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    • 9. 发明授权
    • Phase change memory cell with roundless micro-trenches
    • 具有圆形微沟槽的相变存储单元
    • US07642170B2
    • 2010-01-05
    • US11864719
    • 2007-09-28
    • Tzyh-Cheang LeeChun-Sheng LiangFu-Liang Yang
    • Tzyh-Cheang LeeChun-Sheng LiangFu-Liang Yang
    • H01L21/20
    • H01L45/1233H01L27/2463H01L45/06H01L45/126H01L45/144H01L45/1666
    • A method for constructing a phase change memory device includes forming a first dielectric layer on a substrate; forming a first conductive component in the first dielectric layer; forming a second dielectric layer over the first conductive component in the first dielectric layer; forming a conductive crown in the second dielectric layer, the conductive crown being in contact and alignment with the conductive component; depositing a third dielectric layer in the conductive crown; and forming a trench filled with chalcogenic materials having an amorphous phase and a crystalline phase programmable by controlling a temperature thereof to represent logic states, wherein the trench extends across the conductive crown, such that the trench is free from a rounded end portion caused by lithography during fabrication of the phase change memory device.
    • 一种构造相变存储器件的方法包括:在衬底上形成第一电介质层; 在所述第一介电层中形成第一导电组分; 在所述第一介电层中的所述第一导电部件上形成第二电介质层; 在所述第二介电层中形成导电冠,所述导电冠与所述导电部件接触并对齐; 在导电冠中沉积第三电介质层; 并且形成填充有具有非晶相和结晶相的硫化物的沟槽,其可通过控制其温度来表示逻辑状态,其中所述沟槽延伸穿过所述导电冠,使得所述沟槽没有由光刻引起的圆形端部 在相变存储器件的制造过程中。
    • 10. 发明申请
    • Phase change memory cell with roundless micro-trenches
    • 具有圆形微沟槽的相变存储单元
    • US20090087945A1
    • 2009-04-02
    • US11864719
    • 2007-09-28
    • Tzyh Cheang LeeChun-Sheng LiangFu-Liang Yang
    • Tzyh Cheang LeeChun-Sheng LiangFu-Liang Yang
    • H01L45/00
    • H01L45/1233H01L27/2463H01L45/06H01L45/126H01L45/144H01L45/1666
    • A method for constructing a phase change memory device includes forming a first dielectric layer on a substrate; forming a first conductive component in the first dielectric layer; forming a second dielectric layer over the first conductive component in the first dielectric layer; forming a conductive crown in the second dielectric layer, the conductive crown being in contact and alignment with the conductive component; depositing a third dielectric layer in the conductive crown; and forming a trench filled with chalcogenic materials having an amorphous phase and a crystalline phase programmable by controlling a temperature thereof to represent logic states, wherein the trench extends across the conductive crown, such that the trench is free from a rounded end portion caused by lithography during fabrication of the phase change memory device.
    • 一种构造相变存储器件的方法包括:在衬底上形成第一电介质层; 在所述第一介电层中形成第一导电组分; 在所述第一介电层中的所述第一导电部件上形成第二电介质层; 在所述第二介电层中形成导电冠,所述导电冠与所述导电部件接触并对齐; 在导电冠中沉积第三电介质层; 并且形成填充有具有非晶相和结晶相的硫化物的沟槽,其可通过控制其温度来表示逻辑状态,其中所述沟槽延伸穿过导电冠,使得沟槽没有由光刻引起的圆形端部 在相变存储器件的制造过程中。