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1. 发明授权

US06997785B1 Wafer planarization composition and method of use 失效
公开(公告)号：US06997785B1
公开(公告)日：2006-02-14
申请号：US11020287
申请日：2004-12-23
申请人： Christopher J. Rueb , Richard J. Webb , Bhaskar V. Velamakanni
发明人： Christopher J. Rueb , Richard J. Webb , Bhaskar V. Velamakanni
IPC分类号： B24B1/00
CPC分类号： C09G1/04 , H01L21/31053
摘要： A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

2. 发明授权

US07198560B2 Wafer planarization composition and method of use 失效
标题翻译：晶圆平面化组成及使用方法
公开(公告)号：US07198560B2
公开(公告)日：2007-04-03
申请号：US11287941
申请日：2005-11-28
申请人： Christopher J. Rueb , Richard J. Webb , Bhaskar V. Velamakanni
发明人： Christopher J. Rueb , Richard J. Webb , Bhaskar V. Velamakanni
IPC分类号： B24B29/00
CPC分类号： C09G1/04 , H01L21/31053
摘要： A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
摘要翻译：一种用于抛光包含氨基酸和钙离子或钡离子的晶片的晶片抛光溶液和方法。可以调整晶片抛光溶液以控制使用固定的研磨CMP工艺来修改半导体晶片的切割速率和选择性。

3. 发明授权

US07449124B2 Method of polishing a wafer 有权
标题翻译：抛光晶圆的方法
公开(公告)号：US07449124B2
公开(公告)日：2008-11-11
申请号：US11361873
申请日：2006-02-24
申请人： Richard J. Webb , John C. Clark , Christopher J. Rueb , John J. Gagliardi
发明人： Richard J. Webb , John C. Clark , Christopher J. Rueb , John J. Gagliardi
IPC分类号： C23F1/00 , H01L21/302
CPC分类号： C09G1/02 , B24B1/00 , B24B7/228 , B24D11/00 , H01L21/31053
摘要： A method for polishing a wafer comprising an aqueous solution having a pH in the range of 6 to 8, wherein the aqueous solution comprises at least one compound selected from the group consisting of a polymethacrylic acid, a polysulfonic acid, and combinations thereof, and wherein the compound is present in the range of 1.5 to 4 percent by weight of the aqueous solution. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
摘要翻译：一种用于抛光晶片的方法，所述方法包括pH在6至8范围内的水溶液，其中所述水溶液包含至少一种选自聚甲基丙烯酸，聚磺酸及其组合的化合物，并且其中该化合物以水溶液的1.5至4重量％的范围存在。可以调整晶片抛光溶液以控制使用固定的研磨CMP工艺来修改半导体晶片的切割速率和选择性。

4. 发明申请

US20120034426A1 ARTICLE AND METHOD FOR BONDING SUBSTRATES WITH LARGE TOPOGRAPHIES 审中-公开
标题翻译：用于将基板与大型地形结合的文章和方法
公开(公告)号：US20120034426A1
公开(公告)日：2012-02-09
申请号：US12850772
申请日：2010-08-05
申请人： Richard J. Webb , Wayne S. Mahoney , Eric G. Larson
发明人： Richard J. Webb , Wayne S. Mahoney , Eric G. Larson
IPC分类号： B32B3/30 , B32B38/00 , B32B37/02
CPC分类号： H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , Y10T156/10 , Y10T428/24612
摘要： The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.
摘要翻译：本发明是例如在晶片加工领域中有用的物品。该制品包括基底，平整层，接合层，光热转换层和临时载体。衬底具有从第一主表面延伸并且具有初始台阶高度的第一主表面，第二主表面和至少一个三维形貌特征。平整层定位成与第一主表面相邻并且将基底的形貌减小到初始台阶高度的约5％至约95％之间。接合层定位成与流平层相邻并进一步将衬底的形貌减小到小于初始台阶高度的约20％。光热转换层位于接合层附近，临时载体位于光热转换层附近。

