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    • 5. 发明申请
    • Thermal Fluid-Ejection Echanism Having Heating Resistor On Cavity Sidewalls
    • 在腔侧壁上具有加热电阻的热流体喷射机构
    • US20130286104A1
    • 2013-10-31
    • US13978571
    • 2011-01-31
    • Peter MardilovichLawrence H. WhiteEric D. Torniainen
    • Peter MardilovichLawrence H. WhiteEric D. Torniainen
    • B41J2/05
    • B41J2/05B41J2/1412B41J2/14129B41J2/1603B41J2/1626B41J2002/14387
    • A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.
    • 热流体喷射机构包括具有顶表面的基板。 在衬底内形成的空腔具有一个或多个侧壁和底板。 来自地板的侧壁的角度大于或等于标称九十度。 热流体喷射机构包括在基板的顶表面和空腔的侧壁的一个或多个上的图案化导电层。 热流体喷射机构包括在腔的侧壁上的图案化电阻层。 图案化电阻层位于图案化导电层上方,其中图案化的导电层形成在空腔的侧壁上。 图案化电阻层形成为热流体喷射机构的加热电阻器。 导电层形成为热流体喷射机构的导体,以允许加热电阻器的电激活以使流体从热流体喷射机构喷出。