专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080308309A1 Structure of packaging substrate having capacitor embedded therein and method for fabricating the same 审中-公开
标题翻译：其中包含电容器的封装衬底的结构及其制造方法
公开(公告)号：US20080308309A1
公开(公告)日：2008-12-18
申请号：US11808962
申请日：2007-06-14
申请人： Chung-Cheng Lien , Chih-Kui Yang
发明人： Chung-Cheng Lien , Chih-Kui Yang
IPC分类号： H05K1/16 , H05K3/10
CPC分类号： H05K1/162 , H05K3/4644 , H05K3/4652 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2203/0152 , H05K2203/0353 , H05K2203/0376 , H05K2203/0537 , H05K2203/1131 , Y10T29/49155
摘要： A structure of a packaging substrate having capacitors embedded therein is disclosed. The structure comprises a core substrate, a dielectric layer, and an outer circuit layer. The core substrate comprises an inner circuit layer. The dielectric layer is disposed at both sides of the core substrate, having first conductive vias each connecting to the inner circuit layer through a piece of outer electrode plate, a piece of high dielectric material layer, a piece of inner electrode plate, and a piece of adhesive layer, in sequence. The outer circuit layer is disposed on the surface of each of the dielectric layers. Herein, the capacitor is composed of a piece of the outer electrode plate, the high dielectric material layer and the inner electrode plate. The invention further comprises a method for manufacturing the same. This can achieve low costs, avoid the formation of voids, and reduce parasitic capacitance.
摘要翻译：公开了一种其中嵌有电容器的封装衬底的结构。该结构包括芯基板，电介质层和外电路层。芯基板包括内电路层。电介质层设置在芯基板的两侧，具有通过一片外电极板，一片高电介质材料层，一片内电极板和一片连接到内电路层的第一导电通孔的粘合剂层。外电路层设置在每个电介质层的表面上。这里，电容器由外电极板，高介电材料层和内电极板构成。本发明还包括其制造方法。这可以实现低成本，避免形成空隙，并减少寄生电容。

2. 发明申请

US20080210460A1 Circuit board structure with capacitors embedded therein and method for fabricating the same 有权
标题翻译：具有嵌入电容器的电路板结构及其制造方法
公开(公告)号：US20080210460A1
公开(公告)日：2008-09-04
申请号：US12010345
申请日：2008-01-24
申请人： Chung-Cheng Lien , Chih-Kui Yang
发明人： Chung-Cheng Lien , Chih-Kui Yang
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4652 , H05K2201/0355 , H05K2201/09536 , H05K2201/09763
摘要： A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.
摘要翻译：公开了一种其中嵌有电容器的电路板结构及其制造方法。该结构包括至少两个核心层，其单独地包括具有两个相对表面的电介质层，设置在电介质层的两个相对表面的外侧的电路层，以及分别嵌入在介电层的两个相对表面的内部的内部的至少两个电容器所述电介质层与所述电路层在同一侧分别电连接; 设置在所述芯层之间的至少一个粘合剂层，以将所述芯层组合为芯结构; 以及穿透芯层和粘合剂层的至少一个导电通孔，并且电连接芯层的电路层。因此，本发明可以提高电路布局的灵活性，并且实现电容器之间的并联以提供更多的电容。

3. 发明申请

US20080217739A1 Semiconductor packaging substrate structure with capacitor embedded therein 审中-公开
标题翻译：具有电容器的半导体封装衬底结构嵌入其中
公开(公告)号：US20080217739A1
公开(公告)日：2008-09-11
申请号：US12153388
申请日：2008-05-19
申请人： Chung-Cheng Lien , Chih-Kui Yang
发明人： Chung-Cheng Lien , Chih-Kui Yang
IPC分类号： H01L27/08
CPC分类号： H01L23/49833 , H01L23/49822 , H01L2924/0002 , H05K1/162 , H05K3/0023 , H05K3/4602 , H05K3/4661 , H05K2201/0187 , H05K2201/0195 , H05K2201/0209 , H05K2201/09536 , H05K2201/09672 , H01L2924/00
摘要： The present invention relates to a semiconductor packaging substrate structure with a capacitor embedded therein, which includes an inner circuit board, a patterned buffer layer, a high dielectric material layer, and a patterned metal layer. The buffer layer is disposed on at least one surface of the inner circuit board to expose the inner electrode layer of the internal board. The high dielectric material layer is located on the buffer layer and the inner electrode layer. The metal layer is placed on the high dielectric material layer including an outer circuit layer capable of electrical connection to the inner circuit layer, and an outer electrode layer corresponding to the inner electrode layer to form a capacitor. Owing to the assistance of the buffer layer, the structure can enhance the transmission and the quality of the products.
摘要翻译：本发明涉及一种具有嵌入其中的电容器的半导体封装衬底结构，其包括内部电路板，图案化缓冲层，高介电材料层和图案化金属层。缓冲层设置在内部电路板的至少一个表面上，以暴露内部电路板的内部电极层。高介电材料层位于缓冲层和内电极层上。金属层被放置在包括能够与内部电路层电连接的外部电路层的高电介质材料层和与内部电极层相对应的外部电极层以形成电容器。由于缓冲层的帮助，该结构可以增强产品的传输和质量。

