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1. 发明授权

US08012777B2 Packaging process of light emitting diode 有权
标题翻译：发光二极管封装工艺
公开(公告)号：US08012777B2
公开(公告)日：2011-09-06
申请号：US12496644
申请日：2009-07-02
申请人： Wen-Sung Chang , Cheng-Ta Kuo
发明人： Wen-Sung Chang , Cheng-Ta Kuo
IPC分类号： H01L21/56
CPC分类号： H01L33/52 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured.
摘要翻译：提供了一种发光二极管（LED）的封装工艺。首先，将LED芯片与载体接合以彼此电连接。之后，载体被加热以升高其温度。接下来，通过分配工艺在加热的载体上形成密封剂以封装LED芯片，其中在与载体接触之前，密封剂在与载体接触之前的粘度低于封装剂的粘度。此后，密封剂固化。

2. 发明申请

US20100261299A1 PACKAGING PROCESS OF LIGHT EMITTING DIODE 有权
标题翻译：发光二极管的包装工艺
公开(公告)号：US20100261299A1
公开(公告)日：2010-10-14
申请号：US12496644
申请日：2009-07-02
申请人： Wen-Sung Chang , Cheng-Ta Kuo
发明人： Wen-Sung Chang , Cheng-Ta Kuo
IPC分类号： H01L21/56 , H01L33/00
CPC分类号： H01L33/52 , H01L2924/0002 , H01L2933/005 , H01L2924/00
摘要： A packaging process of a light emitting diode (LED) is provided. First, an LED chip is bonded with a carrier to electrically connect to each other. After that, the carrier is heated to raise the temperature thereof. Next, an encapsulant is formed on the heated carrier by a dispensing process to encapsulate the LED chip, wherein the viscosity of the encapsulant before contacting the carrier is lower than that of the encapsulant after contacting the carrier. Thereafter, the encapsulant is cured.
摘要翻译：提供了一种发光二极管（LED）的封装工艺。首先，将LED芯片与载体接合以彼此电连接。之后，载体被加热以升高其温度。接下来，通过分配工艺在加热的载体上形成密封剂以封装LED芯片，其中在与载体接触之前，密封剂在与载体接触之前的粘度低于封装剂的粘度。此后，密封剂固化。

3. 发明申请

US20090102045A1 Packaging substrate having capacitor embedded therein 审中-公开
标题翻译：其中包含电容器的封装基板
公开(公告)号：US20090102045A1
公开(公告)日：2009-04-23
申请号：US12285957
申请日：2008-10-17
申请人： Shih-Ping Hsu , Wen-Sung Chang , Chih-Kui Yang
发明人： Shih-Ping Hsu , Wen-Sung Chang , Chih-Kui Yang
IPC分类号： H01L23/12
CPC分类号： H01L23/50 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： A packaging substrate having capacitors embedded therein, comprising: two capacitor disposition layers, each respectively consisting of a high dielectric layer and two first circuit layers disposed on two opposite surfaces of the high dielectric layer, wherein each of the first circuit layers has a plurality of electrode plates and a plurality of circuits; an adhesive layer disposed between the capacitor disposition layers to adhere the capacitor disposition layers to form a core board structure, wherein spaces between the circuits of every first circuit layer are filled with the adhesive layer; and a plurality of conductive through holes penetrating the capacitor disposition layers and the adhesive layer, and electrically connecting the circuits of the capacitor disposition layers respectively; wherein, pairs of the electrode plates on the opposite surfaces of each of the capacitor disposition layers are parallel and correspond to each other to form capacitors.
摘要翻译：一种具有嵌入其中的电容器的封装衬底，包括：两个电容器配置层，每个电容器配置层分别由高电介质层和设置在高电介质层的两个相对表面上的两个第一电路层组成，其中每个第一电路层具有多个电极板和多个电路; 设置在电容器配置层之间的粘合剂层，以粘附电容器配置层以形成芯板结构，其中每个第一电路层的电路之间的空间用粘合剂层填充; 以及穿过电容器配置层和粘合剂层的多个导电通孔，并分别电连接电容器配置层的电路; 其中，每个电容器配置层的相对表面上的电极板对成对平行并彼此对应以形成电容器。

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