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1. 发明申请

US20110127620A1 MEMS INTEGRATED CHIP AND METHOD FOR MAKING SAME 失效
标题翻译： MEMS集成芯片及其制造方法
公开(公告)号：US20110127620A1
公开(公告)日：2011-06-02
申请号：US12627480
申请日：2009-11-30
申请人： Chuan-Wei Wang , Sheng-Ta Lee , Hsin-Hui Hsu , Wei-Chung Wang
发明人： Chuan-Wei Wang , Sheng-Ta Lee , Hsin-Hui Hsu , Wei-Chung Wang
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： H01L23/481 , B81B2207/07 , B81C1/00246 , B81C2203/0714 , B81C2203/0735 , H01L29/78 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a MEMS (Micro-Electro-Mechanical System) chip and a method for making the MEMS chip. The MEMS chip comprises: a first substrate having a first surface and a second surface opposing each other; a microelectronic device area on the first surface; a first MEMS device area on the second surface; and a conductive interconnection structure electrically connecting the microelectronic device area and the first MEMS device area.
摘要翻译：本发明公开了一种MEMS（微电子机械系统）芯片及其制造方法。 MEMS芯片包括：具有第一表面和彼此相对的第二表面的第一基板; 第一表面上的微电子器件区域; 第二表面上的第一MEMS器件区域; 以及电连接微电子器件区域和第一MEMS器件区域的导电互连结构。

2. 发明授权

US08513041B2 MEMS integrated chip and method for making same 失效
标题翻译： MEMS集成芯片及其制造方法
公开(公告)号：US08513041B2
公开(公告)日：2013-08-20
申请号：US12627480
申请日：2009-11-30
申请人： Chuan-Wei Wang , Sheng-Ta Lee , Hsin-Hui Hsu , Wei-Chung Wang
发明人： Chuan-Wei Wang , Sheng-Ta Lee , Hsin-Hui Hsu , Wei-Chung Wang
IPC分类号： H01L21/00
CPC分类号： H01L23/481 , B81B2207/07 , B81C1/00246 , B81C2203/0714 , B81C2203/0735 , H01L29/78 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a MEMS (Micro-Electro-Mechanical System) chip and a method for making the MEMS chip. The MEMS chip comprises: a first substrate having a first surface and a second surface opposing each other; a microelectronic device area on the first surface; a first MEMS device area on the second surface; and a conductive interconnection structure electrically connecting the microelectronic device area and the first MEMS device area.
摘要翻译：本发明公开了一种MEMS（微电子机械系统）芯片及其制造方法。 MEMS芯片包括：具有第一表面和彼此相对的第二表面的第一基板; 第一表面上的微电子器件区域; 第二表面上的第一MEMS器件区域; 以及电连接微电子器件区域和第一MEMS器件区域的导电互连结构。

3. 发明授权

US08421173B2 Chip package structure and chip packaging process 有权
标题翻译：芯片封装结构和芯片封装工艺
公开(公告)号：US08421173B2
公开(公告)日：2013-04-16
申请号：US13210485
申请日：2011-08-16
申请人： Wei-Chung Wang , Sen-Huang Huang
发明人： Wei-Chung Wang , Sen-Huang Huang
IPC分类号： H01L31/0232 , H01L21/00 , H01L21/84
CPC分类号： H01L23/3114 , H01L21/561 , H01L24/19 , H01L24/20 , H01L27/14618 , H01L27/14683 , H01L2224/12105 , H01L2924/14 , H01L2924/00
摘要： A chip package structure includes a silicon substrate, a sensing component, a metal circuit layer, a first insulating layer and a conductive metal layer. The silicon substrate has opposite first and second surfaces. The sensing component is disposed on the first surface. The metal circuit layer is disposed on the first surface and electrically connected to the sensing component. The first insulating layer covers the second surface and has a first through hole to expose a portion of the second surface. The conductive metal layer is disposed on the first insulating layer and includes first leads and a second lead. The first leads are electrically connected to the metal circuit layer. The second lead is filled in the first through hole to electrically connect to the silicon substrate and one of the first leads. A chip packaging process for fabricating the chip package structure is also provided.
摘要翻译：芯片封装结构包括硅衬底，感测部件，金属电路层，第一绝缘层和导电金属层。硅衬底具有相对的第一和第二表面。感测部件设置在第一表面上。金属电路层设置在第一表面上并电连接到感测部件。第一绝缘层覆盖第二表面并且具有第一通孔以暴露第二表面的一部分。导电金属层设置在第一绝缘层上，并且包括第一引线和第二引线。第一引线电连接到金属电路层。第二引线被填充在第一通孔中以电连接到硅衬底和第一引线之一。还提供了用于制造芯片封装结构的芯片封装工艺。