4. 发明授权

US08642898B2 Circuit board structure with capacitors embedded therein 有权
标题翻译：具有内置电容器的电路板结构
公开(公告)号：US08642898B2
公开(公告)日：2014-02-04
申请号：US13565075
申请日：2012-08-02
申请人： Chung-Cheng Lien , Chih-Kui Yang
发明人： Chung-Cheng Lien , Chih-Kui Yang
IPC分类号： H05K1/16 , H05K3/02 , H05K3/42 , H05K3/46
CPC分类号： H05K1/162 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4652 , H05K2201/0355 , H05K2201/09536 , H05K2201/09763
摘要： A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.
摘要翻译：公开了一种其中嵌有电容器的电路板结构及其制造方法。该结构包括至少两个核心层，其单独地包括具有两个相对表面的电介质层，设置在电介质层的两个相对表面的外侧的电路层，以及分别嵌入在介电层的两个相对表面的内部的内部的至少两个电容器所述电介质层与所述电路层在同一侧分别电连接; 设置在所述芯层之间的至少一个粘合剂层，以将所述芯层组合为芯结构; 以及穿透芯层和粘合剂层的至少一个导电通孔，并且电连接芯层的电路层。因此，本发明可以提高电路布局的灵活性，并且实现电容器之间的并联以提供更多的电容。

5. 发明申请

US20120292089A1 CIRCUIT BOARD STRUCTURE WITH CAPACITORS EMBEDDED THEREIN AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：嵌入式电容器的电路板结构及其制造方法
公开(公告)号：US20120292089A1
公开(公告)日：2012-11-22
申请号：US13565075
申请日：2012-08-02
申请人： Chung-Cheng LIEN , Chih-Kui Yang
发明人： Chung-Cheng LIEN , Chih-Kui Yang
IPC分类号： H05K1/16
CPC分类号： H05K1/162 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4652 , H05K2201/0355 , H05K2201/09536 , H05K2201/09763
摘要： A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.
摘要翻译：公开了一种其中嵌有电容器的电路板结构及其制造方法。该结构包括至少两个核心层，其单独地包括具有两个相对表面的电介质层，设置在电介质层的两个相对表面的外侧的电路层，以及分别嵌入在介电层的两个相对表面的内部的内部的至少两个电容器所述电介质层与所述电路层在同一侧分别电连接; 设置在所述芯层之间的至少一个粘合剂层，以将所述芯层组合为芯结构; 以及穿透芯层和粘合剂层的至少一个导电通孔，并且电连接芯层的电路层。因此，本发明可以提高电路布局的灵活性，并且实现电容器之间的并联以提供更多的电容。

