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1. 发明申请

US20140008586A1 Conductive Ink Composition for Offset or Reverse-Offset Printing 审中-公开
标题翻译：用于偏移或反向偏移印刷的导电油墨组合物
公开(公告)号：US20140008586A1
公开(公告)日：2014-01-09
申请号：US13976572
申请日：2012-02-24
申请人： Choong-Hoon Paik , Won IL Son , Seok Heon Oh , Eui Duk Kim
发明人： Choong-Hoon Paik , Won IL Son , Seok Heon Oh , Eui Duk Kim
IPC分类号： C09D11/00
CPC分类号： H05K3/1275 , B41F16/00 , C09D11/033 , C09D11/037 , C09D11/102 , C09D11/103 , C09D11/52 , H05K1/097
摘要： There is provided a conductive ink composition for offset or reverse-offset printing, the conductive ink composition including a high boiling point solvent having a boiling point of 180 to 250° C. and a dispersion assistant solvent having a boiling point of 50 to 150° C., together with metal particles and tert-butyl alcohol as a main solvent.
摘要翻译：提供了一种用于偏移或反胶印的导电油墨组合物，该导电油墨组合物包括沸点为180-250℃的沸点高沸点溶剂和沸点为50-150℃的分散助溶剂 C.与金属颗粒和叔丁醇一起作为主要溶剂。

2. 发明授权

US09318233B2 Method for manufacturing conductive metal thin film using carboxylic acid 有权
标题翻译：使用羧酸制造导电金属薄膜的方法
公开(公告)号：US09318233B2
公开(公告)日：2016-04-19
申请号：US13503908
申请日：2010-10-26
申请人： Won Il Son , Sun Jin Park , Eui Duk Kim , Seok Heon Oh , Joo Ho Moon , Kyoo Hee Woo , Dong Jo Kim
发明人： Won Il Son , Sun Jin Park , Eui Duk Kim , Seok Heon Oh , Joo Ho Moon , Kyoo Hee Woo , Dong Jo Kim
IPC分类号： B05D5/12 , H01B1/22 , B22F3/22 , B22F3/24 , B82Y30/00 , C09C1/62 , C09D5/24 , C09D7/12 , C09D11/52 , C08K3/08 , C08K9/04
CPC分类号： H01B1/22 , B22F3/22 , B22F3/24 , B22F2998/10 , B82Y30/00 , C01P2004/03 , C01P2004/64 , C01P2006/40 , C08K3/08 , C08K9/04 , C09C1/62 , C09C1/627 , C09D5/24 , C09D7/62 , C09D11/52 , B22F2001/0092 , B22F3/1021 , B22F3/105 , B22F2003/241
摘要： The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.
摘要翻译：导电金属薄膜的制造方法技术领域本发明涉及导电性金属薄膜的制造方法，其特征在于，包括：在具有核/壳结构的导电性金属粒子的分散体中添加羧酸，将导电性金属涂布液涂布在基板的顶部，进行热处理，除去具有核/壳结构的导电性金属粒子的表面的金属氧化物层; 以及形成去除了金属氧化物层的导电金属颗粒的薄膜。

3. 发明授权

US09028724B2 Method for preparing water-soluble nanoparticles and their dispersions 有权
标题翻译：制备水溶性纳米粒子及其分散体的方法
公开(公告)号：US09028724B2
公开(公告)日：2015-05-12
申请号：US13395827
申请日：2010-09-14
申请人： Won Il Son , Eui Duk Kim , Seok Heon Oh
发明人： Won Il Son , Eui Duk Kim , Seok Heon Oh
IPC分类号： H01B1/12 , C09C3/10 , C09C1/62 , C09C1/64 , C09D11/322 , C09D11/52
CPC分类号： C09C3/10 , C01P2002/84 , C01P2004/04 , C09C1/62 , C09C1/627 , C09C1/644 , C09D11/322 , C09D11/52
摘要： Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.
摘要翻译：本发明提供了通过改性具有亲水基团的疏水基团的金属纳米粒子的表面，制备具有优异分散性并在低温下烧结的金属纳米颗粒的水性分散体的方法。具体地说，通过用含有表面活性剂和润湿分散剂的表面改性溶液处理金属纳米颗粒的表面疏水性基团，处理量可以提高约10倍，并且颗粒可以单分散而不凝聚。此外，通过在溶液中使用抗氧化剂和配体去除剂，可以防止颗粒的变性和氧化，并且可以有效地消除高沸点疏水性配体。亲水处理的金属纳米颗粒可以分散在水基溶剂中以制备在低温下可烧结的金属油墨。

