专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090127712A1 NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE 有权
标题翻译：基于纳米线的导向粘合剂
公开(公告)号：US20090127712A1
公开(公告)日：2009-05-21
申请号：US11718713
申请日：2005-11-04
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01L23/52 , C09J9/02 , C09J11/04 , H01L21/00 , C09J7/00
CPC分类号： H05K3/323 , B82Y10/00 , B82Y30/00 , C09J7/10 , C09J9/02 , C09J11/04 , C09J2201/602 , H01L2924/0002 , H05K2201/026 , H05K2201/0323 , Y10T428/24 , H01L2924/00
摘要： A tape adhesive type material is directionally conductive. According to an example embodiment of the present invention, carbon nanotubes (212, 214, 216, 218) are configured in a generally parallel arrangement in a tape base type material (210). The carbon nanotubes conduct (e.g., electrically and/or thermally) in their generally parallel direction and the tape base type material inhibits conduction in a generally lateral direction. In some implementations, the tape base material is arranged between integrated circuit components (220, 230), with the carbon nanotubes making a conductive connection there between. This approach is applicable to coupling a variety of components together, such as integrated circuit dies (flip chip and conventional dies) to package substrates, to each other and/or to leadframes.
摘要翻译：带状粘合剂型材料是定向导电的。根据本发明的示例性实施例，碳纳米管（212,214,216,218）以大致平行的布置配置在带基型材料（210）中。碳纳米管在其大致平行的方向上导电（例如，电和/或热），并且带基型材料在大体上横向方向上抑制传导。在一些实施方案中，带基材料布置在集成电路部件（220,230）之间，碳纳米管之间形成导电连接。该方法适用于将各种组件（诸如集成电路管芯（倒装芯片和常规裸片））耦合到封装衬底，彼此和/或引线框架。

2. 发明申请

US20080211112A1 Carbon Nanotube Bond Pad Structure and Method Therefor 有权
标题翻译：碳纳米管焊盘结构及其方法
公开(公告)号：US20080211112A1
公开(公告)日：2008-09-04
申请号：US11910046
申请日：2006-03-27
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01L23/52 , H01L21/4763
CPC分类号： H01L24/05 , H01L23/5226 , H01L23/53276 , H01L24/03 , H01L24/48 , H01L2224/04042 , H01L2224/05093 , H01L2224/05096 , H01L2224/05624 , H01L2224/05647 , H01L2224/45015 , H01L2224/48463 , H01L2224/859 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01058 , H01L2924/01082 , H01L2924/01083 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , Y10S977/742 , Y10S977/932 , H01L2224/45099 , H01L2924/00
摘要： A bond pad structure (300) for an integrated circuit (IC) device uses carbon nanotubes to increase the strength and resilience of wire bonds (360). In an example embodiment there is, a bond pad structure (300) on an IC substrate, the bond pad structure comprises, a first conductive layer (310) having a top surface and a bottom surface, the bottom surface attached to the IC substrate. A dielectric layer (320) is deposited on the top surface of the first conductive layer (310), the dielectric layer having an array of vias (325), the array of vias filled with a carbon nanotube material (325), the carbon nanotube material (325) is electrically coupled to the first conductive layer (310). There is a second conductive layer (330) having a top surface and a bottom surface, the bottom surface of the second conductive layer is electrically coupled to the carbon nanotube material (325). A feature of this embodiment may include the first (410,510) or second (430, 530) conductive layer being comprised of carbon nanotube material, as well.
摘要翻译：用于集成电路（IC）器件的接合焊盘结构（300）使用碳纳米管来增加引线键合的强度和弹性（360）。在一个示例性实施例中，在IC衬底上存在接合焊盘结构（300），所述接合焊盘结构包括具有顶表面和底表面的第一导电层（310），所述底表面附接到所述IC衬底。介电层（320）沉积在第一导电层（310）的顶表面上，介电层具有通孔阵列（325），填充有碳纳米管材料（325）的通孔阵列，碳纳米管材料（325）电耦合到第一导电层（310）。存在具有顶表面和底表面的第二导电层（330），第二导电层的底表面电耦合到碳纳米管材料（325）。该实施例的特征还可以包括由碳纳米管材料构成的第一（410,510）或第二（430,530）导电层。