4. 发明授权

US08288853B2 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US08288853B2
公开(公告)日：2012-10-16
申请号：US12615852
申请日：2009-11-10
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L21/76898 , H01L25/50 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05548 , H01L2224/05647 , H01L2224/05666 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2224/05099
摘要： A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder.
摘要翻译：封装包括包括半导体本体，孔，隔离层，导电层和焊料的第一单元。半导体本体具有第一表面，其具有衬垫和暴露衬垫的保护层。孔穿透半导体本体。隔离层设置在孔的侧壁上。导电层覆盖焊盘，保护层的一部分和隔离层。导电层的下端延伸到半导体本体的第二表面的下方。焊料设置在孔中，并通过导电层与焊盘电连接。类似于第一单元并且堆叠在其上的第二单元包括延伸到第二半导体本体的第二表面下方并接触第一焊料的上端的第二导电层的下端。

5. 发明申请

US20110261015A1 OPTICAL TOUCH DISPLAY DEVICE 失效
标题翻译：光触摸显示设备
公开(公告)号：US20110261015A1
公开(公告)日：2011-10-27
申请号：US12916835
申请日：2010-11-01
申请人： CHIH-HUNG LU , Wei-Chung Wang , Hui-Hsuan Chen
发明人： CHIH-HUNG LU , Wei-Chung Wang , Hui-Hsuan Chen
IPC分类号： G06F3/042
CPC分类号： G06F3/0421
摘要： An optical touch device includes a display panel and at least a light emitting and receiving unit. The display panel includes a transparent substrate having a touch surface and a plurality of side surfaces adjacent to the touch surface. At least one of the side surfaces is a first light incidence surface and at least one of the side surfaces is a first light emitting surface. Each light emitting and receiving unit includes a linear light source and a light sensing component. The linear light source is disposed beside the first light incidence surface and is configured for providing optical signals into the transparent substrate. The light sensing component is disposed beside the first light emitting surface. The light sensing component is configured for receiving the optical signals from the linear light source. The optical touch display device has advantages of low cost.
摘要翻译：光学触摸装置包括显示面板和至少一个发光和接收单元。显示面板包括具有触摸表面和与触摸表面相邻的多个侧表面的透明基板。侧表面中的至少一个是第一光入射表面，并且至少一个侧表面是第一发光表面。每个发光和接收单元包括线性光源和光感测部件。线性光源设置在第一光入射面旁边，并且被配置为将光信号提供到透明基板中。光感测部件设置在第一光发射表面旁边。光感测部件被配置为从线性光源接收光信号。光触摸显示装置具有成本低的优点。

6. 发明授权

US07642132B2 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US07642132B2
公开(公告)日：2010-01-05
申请号：US11584546
申请日：2006-10-23
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L21/44
CPC分类号： H01L25/0657 , H01L21/76898 , H01L25/50 , H01L2224/05001 , H01L2224/05022 , H01L2224/05024 , H01L2224/05548 , H01L2224/05647 , H01L2224/05666 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2224/05099
摘要： The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer and the solder thereon are “inserted” into the space formed by the conductive layer of the lower semiconductor body, so as to enhance the joining between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.
摘要翻译：本发明涉及三维包装及其制造方法。该方法包括：（a）提供半导体本体; （b）在半导体本体中形成至少一个盲孔; （c）在盲孔的侧壁上形成隔离层; （d）在隔离层上形成导电层; （e）图案化导电层; （f）去除所述半导体主体的下表面的一部分和所述隔离层的一部分，以暴露所述导电层的一部分; （g）在导电层的下端形成焊料; （h）堆叠多个半导体体，进行回流处理; 和（i）切割堆叠的半导体本体，以便形成多个三维封装。因此，导电层的下端和其上的焊料被“插入”到由下半导体本体的导电层形成的空间中，以便增强导电层和焊料之间的接合，并且有效地减少加入后三维包装的整体高度。