4. 发明申请

US20120219703A1 Method for Manufacturing Conductive Metal Thin Film Using Carboxylic Acid 有权
标题翻译：使用羧酸制造导电金属薄膜的方法
公开(公告)号：US20120219703A1
公开(公告)日：2012-08-30
申请号：US13503908
申请日：2010-10-26
申请人： Won Il Son , Sun Jin Park , Eui Duk Kim , Seok Heon Oh , Joo Ho Moon , Kyoo Hee Woo , Dong Jo Kim
发明人： Won Il Son , Sun Jin Park , Eui Duk Kim , Seok Heon Oh , Joo Ho Moon , Kyoo Hee Woo , Dong Jo Kim
IPC分类号： B05D5/12 , B05D3/02
CPC分类号： H01B1/22 , B22F3/22 , B22F3/24 , B22F2998/10 , B82Y30/00 , C01P2004/03 , C01P2004/64 , C01P2006/40 , C08K3/08 , C08K9/04 , C09C1/62 , C09C1/627 , C09D5/24 , C09D7/62 , C09D11/52 , B22F2001/0092 , B22F3/1021 , B22F3/105 , B22F2003/241
摘要： The present invention relates to a method for manufacturing a conductive metal thin film, including: preparing a conductive metal coating solution by adding carboxylic acid to a dispersion including a conductive metal particle having a core/shell structure; coating the conductive metal coating solution on a top portion of a substrate, heat-treating it, and removing an metal oxide layer of the surface of the conductive metal particle having the core/shell structure; and forming a thin film of the conductive metal particle from which the metal oxide layer is removed.
摘要翻译：导电金属薄膜的制造方法技术领域本发明涉及导电性金属薄膜的制造方法，其特征在于，包括：在具有核/壳结构的导电性金属粒子的分散体中添加羧酸，将导电性金属涂布液涂布在基板的顶部，进行热处理，除去具有核/壳结构的导电性金属粒子的表面的金属氧化物层; 以及形成去除了金属氧化物层的导电金属颗粒的薄膜。

5. 发明申请

US20120168692A1 Method for Preparing Water-Soluble Nanoparticles and Their Dispersions 有权
标题翻译：制备水溶性纳米粒子及其分散体的方法
公开(公告)号：US20120168692A1
公开(公告)日：2012-07-05
申请号：US13395827
申请日：2010-09-14
申请人： Won Son, II , Eui Duk Kim , Seok Heon Oh
发明人： Won Son, II , Eui Duk Kim , Seok Heon Oh
IPC分类号： H01B1/02 , B82Y30/00 , B82Y40/00
CPC分类号： C09C3/10 , C01P2002/84 , C01P2004/04 , C09C1/62 , C09C1/627 , C09C1/644 , C09D11/322 , C09D11/52
摘要： Provided is a method for preparing an aqueous dispersion of metal nanoparticles having superior dispersibility and being sinterable at low temperature by modifying the surface of metal nanoparticles having hydrophobic groups with hydrophilic groups. Specifically, by treating the surface hydrophobic groups of the metal nanoparticles with a surface modification solution containing a surfactant and a wetting-dispersing agent, the treatment throughput can be improved about 10-fold and the particles can be monodispersed without agglomeration. Further, by using an antioxidant and a ligand removal agent in the solution, denaturation and oxidation of the particles can be prevented and the high-boiling-point hydrophobic ligands can be eliminated effectively. The hydrophilically treated metal nanoparticles may be dispersed in an aqueous-based solvent to prepare a metal ink sinterable at low temperature.
摘要翻译：本发明提供了通过改性具有亲水基团的疏水基团的金属纳米粒子的表面，制备具有优异分散性并在低温下烧结的金属纳米颗粒的水性分散体的方法。具体地说，通过用含有表面活性剂和润湿分散剂的表面改性溶液处理金属纳米颗粒的表面疏水性基团，处理量可以提高约10倍，并且颗粒可以单分散而不凝聚。此外，通过在溶液中使用抗氧化剂和配体去除剂，可以防止颗粒的变性和氧化，并且可以有效地消除高沸点疏水性配体。亲水处理的金属纳米颗粒可以分散在水基溶剂中以制备在低温下可烧结的金属油墨。