5. 发明授权

US07950189B1 Modular in-wall medical services unit 有权
标题翻译：模块化内墙医疗服务单位
公开(公告)号：US07950189B1
公开(公告)日：2011-05-31
申请号：US12814986
申请日：2010-06-14
申请人： James A. Walker , Taylor C. Culpepper , Richard J. Webb , John R. Pierson
发明人： James A. Walker , Taylor C. Culpepper , Richard J. Webb , John R. Pierson
IPC分类号： E04F19/00
CPC分类号： A61G12/005 , E04F17/08 , E04H3/08
摘要： A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.
摘要翻译：用于医疗设施的模块化内墙医疗服务单元。框架支撑具有盖板的机柜，其提供电气和/或气体出口。内置电气和气体管道。接线盒和框架顶部附近的气体导管的端部可在墙板应用后进入。因此，在布线完成之前或之后可以安装墙板，并且进行气体连接。自对准盖板被“浮动地”支撑在框架上，使得在盖板被“贴合”到壁并固定之前，可以在边缘周围施加密封剂珠。盖板上的装饰法兰包括垂直设备安装轨道。通过使框架的高度可调，简化制造; 相同的框架元件可用于组装不同天花板高度的单元，减少库存中所需零件的数量并加快组装。

6. 发明申请

US20090115075A1 METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY 有权
标题翻译：使用层压体制造薄基板的方法
公开(公告)号：US20090115075A1
公开(公告)日：2009-05-07
申请号：US12336994
申请日：2008-12-17
申请人： Carl R. KESSEL , Larry D. Boardman , Richard J. Webb
发明人： Carl R. KESSEL , Larry D. Boardman , Richard J. Webb
IPC分类号： H01L21/302 , B32B9/04 , H01L23/28
CPC分类号： B32B37/12 , B24B7/228 , B32B2310/0806 , B32B2457/14 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , Y10T428/31663
摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
摘要翻译：提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

7. 发明授权

US07775000B2 Modular in-wall medical services unit 有权
标题翻译：模块化内墙医疗服务单位
公开(公告)号：US07775000B2
公开(公告)日：2010-08-17
申请号：US10100768
申请日：2002-03-19
申请人： James A. Walker , Taylor C. Culpepper , Richard J. Webb , John R. Pierson
发明人： James A. Walker , Taylor C. Culpepper , Richard J. Webb , John R. Pierson
IPC分类号： E04B7/18
CPC分类号： A61G12/005 , E04F17/08 , E04H3/08
摘要： A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.
摘要翻译：用于医疗设施的模块化内墙医疗服务单元。框架支撑具有盖板的机柜，其提供电气和/或气体出口。内置电气和气体管道。接线盒和框架顶部附近的气体导管的端部可在墙板应用后进入。因此，在布线完成之前或之后可以安装墙板，并且进行气体连接。自对准盖板被“浮动地”支撑在框架上，使得在盖板被“贴合”到壁并固定之前，可以在边缘周围施加密封剂珠。盖板上的装饰法兰包括垂直设备安装轨道。通过使框架的高度可调，简化制造; 相同的框架元件可用于组装不同天花板高度的单元，减少库存中所需零件的数量并加快组装。

8. 发明授权

US6007407A Abrasive construction for semiconductor wafer modification 失效
标题翻译：用于半导体晶片修改的磨料结构
公开(公告)号：US6007407A
公开(公告)日：1999-12-28
申请号：US915058
申请日：1997-08-20
申请人： Denise R. Rutherford , Douglas P. Goetz , Cristina U. Thomas , Richard J. Webb , Wesley J. Bruxvoort , James D. Buhler , William J. Hollywood
发明人： Denise R. Rutherford , Douglas P. Goetz , Cristina U. Thomas , Richard J. Webb , Wesley J. Bruxvoort , James D. Buhler , William J. Hollywood
IPC分类号： B24D11/02 , B24B37/22 , B24B37/24 , B24D3/00 , B24D3/28 , B24D3/34 , B24D11/00 , B24D13/14 , B24B5/00
CPC分类号： B24B37/245 , B24B37/22 , B24D3/001 , B24D3/28
摘要： An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
摘要翻译：用于改变诸如半导体晶片的工件的表面的研磨结构。研磨结构包括：三维，有纹理，固定的研磨元件; 至少一个与所述固定研磨元件共同延伸的弹性元件; 以及至少一个与弹性元件和固定研磨元件共同延伸并插入其中的刚性元件，其中刚性元件的杨氏模量大于弹性元件的杨氏模量。