7. 发明授权

US07528053B2 Three-dimensional package and method of making the same 有权
标题翻译：三维包装及其制作方法
公开(公告)号：US07528053B2
公开(公告)日：2009-05-05
申请号：US11645042
申请日：2006-12-26
申请人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
发明人： Min-Lung Huang , Wei-Chung Wang , Po-Jen Cheng , Kuo-Chung Yee , Ching-Huei Su , Jian-Wen Lo , Chian-Chi Lin
IPC分类号： H01L21/46 , H01L21/4763
CPC分类号： H01L25/0657 , H01L21/76898 , H01L25/50 , H01L2224/48145 , H01L2225/06506 , H01L2225/06524 , H01L2225/06541 , H01L2924/01019 , H01L2924/01078 , H01L2924/00012
摘要： A three-dimensional package and a method of making the same including providing a wafer; forming at least one blind hole in the wafer; forming an isolation layer on the side wall of the blind hole; forming a conductive layer on the isolation layer; forming a dry film on the conductive layer; filling the blind hole with metal; removing the dry film, and patterning the conductive layer; removing a part of the metal in the blind hole to form a space; removing a part of the second surface of the wafer and a part of the isolation layer, to expose a part of the conductive layer; forming a solder on the lower end of the conductive layer, the melting point of the solder is lower than the metal; stacking a plurality of the wafers, and performing a reflow process; and cutting the stacked wafers, to form three-dimensional packages.
摘要翻译：三维封装及其制造方法，包括提供晶片; 在晶片中形成至少一个盲孔; 在盲孔的侧壁上形成隔离层; 在隔离层上形成导电层; 在导电层上形成干膜; 用金属填充盲孔; 去除干膜，图案化导电层; 去除盲孔中的金属的一部分以形成空间; 去除所述晶片的所述第二表面的一部分和所述隔离层的一部分，以暴露所述导电层的一部分; 在导电层的下端形成焊料，焊料的熔点低于金属; 堆叠多个晶片，并进行回流处理; 并切割堆叠的晶片，以形成三维封装。

8. 发明授权

US07410886B2 Method for fabricating protective caps for protecting elements on a wafer surface 有权
标题翻译：制造用于保护晶片表面上的元件的保护帽的方法
公开(公告)号：US07410886B2
公开(公告)日：2008-08-12
申请号：US11164965
申请日：2005-12-13
申请人： Wei-Chung Wang
发明人： Wei-Chung Wang
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L23/04 , B81C1/00333 , B81C2203/0127 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of fabricating protective caps for protecting devices on wafer surface includes: (a) providing a non-metal cap substrate and forming a metal layer on the non-metal cap substrate; (b) forming a plurality of cavities on a surface of the metal layer, wherein the location of each cavity corresponds to each of the devices on the wafer surface; and (c) forming a protective cap in each cavity and forming a plurality of bonding media around the cavities.
摘要翻译：一种制造用于保护晶片表面上的器件的保护帽的方法包括：（a）提供非金属帽衬底并在非金属帽衬底上形成金属层; （b）在金属层的表面上形成多个空腔，其中每个空腔的位置对应于晶片表面上的每个器件; 和（c）在每个空腔中形成保护帽，并且在空腔周围形成多个粘合介质。

9. 发明授权

US07336259B2 Rechargeable wireless input device 失效
标题翻译：可充电无线输入设备
公开(公告)号：US07336259B2
公开(公告)日：2008-02-26
申请号：US11103992
申请日：2005-04-11
申请人： Tsu-Nan Li , Wei-Chung Wang , Yu-Wen Tseng
发明人： Tsu-Nan Li , Wei-Chung Wang , Yu-Wen Tseng
IPC分类号： H04B1/38 , H04M1/00
CPC分类号： G06F1/266 , G06F3/03543
摘要： An input device has a body and a battery that is retained in the body. A receiver is coupled to a computer via a cable, with the body removably engaging the receiver. The computer delivers power through the cable and the receiver to charge the battery, while the input device simultaneously transmits operational signals to the receiver for further transmission to the computer.
摘要翻译：输入装置具有保持在体内的主体和电池。接收器通过电缆耦合到计算机，其中身体可移除地接合接收器。计算机通过电缆和接收器提供电力为电池充电，而输入设备同时向接收器发送操作信号以进一步传输到计算机。

10. 发明授权

US08913034B2 Connector of connecting light sensor and substrate and method of fabricating light sensor 有权
标题翻译：连接光传感器和基板的连接器以及制造光传感器的方法
公开(公告)号：US08913034B2
公开(公告)日：2014-12-16
申请号：US12717927
申请日：2010-03-04
申请人： Wei-Chung Wang
发明人： Wei-Chung Wang
IPC分类号： G06F3/042 , H01L31/0203
CPC分类号： H01L31/0203 , G01J1/0295 , G01J1/0411 , G01J1/42 , G06F3/0428 , H01L31/02325 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/92125 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A connector of connecting a light sensor and a substrate is utilized for rotating the light sensor so that the light-receiving direction of the light sensor is parallel with the substrate. When the connector is utilized in an optical touch system, the light sensor can be disposed on the substrate of the optical touch system by means of general manufacturing facilities of flat display panels. Meanwhile, the light-receiving direction of the light sensor is parallel with the substrate of the optical touch system.
摘要翻译：连接光传感器和基板的连接器用于旋转光传感器，使得光传感器的光接收方向与基板平行。当在光学触摸系统中使用连接器时，光传感器可以通过平板显示面板的一般制造设备设置在光学触摸系统的基板上。同时，光传感器的光接收方向与光学触摸系统的基板平行。

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