6. 发明授权

US08256106B2 Method for fabricating circuit board structure with capacitors embedded therein 有权
标题翻译：制造电容器结构的方法，其中嵌入电容器
公开(公告)号：US08256106B2
公开(公告)日：2012-09-04
申请号：US12010345
申请日：2008-01-24
申请人： Chung-Cheng Lien , Chih-Kui Yang
发明人： Chung-Cheng Lien , Chih-Kui Yang
IPC分类号： H05K1/16 , H05K3/02 , H05K3/32 , H05K3/42 , H05K3/46
CPC分类号： H05K1/162 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4652 , H05K2201/0355 , H05K2201/09536 , H05K2201/09763
摘要： A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and at least two capacitors embedded respectively on the insides of the two opposite surfaces of the dielectric layer and individually electrically connecting with the circuit layer at the same side; at least one adhesive layer disposed between the core layers to combine the core layers as a core structure; and at least one conductive through hole penetrating the core layers and the adhesive layer, and electrically connecting the circuit layers of the core layers. Accordingly, the present invention can improve the flexibility of circuit layout, and realize parallel connection between the capacitors to provide more capacitance.
摘要翻译：公开了一种其中嵌有电容器的电路板结构及其制造方法。该结构包括至少两个核心层，其单独地包括具有两个相对表面的电介质层，设置在电介质层的两个相对表面的外侧的电路层，以及分别嵌入在介电层的两个相对表面的内部的内部的至少两个电容器所述电介质层与所述电路层在同一侧分别电连接; 设置在所述芯层之间的至少一个粘合剂层，以将所述芯层组合为芯结构; 以及穿透芯层和粘合剂层的至少一个导电通孔，并且电连接芯层的电路层。因此，本发明可以提高电路布局的灵活性，并且实现电容器之间的并联以提供更多的电容。

7. 发明申请

US20080030965A1 Circuit board structure with capacitors embedded therein and method for fabricating the same 审中-公开
标题翻译：具有嵌入电容器的电路板结构及其制造方法
公开(公告)号：US20080030965A1
公开(公告)日：2008-02-07
申请号：US11701441
申请日：2007-02-02
申请人： Chung-Cheng Lien , Chih-Kui Yang
发明人： Chung-Cheng Lien , Chih-Kui Yang
IPC分类号： H05K1/00
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0355 , H05K2201/09509 , Y10T29/49126
摘要： A circuit board structure with capacitor embedded therein and method for fabricating the same are disclosed, especially a core structure with capacitors embedded therein and method for fabricating the same. The structure comprising: a core board having a dielectric layer with a first surface and an opposite second surface; at least one high dielectric coefficient material layer formed in the dielectric layer, wherein a first electrode plate formed on the other surface of the high dielectric coefficient material layer; a first circuit layer formed on the first surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and having a second electrode plate corresponding to the first electrode plate; and a first conductive via formed in the dielectric layer and electrically connecting the first electrode plate and the first circuit layer.
摘要翻译：公开了一种其中嵌有电容器的电路板结构及其制造方法，特别是其中嵌有电容器的芯结构及其制造方法。该结构包括：芯板，具有具有第一表面和相对的第二表面的电介质层; 形成在所述电介质层中的至少一个高介电系数材料层，其中形成在所述高介电系数材料层的另一个表面上的第一电极板; 形成在所述电介质层的第一表面上的第一电路层; 形成在电介质层的第二表面上并具有与第一电极板对应的第二电极板的第二电路层; 以及形成在电介质层中并电连接第一电极板和第一电路层的第一导电通孔。

8. 发明授权

US07908744B2 Method for fabricating printed circuit board having capacitance components 有权
标题翻译：一种具有电容元件的印刷电路板的制造方法
公开(公告)号：US07908744B2
公开(公告)日：2011-03-22
申请号：US12541267
申请日：2009-08-14
申请人： Shin-Ping Hsu , Chih-Kui Yang
发明人： Shin-Ping Hsu , Chih-Kui Yang
IPC分类号： H05K3/36
CPC分类号： H05K1/162 , H05K3/025 , H05K3/4602 , H05K3/4652 , H05K2201/09509 , H05K2201/09518 , H05K2201/09763 , H05K2203/0152 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： A method of fabricating a printed circuit board having capacitance components, including: providing a core board having first and second surfaces with first and second wiring layers provided thereon, respectively, and electrically connected, a second dielectric layer, and a carrier board sequentially provided thereon with a second metal layer, a high dielectric material layer, and a third wiring layer with a plurality of first electrode plates thereon; laminating the core board, second dielectric layer, and carrier board to one another; removing the carrier board so as to expose the second metal layer; and patterning the second metal layer so as to form a fifth wiring layer having a plurality of second electrode plates and a plurality of second conductive vias electrically connected to the third wiring layer, thereby allowing the first electrode plates, high dielectric material layer, and second electrode plates together to form a plurality of capacitance components.
摘要翻译：一种制造具有电容元件的印刷电路板的方法，包括：提供具有分别设置在其上的第一和第二布线层的第一和第二表面的芯板，并且电连接，第二介电层和顺序地设置在其上的载体板具有第二金属层，高介电材料层和在其上具有多个第一电极板的第三布线层; 将芯板，第二介质层和载体板彼此层叠; 移除载体板以露出第二金属层; 以及图案化所述第二金属层以形成具有多个第二电极板的第五布线层和与所述第三布线层电连接的多个第二导电通孔，从而允许所述第一电极板，高电介质层和第二布线层电极板一起形成多个电容部件。