3. 发明申请

US20060180916A1 Ground arch for wirebond ball grid arrays 有权
标题翻译：导轨焊接网格阵列
公开(公告)号：US20060180916A1
公开(公告)日：2006-08-17
申请号：US10565044
申请日：2004-07-30
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L24/73 , H01L23/04 , H01L23/3672 , H01L23/49816 , H01L23/50 , H01L23/552 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/91 , H01L2223/6611 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/484 , H01L2224/48599 , H01L2224/73221 , H01L2224/73229 , H01L2224/73265 , H01L2224/85201 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/1617 , H01L2924/163 , H01L2924/166 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device (100) comprising an integrated circuit (130) having a plurality (115) of grounding pads, signal pads, and power pads and a package (110) for mounting the integrated circuit and includes a conductive path having at least one reference trace (140) that surrounds the integrated circuit. A grounding arch (170) formed by a dielectric-coated metal tape is disposed over the integrated circuit and connected to its ground pad in order to provide heat dissipation and EMI shielding.
摘要翻译：一种结构提供了对键合线阻抗的控制。在示例实施例中，存在集成电路设备（100），其包括具有多个（115）接地焊盘，信号焊盘和电源焊盘的集成电路（130）和用于安装集成电路的封装（110），并且包括具有围绕集成电路的至少一个参考迹线（140）的导电路径。由电介质涂覆的金属带形成的接地拱（170）设置在集成电路上并连接到其接地垫，以提供散热和EMI屏蔽。

4. 发明授权

US08681500B2 Integrated circuit nanotube-based subsrate 有权
标题翻译：集成电路纳米管为基础
公开(公告)号：US08681500B2
公开(公告)日：2014-03-25
申请号：US11718710
申请日：2005-11-04
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H05K1/056 , B82Y10/00 , H01L23/14 , H01L23/3128 , H01L23/373 , H01L23/49827 , H01L24/48 , H01L2224/32225 , H01L2224/48227 , H01L2224/48237 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K1/0206 , H05K2201/026 , H05K2201/0323 , Y10T29/49117 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners to provide structural support and/or thermal conductivity. In some instances, the carbon nanotube structure is arranged to provide substantially all structural support for an integrated circuit arrangement. In other instances, the carbon nanotube structure is arranged to dissipate heat throughout the substrate. In still other instances, the carbon nanotube structure is arranged to remove heat from selected portions of the carbon nanotube substrate.
摘要翻译：碳纳米管材料用于集成电路基板。根据示例性实施例，集成电路装置（100）包括其中具有碳纳米管结构（120）的衬底（110）。碳纳米管结构以各种方式中的一种或多种配置以提供结构支持和/或导热性。在一些情况下，碳纳米管结构被布置成为集成电路装置提供基本上所有的结构支撑。在其他情况下，碳纳米管结构被布置成在整个基板上散热。在其他情况下，碳纳米管结构被布置成从碳纳米管基底的选定部分去除热量。

5. 发明申请

US20090301757A1 METHOD AND SYSTEM FOR COMPOSITE BOND WIRES 有权
标题翻译：复合粘结线的方法和系统
公开(公告)号：US20090301757A1
公开(公告)日：2009-12-10
申请号：US12302492
申请日：2007-05-25
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01B5/00 , B05D5/12 , H01B1/22
CPC分类号： C22C1/1036 , B22F2998/00 , H01L23/66 , H01L24/43 , H01L24/45 , H01L24/73 , H01L2223/6611 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45186 , H01L2224/45198 , H01L2224/45244 , H01L2224/45386 , H01L2224/45387 , H01L2224/45565 , H01L2224/4557 , H01L2224/45572 , H01L2224/456 , H01L2224/45644 , H01L2224/45647 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , Y10S505/704 , Y10S505/74 , Y10S505/813 , Y10T428/12056 , Y10T428/2942 , Y10T428/2949 , B22F5/12 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/01049 , H01L2924/01006
摘要： Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals.
摘要翻译：用于集成电路的接合线使用各种方法来实现。使用一种这样的方法，制造用于集成电路的复合键合线。将导电材料熔融并与尺寸小于100微米的颗粒材料混合以产生混合物。该混合物用于生成复合键合线。还提供了具有内芯和具有比内芯更高的导电性的外层的复合线。外层设计为比用于承载交流信号的工作频率处的皮肤深度更厚。