6. 发明申请

US20090130339A1 Method for Preparing Electroconductive Particles with Improved Dispersion and Adherence 审中-公开
标题翻译：制备具有改进的分散性和粘附性的导电颗粒的方法
公开(公告)号：US20090130339A1
公开(公告)日：2009-05-21
申请号：US11991726
申请日：2006-10-13
申请人： Won Il Son , Dong Ok Kim , Jeong Hee Jin , Seok Heon Oh
发明人： Won Il Son , Dong Ok Kim , Jeong Hee Jin , Seok Heon Oh
IPC分类号： C23C18/54 , B06B1/20
CPC分类号： C23C18/1666 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/34
摘要： The present invention relates to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, and, more particularly, to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, using an electroless plating method of forming a metal plating layer on the surface of a base material made of resin powder in an electroless plating solution, wherein an ultrasonic treatment is performed at the time of forming the plating layer. The present invention has advantages in that an aggregation phenomenon, which is generated when the base material made of the resin powder is plated using an electroless plating method, does not occur and a plating reaction can be performed at low temperature, so that it is possible to obtain a compact plating layer and plating powder having improved uniformity and adherence with respect to resin powder. Further, the present invention, unlike the conventional technique, has advantages in that post-treatment processes are not performed and a plating reaction is performed at low temperature, so that the process operating cost is reduced and the processes are made simple.
摘要翻译：本发明涉及一种具有优异的分散性和粘附性的导电化学镀粉末的制造方法，更具体地说，涉及使用形成金属镀层的化学镀方法制造具有优异的分散性和粘附性的导电化学镀粉末的方法在化学镀溶液中的由树脂粉末制成的基材的表面上，在形成镀层时进行超声波处理。本发明的优点在于，不会发生使用无电解镀法对由树脂粉末制成的基材产生的聚集现象，并且可以在低温下进行电镀反应，以获得相对于树脂粉末具有改善的均匀性和粘附性的致密的电镀层和电镀粉末。此外，本发明与传统技术不同，其优点在于不进行后处理工艺，并且在低温下进行电镀反应，从而降低了工艺操作成本，并使工艺简单。

7. 发明申请

US20090117381A1 Acryl Microbead Having Marron Particle Size Distribution and Method of Preparing Thereof 审中-公开
标题翻译：具有Marron粒度分布的丙烯微珠及其制备方法
公开(公告)号：US20090117381A1
公开(公告)日：2009-05-07
申请号：US11991673
申请日：2006-08-31
申请人： Jae Eock Cho , Se Jin Oh , Seok Heon Oh
发明人： Jae Eock Cho , Se Jin Oh , Seok Heon Oh
IPC分类号： B32B5/16 , C08L33/08 , B32B27/00
CPC分类号： C08F2/16 , C08F220/14 , Y10T428/2982
摘要： Disclosed herein are acryl microbeads having a narrow particle size distribution and a method of preparing the same. In a method of preparing acryl microbeads through polymerization by stirring a polymerization composition containing vinyl acrylate monomers, an initiator and a dispersion stabilizer at a high speed to form microdroplets and increasing a reaction temperature to induce the polymerization reaction of the monomers within the microdroplets, a low molecular weight seed particle capable of absorbing vinyl acrylate monomers dissolved in a reaction medium outside the microdroplets is supplied at the time of the polymerization reaction, and thus the acryl microbeads have a narrow particle size distribution. The microbeads, which are almost completely free of fine and coarse particles and thus need no sorting process, which range in size from 1 to 50 μm, and which have a narrow particle size distribution can be prepared at a high yield without using a polymerization inhibitor. Exhibiting excellent physicochemical properties including color, transparency, etc., the microbeads can find a wide spectrum of applications in various industries including optical, cosmetic, and food industries.
摘要翻译：本文公开了具有窄粒度分布的丙烯酸微珠和其制备方法。在通过聚合制备丙烯酸微珠的方法中，通过以高速搅拌含有丙烯酸乙烯酯单体，引发剂和分散体稳定剂的聚合组合物以形成微滴并增加反应温度以诱导单体在微滴中的聚合反应，在聚合反应时供给溶解在微滴外的反应介质中的能够吸收丙烯酸乙烯酯单体的低分子量种子颗粒，因此丙烯酸类微珠粒径分布窄。几乎完全不含细粒和粗颗粒的微珠，并且不需要分选过程，其尺寸范围为1至50μm，并且可以以高产率制备具有窄粒度分布的微珠，而不使用聚合抑制剂。微珠具有优异的物理化学性质，包括颜色，透明度等，可以在光学，化妆品和食品工业等行业中得到广泛的应用。

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