9. 发明申请

US20100115767A1 METHOD FOR FABRICATING PRINTED CIRCUIT BOARD HAVING CAPACITANCE COMPONENTS 有权
标题翻译：用于制作具有电容元件的印刷电路板的方法
公开(公告)号：US20100115767A1
公开(公告)日：2010-05-13
申请号：US12541267
申请日：2009-08-14
申请人： Shin-Ping Hsu , Chih-Kui Yang
发明人： Shin-Ping Hsu , Chih-Kui Yang
IPC分类号： H05K3/30
CPC分类号： H05K1/162 , H05K3/025 , H05K3/4602 , H05K3/4652 , H05K2201/09509 , H05K2201/09518 , H05K2201/09763 , H05K2203/0152 , Y10T29/435 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： A method of fabricating a printed circuit board having capacitance components, including: providing a core board having first and second surfaces with first and second wiring layers provided thereon, respectively, and electrically connected, a second dielectric layer, and a carrier board sequentially provided thereon with a second metal layer, a high dielectric material layer, and a third wiring layer with a plurality of first electrode plates thereon; laminating the core board, second dielectric layer, and carrier board to one another; removing the carrier board so as to expose the second metal layer; and patterning the second metal layer so as to form a fifth wiring layer having a plurality of second electrode plates and a plurality of second conductive vias electrically connected to the third wiring layer, thereby allowing the first electrode plates, high dielectric material layer, and second electrode plates together to form a plurality of capacitance components.
摘要翻译：一种制造具有电容元件的印刷电路板的方法，包括：提供具有分别设置在其上的第一和第二布线层的第一和第二表面的芯板，并且电连接，第二介电层和顺序地设置在其上的载体板具有第二金属层，高介电材料层和在其上具有多个第一电极板的第三布线层; 将芯板，第二介质层和载体板彼此层叠; 移除载体板以露出第二金属层; 以及图案化所述第二金属层以形成具有多个第二电极板的第五布线层和与所述第三布线层电连接的多个第二导电通孔，从而允许所述第一电极板，高电介质层和第二布线层电极板一起形成多个电容部件。

10. 发明申请

US20090102045A1 Packaging substrate having capacitor embedded therein 审中-公开
标题翻译：其中包含电容器的封装基板
公开(公告)号：US20090102045A1
公开(公告)日：2009-04-23
申请号：US12285957
申请日：2008-10-17
申请人： Shih-Ping Hsu , Wen-Sung Chang , Chih-Kui Yang
发明人： Shih-Ping Hsu , Wen-Sung Chang , Chih-Kui Yang
IPC分类号： H01L23/12
CPC分类号： H01L23/50 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A packaging substrate having capacitors embedded therein, comprising: two capacitor disposition layers, each respectively consisting of a high dielectric layer and two first circuit layers disposed on two opposite surfaces of the high dielectric layer, wherein each of the first circuit layers has a plurality of electrode plates and a plurality of circuits; an adhesive layer disposed between the capacitor disposition layers to adhere the capacitor disposition layers to form a core board structure, wherein spaces between the circuits of every first circuit layer are filled with the adhesive layer; and a plurality of conductive through holes penetrating the capacitor disposition layers and the adhesive layer, and electrically connecting the circuits of the capacitor disposition layers respectively; wherein, pairs of the electrode plates on the opposite surfaces of each of the capacitor disposition layers are parallel and correspond to each other to form capacitors.
摘要翻译：一种具有嵌入其中的电容器的封装衬底，包括：两个电容器配置层，每个电容器配置层分别由高电介质层和设置在高电介质层的两个相对表面上的两个第一电路层组成，其中每个第一电路层具有多个电极板和多个电路; 设置在电容器配置层之间的粘合剂层，以粘附电容器配置层以形成芯板结构，其中每个第一电路层的电路之间的空间用粘合剂层填充; 以及穿过电容器配置层和粘合剂层的多个导电通孔，并分别电连接电容器配置层的电路; 其中，每个电容器配置层的相对表面上的电极板对成对平行并彼此对应以形成电容器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式