6. 发明申请

US20080266028A1 Enhanced Substrate Using Metamaterials 有权
标题翻译：增强基板使用超材料
公开(公告)号：US20080266028A1
公开(公告)日：2008-10-30
申请号：US12097128
申请日：2006-12-15
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01P3/08 , G06F17/50
CPC分类号： H01Q15/0086 , H01L23/64 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H05K1/0236 , H01L2924/00
摘要： In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate (10) is configured as a meta-material. The meta-material provides noise protection for a signal line (15) having a pre-determined length disposed on the meta-material. The substrate comprises a dielectric material (2, 4, 6) having a topside surface and an underside surface. A conductive material (30) is arranged into pre-determined shapes (35) having a collective length. Dielectric material envelops the conductive material and the conductive material is disposed at a first predetermined distance (55) from the topside surface and at a second predetermined distance from the underside surface. The collective length of the conductive material (30) is comparable to the pre-determined length of the signal line (15).
摘要翻译：通过包装提高信号质量，可以使用超材料。元材料被设计成使信号的作用方式使得信号的形状表现得如同介电常数和磁导率不同于使用的绝缘体的实际介电常数和磁导率。在示例性实施例中，衬底（10）被配置为超常材料。超临界材料为具有设置在超常材料上的预定长度的信号线（15）提供噪声保护。衬底包括具有顶侧表面和下表面的电介质材料（2,4,6）。导电材料（30）被布置成具有共同长度的预定形状（35）。电介质材料包围导电材料，并且导电材料设置在与顶侧表面相距第一预定距离（55）处并且距离下表面第二预定距离。导电材料（30）的总长度与信号线（15）的预定长度相当。

7. 发明申请

US20060125079A1 High density package interconnect wire bond strip line and method therefor 审中-公开
标题翻译：高密度封装互连线接线条及其方法
公开(公告)号：US20060125079A1
公开(公告)日：2006-06-15
申请号：US10537666
申请日：2003-12-04
申请人： Chris Wyland , Wayne Nunn
发明人： Chris Wyland , Wayne Nunn
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L23/66 , H01L24/45 , H01L24/49 , H01L2223/6611 , H01L2223/6627 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/4903 , H01L2224/49051 , H01L2224/49176 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/0101 , H01L2924/01013 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01054 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/1903 , H01L2924/19033 , H01L2924/20752 , H01L2924/3011 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： In an example embodiment, an integrated circuit (105) is placed in a package (100), the package having signal pad connections, power connections, and ground connections. A lower strip line (110) is bonded by coupling a first ground connection (110a) of the IC (105) to a first package substrate ground connection (110b). After bonding the lower strip line, a plurality of wires (125) is bonded by a plurality of signal pads (125a) on a device die (105) being coupled to signal pad connections (125b) on the package substrate (100), the plurality of signal pads (125a) being in proximity to the first ground connection (110a) and the plurality of wires (125) maintained at a first predetermined distance from the lower strip line (110). After bonding the plurality of wires (125), an upper strip line (130) is bonded by coupling a second ground connection (130a) of the IC (105) with a second package substrate ground connection (130b), the upper strip line maintained at a second predetermined distance from the plurality of wires (125).
摘要翻译：在示例性实施例中，集成电路（105）被放置在封装（100）中，封装具有信号焊盘连接，电源连接和接地连接。通过将IC（105）的第一接地连接（110a）耦合到第一封装衬底接地连接（110b）来将下带状线（110）接合。在接合下带状线之后，多个导线（125）通过耦合到封装衬底（100）上的信号焊盘连接（125b）的器件管芯（105）上的多个信号焊盘（125a）接合，所述多个信号焊盘（125a）处于靠近所述第一接地连接（110a）并且所述多根电线（125）保持在距离所述下带状线（110）的第一预定距离处。在结合多个电线（125）之后，通过将IC（105）的第二接地连接（130a）与第二封装衬底接地连接（130b）耦合来接合上带状线（130），上带线保持在距离多个电线（125）的第二预定距离处。

8. 发明授权

US08848372B2 Nanotube-based fluid interface material and approach 有权
标题翻译：基于纳米管的流体界面材料和方法
公开(公告)号：US08848372B2
公开(公告)日：2014-09-30
申请号：US11718714
申请日：2005-11-04
申请人： Chris Wyland , Hendrikus Johannes Jacobus Thoonen
发明人： Chris Wyland , Hendrikus Johannes Jacobus Thoonen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34 , H01L23/373 , C09K5/10 , B82Y10/00
CPC分类号： B82Y10/00 , C09K5/10 , H01L23/373 , H01L2924/0002 , H01L2924/00
摘要： A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.
摘要翻译：热界面材料有助于集成电路器件和导热器件之间的热传递。根据示例性实施例，热界面材料包括增强其导热性的碳纳米管材料。界面材料在集成电路器件和导热器件之间流动。碳纳米管材料将热量从集成电路器件传导到导热器件。