9. 发明授权

US5958794A Method of modifying an exposed surface of a semiconductor wafer 失效
标题翻译：修改半导体晶片的暴露表面的方法
公开(公告)号：US5958794A
公开(公告)日：1999-09-28
申请号：US694014
申请日：1996-08-08
申请人： Wesley J. Bruxvoort , Scott R. Culler , Kwok-Lun Ho , David A. Kaisaki , Carl R. Kessel , Thomas P. Klun , Heather K. Kranz , Robert P. Messner , Richard J. Webb , Julia P. Williams
发明人： Wesley J. Bruxvoort , Scott R. Culler , Kwok-Lun Ho , David A. Kaisaki , Carl R. Kessel , Thomas P. Klun , Heather K. Kranz , Robert P. Messner , Richard J. Webb , Julia P. Williams
IPC分类号： B24B1/00 , B24B7/22 , B24B21/04 , B24B37/04 , B24B53/007 , B24B53/017 , B24D3/00 , B24D3/02 , B24D3/28 , B24D11/00 , H01L21/304 , H01L21/3105 , H01L21/302
CPC分类号： B24B53/017 , B24B21/04 , B24B37/042 , B24B7/228 , B24D11/00 , B24D3/28 , H01L21/31053
摘要： A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:(a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and(b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.
摘要翻译：一种修改半导体晶片的暴露表面的方法，其包括以下步骤：（a）使所述表面与具有三维纹理磨料表面的固定磨料制品接触，所述磨料制品包括多个研磨颗粒和粘合剂一个预先确定的模式; 和（b）相对移动所述晶片和所述固定磨料制品以修改所述晶片的所述表面。

10. 发明授权

US5219462A Abrasive article having abrasive composite members positioned in recesses 失效
标题翻译：具有定位在凹槽中的研磨复合构件的磨料制品
公开(公告)号：US5219462A
公开(公告)日：1993-06-15
申请号：US819755
申请日：1992-01-13
申请人： Wesley J. Bruxvoort , Clyde D. Calhoun , Richard J. Webb
发明人： Wesley J. Bruxvoort , Clyde D. Calhoun , Richard J. Webb
IPC分类号： B24D3/00 , B24D3/28 , B24D11/00
CPC分类号： B24D11/00 , B24D3/002 , B24D3/28
摘要： The present invention provides an abrasive article that has abrasive composite members secured firmly in recesses in a backing sheet in a precise pattern whereby there is desired lateral spacing between each abrasive composite member. The present invention also provides a method for preparing the abrasive article comprising the steps of providing an embossed backing sheet having a plurality of recesses in the front surface of the backing sheet. The recesses are filled with an abrasive slurry that includes a plurality of abrasive grains dispersed in a binder precursor. An expanding agent is also provided in the recesses, either separate from the slurry or dispersed in the slurry. The expanding agent, when activated, expands the abrasive slurry outward and above the front surface of the embossed backing sheet. After the binder precursor of the abrasive slurry is hardened, individual abrasive composite members extend above the front surface of the embossed backing sheet. An alternative embodiment provides recesses that extend completely through the embossed backing sheet, so that abrasive composite members protrude from the front surface and from the back surface of the embossed backing sheet.
摘要翻译：本发明提供了一种磨料制品，其具有以精确图案牢固地固定在底片中的凹部中的磨料复合构件，由此在每个磨料复合构件之间存在期望的横向间隔。本发明还提供了一种制备磨料制品的方法，包括以下步骤：提供在背衬片的前表面中具有多个凹槽的压纹背衬片。凹部填充有包含分散在粘合剂前体中的多个磨料颗粒的磨料浆料。还可以在凹槽中提供发泡剂，或者与浆料分离或分散在浆料中。膨胀剂在被活化时，将研磨浆料向外凸出并压印在背衬片的前表面上方。在研磨浆料的粘合剂前体硬化之后，各个研磨复合材料部件在压花背衬片材的前表面之上延伸。替代实施例提供了完全延伸穿过压花背衬片的凹部，使得磨料复合构件从压花背衬片的前表面和后表面突出。

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