制器
    • US20090302911A1
    • 2009-12-10
    • US12347074
    • 2008-12-31
    • Chen-Hsung WangWei-Liang KungChung-Cheng Wu
    • Chen-Hsung WangWei-Liang KungChung-Cheng Wu
    • H03K3/017
    • H03K3/017H03K3/84H03K4/502
    • A frequency jitter generator and a frequency jitter PWM controller are provided for overcoming the shortcoming that a conventional PWM controller reduces the electromagnetic interference issue by means of varying the operating frequency of the PWM controller based on an input voltage, while resulting in the uncertainty of the range of frequency jitter and the difficulty circuit design due to the effect of the input voltage and the load. The frequency jitter generator and PWM controller adjust the range of frequency jitter by using a signal within a fixed voltage range. The invention not only gets rid of the effect of the input voltage and the loading, but also simplifies the circuit design by fixing the range of frequency jitter no greater than a predetermined percentage regardless of the operating frequency of the PWM controller.
    • 提供了一种频率抖动发生器和频率抖动PWM控制器来克服传统PWM控制器通过基于输入电压改变PWM控制器的工作频率来减少电磁干扰问题的缺点,同时导致不确定性 由于输入电压和负载的影响,频率抖动范围和电路设计难度大。 频率抖动发生器和PWM控制器通过使用固定电压范围内的信号来调整频率抖动的范围。 本发明不仅消除了输入电压和负载的影响,而且通过将频率抖动的范围固定为不大于预定百分比来简化电路设计,而不管PWM控制器的工作频率如何。