9. 发明申请

US20090102067A1 ELECTRICALLY ENHANCED WIREBOND PACKAGE 有权
标题翻译：电加强线束包装
公开(公告)号：US20090102067A1
公开(公告)日：2009-04-23
申请号：US12294211
申请日：2007-03-23
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01L23/52 , H01L21/00 , H01L23/495 , H01L21/58 , H01L23/31
CPC分类号： H01L24/49 , H01L23/3128 , H01L23/3135 , H01L23/49517 , H01L23/4952 , H01L23/49558 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/91 , H01L2223/6611 , H01L2224/24226 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/4903 , H01L2224/49051 , H01L2224/49175 , H01L2224/73277 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/3011 , H01L2924/01004 , H01L2924/00011 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device (100) mounted onto a die attachment area (10); the semiconductor device has a plurality of bonding pads (20a, 25a, 30a, 35a). A lead frame having a plurality of bonding fingers (20b, 25b, 30b, 35b) surrounds the die attachment area. A plurality of mutually isolated connection conductors (25d, 30d, 40, 50) having respective first ends are attached to respective bonding pads on the semiconductor device and the plurality of mutually isolated connection conductors having respective second respective second ends are attached to respective bonding fingers of the lead frame. An insulating material (45) coats at least a portion of the plurality of mutually isolated connection conductors. The mutually isolated connection conductors may include a bond wire (40,50) for the signal connection and a conductive strap (25d,30d) for the voltage reference connection. The insulating material (45) coating the bond wires reduces the likelihood of short circuits during encapsulation.
摘要翻译：与示例性实施例一致，在具有电绝缘连接的封装中存在集成电路（IC）装置。 IC器件包括安装在管芯附接区域（10）上的半导体器件（100）。半导体器件具有多个接合焊盘（20a，25a，30a，35a）。具有多个接合指（20b，25b，30b，35b）的引线框围绕管芯附接区域。具有各自的第一端的多个相互隔离的连接导体（25d，30d，40,50）附接到半导体器件上的各个焊盘，并且具有各自的第二相应的第二端的多个相互隔离的连接导体被附接到相应的接合指的引线框架。绝缘材料（45）涂覆多个相互隔离的连接导体的至少一部分。相互隔离的连接导体可以包括用于信号连接的接合线（40,50）和用于电压参考连接的导电带（25d，30d）。涂覆接合线的绝缘材料（45）降低了封装期间短路的可能性。

10. 发明申请

US20060049505A1 High density interconnect power and ground strap and method therefor 审中-公开
标题翻译：高密度互连电源和接地带及其方法
公开(公告)号：US20060049505A1
公开(公告)日：2006-03-09
申请号：US10537674
申请日：2003-12-04
申请人： Chris Wyland
发明人： Chris Wyland
IPC分类号： H01L23/48
CPC分类号： H01L24/85 , H01L23/49811 , H01L23/49816 , H01L23/50 , H01L23/585 , H01L23/645 , H01L23/66 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/84 , H01L24/91 , H01L2223/6611 , H01L2224/05554 , H01L2224/05644 , H01L2224/37147 , H01L2224/40225 , H01L2224/45015 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/484 , H01L2224/49 , H01L2224/73221 , H01L2224/73229 , H01L2224/85 , H01L2224/92 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/20752 , H01L2924/30107 , H01L2924/3011 , H01L2224/83 , H01L2224/84 , H01L2924/20655 , H01L2224/78 , H01L2924/00 , H01L2224/45099
摘要： One aspect of the present invention relates to reducing the impedance of the paths connecting the power or ground of a device and a BGA package. In a particular example implementation, impedance of the signal bond wires is controlled by placing a ground strap (130) at a predetermined distance from the signal bond wires (115). In a related example embodiment, a low impedance power or ground connection is made between a device die (140) and package in close proximity to wire bonds (115). An integrated circuit (140) includes a plurality of grounding pads, signal pads, power pads and a package for mounting the integrated circuit. The package (100) comprises a plurality of pad landings (110), a grounding ring (105) surrounding the integrated circuit (140); and a grounding strap (130) coupling the grounding ring (105) to the grounding pads (120) of the integrated circuit.
摘要翻译：本发明的一个方面涉及降低连接设备的功率或接地和BGA封装的路径的阻抗。在特定示例实施例中，通过将接地带（130）放置在距离信号接合线（115）预定距离处来控制信号接合线的阻抗。在相关的示例性实施例中，在器件管芯（140）和紧密接合引线接合（115）之间的封装件之间进行低阻抗功率或接地连接。集成电路（140）包括多个接地焊盘，信号焊盘，电源焊盘和用于安装集成电路的封装。封装（100）包括多个焊盘平台（110），围绕集成电路（140）的接地环（105）; 以及将接地环（105）耦合到集成电路的接地焊盘（120）的接地带（130）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式