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1. 发明授权

US6163076A Stacked structure of semiconductor package 有权
标题翻译：半导体封装的堆叠结构
公开(公告)号：US6163076A
公开(公告)日：2000-12-19
申请号：US325382
申请日：1999-06-04
申请人： Chun-Chi Lee , Kuang-Lin Lo , Kuang-Chwn Chou , Shih-Chih Chen
发明人： Chun-Chi Lee , Kuang-Lin Lo , Kuang-Chwn Chou , Shih-Chih Chen
IPC分类号： H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , H01L23/3157 , H01L23/49531 , H01L23/49551 , H01L23/49575 , H01L23/49805 , H01L2224/16 , H01L2225/06517 , H01L2225/06582 , H01L2924/00014 , H01L2224/0401
摘要： A stacked structure of a semiconductor package mainly comprises a first chip, a second chip, a substrate and a lead frame. The first chip and the second chip are attached on the surface of the substrate by a plurality of solder bumps by means of flipchip bonding. Then, the first chip, the second chip and the substrate form a stacked structure. A plurality of plugs of the substrate is provided along an edge of the substrate so as to attach to a plurality of receptacles of the lead frame to form a semiconductor device. The plugs are attached to the receptacles of the lead frame by silver paste to form a semiconductor device in such a way that the first chip and the second chip electrically connect to the lead frame. In addition, the lead frame is bent to form a plurality of fingers, which is placed in a space that is formed by a sidewall of the chip and a surface of the substrate while it is assembled. An encapsulant covers the stacked structure, then the fingers are exposed on the surface of the encapsulant, so that the first chip and the second chip can be operated by means of the fingers.
摘要翻译：半导体封装的堆叠结构主要包括第一芯片，第二芯片，基板和引线框架。第一芯片和第二芯片通过倒装芯片接合通过多个焊料凸块附接在基板的表面上。然后，第一芯片，第二芯片和基板形成堆叠结构。沿着基板的边缘设置多个基板插头，以便连接到引线框架的多个插座以形成半导体器件。插头通过银膏附接到引线框架的插座以形成半导体器件，使得第一芯片和第二芯片电连接到引线框架。此外，引线框架弯曲以形成多个指状物，其被放置在由芯片的侧壁和基板的表面组装在其中的表面形成的空间中。密封剂覆盖堆叠结构，然后将指状物暴露在密封剂的表面上，使得第一芯片和第二芯片可以通过手指操作。

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