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1. 发明授权

US07579998B1 Fractal dipole antenna 失效
标题翻译：分形偶极天线
公开(公告)号：US07579998B1
公开(公告)日：2009-08-25
申请号：US12033403
申请日：2008-02-19
申请人： Chiou-Yung Fang , Hua-Ming Chen , Yang-Kai Wang , Chia-Ming Liang , Ching-Shun Wang
发明人： Chiou-Yung Fang , Hua-Ming Chen , Yang-Kai Wang , Chia-Ming Liang , Ching-Shun Wang
IPC分类号： H01Q9/28
CPC分类号： H01Q1/243 , H01Q1/38 , H01Q9/285
摘要： A fractal dipole antenna includes a dielectric substrate, first and second closed-loop radiating elements, each of which is formed on the dielectric substrate, and first and second fractal radiating elements, each of which is formed on the dielectric substrate and is surrounded by and connected to a respective one of the first and second closed-loop radiating elements.
摘要翻译：分形偶极天线包括电介质基板，第一和第二闭环辐射元件，每个形成在电介质基板上，以及第一和第二分形辐射元件，其每一个形成在电介质基板上，连接到第一和第二闭环辐射元件中的相应一个。

2. 外观设计

USD585436S1 Antenna 有权
公开(公告)号：USD585436S1
公开(公告)日：2009-01-27
申请号：US29303846
申请日：2008-02-19
申请人： Chiou-Yung Fang , Hua-Ming Chen , Yang-Kai Wang , Chia-Ming Liang , Ching-Shun Wang
设计人： Chiou-Yung Fang , Hua-Ming Chen , Yang-Kai Wang , Chia-Ming Liang , Ching-Shun Wang

3. 发明授权

US07548207B1 Circularly polarized antenna 有权
标题翻译：圆极化天线
公开(公告)号：US07548207B1
公开(公告)日：2009-06-16
申请号：US12026727
申请日：2008-02-06
申请人： Fang-Hsien Chu , Hua-Ming Chen , Yang-Kai Wang , Ching-Shun Wang
发明人： Fang-Hsien Chu , Hua-Ming Chen , Yang-Kai Wang , Ching-Shun Wang
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H01Q7/00
摘要： A circularly polarized antenna includes a dielectric substrate, a closed-loop radiating element, a micro-strip radiating element, a feeding element, and a grounding element. The closed-loop radiating element is formed on a first surface of the dielectric substrate. The micro-strip radiating element is formed on the first surface of the dielectric substrate, is surrounded by the closed-loop radiating element, and is coupled to the closed-loop radiating element. The feeding element is formed on the first surface of the dielectric substrate, is surrounded by the closed-loop radiating element, and is coupled to the micro-strip radiating element. The grounding element is formed on a second surface of the dielectric substrate.
摘要翻译：圆极化天线包括电介质基板，闭环辐射元件，微带辐射元件，馈电元件和接地元件。闭环辐射元件形成在电介质基板的第一表面上。微带辐射元件形成在电介质基板的第一表面上，被闭环辐射元件包围，并且耦合到闭环辐射元件。供电元件形成在电介质基板的第一表面上，被闭环辐射元件围绕，并且耦合到微带辐射元件。接地元件形成在电介质基板的第二表面上。

4. 发明申请

US20080142965A1 Chip package 审中-公开
标题翻译：芯片封装
公开(公告)号：US20080142965A1
公开(公告)日：2008-06-19
申请号：US11785195
申请日：2007-04-16
申请人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Ming-Chung Wang
发明人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Ming-Chung Wang
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L2224/16225 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A chip package includes: a circuit board formed with conductive traces; a semiconductor chip formed with conductive pads; a bridging member sandwiched between the circuit board and the semiconductor chip and including an elastic dielectric body and spaced apart flexible conductive lines, each of which extends through the elastic dielectric body to contact a respective one of the conductive traces of the circuit board and a respective one of the conductive pads of the semiconductor chip; and a holding member pressing the semiconductor chip against the elastic dielectric body so as to result in pressing action of the elastic dielectric body against the circuit board.
摘要翻译：芯片封装包括：形成有导电迹线的电路板; 形成有导电焊盘的半导体芯片; 夹在所述电路板和所述半导体芯片之间并且包括弹性介电体和间隔开的柔性导电线的桥接构件，每个所述桥接构件延伸穿过所述弹性介电体以接触所述电路板的相应导电迹线和相应的半导体芯片的导电焊盘之一; 以及保持构件，将半导体芯片压靠在弹性介电体上，以使弹性介电体抵抗电路板的压力。

5. 发明授权

US07277242B1 Lens module 失效
标题翻译：镜头模块
公开(公告)号：US07277242B1
公开(公告)日：2007-10-02
申请号：US11723180
申请日：2007-03-16
申请人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Miy-Chung Wang
发明人： Ching-Shun Wang , Chun-Hua Hsia , Yu-Heng Liu , Yang-Kai Wang , Kuang-Yau Teng , Miy-Chung Wang
IPC分类号： G02B7/02 , G02B27/00
CPC分类号： G02B7/02 , H04N5/2253 , H04N5/2257
摘要： A lens module includes a lens seat, an image sensor unit, a lens set, a circuit board, and a resilient interposer. The lens seat includes a top wall that is formed with a barrel hole, a side wall that extends from a periphery of the top wall and that cooperates with the top wall to define a chamber, and a lens barrel. The lens barrel has a first barrel portion disposed in the chamber and a second barrel portion extending from the first barrel portion and passing through the barrel hole in the top wall. The image sensor unit and the lens set are disposed in the first and second barrel portions of the lens barrel, respectively. The circuit board is disposed to cover an open side of the lens seat, and is connected electrically to the image sensor unit via the resilient interposer.
摘要翻译：透镜模块包括透镜座，图像传感器单元，透镜组，电路板和弹性插入器。透镜座包括形成有筒孔的顶壁，从顶壁的周边延伸并与顶壁配合以限定室的侧壁和透镜镜筒。透镜镜筒具有设置在腔室中的第一镜筒部分和从第一镜筒部分延伸并穿过顶壁中的镜筒孔的第二镜筒部分。图像传感器单元和透镜组分别设置在镜筒的第一和第二镜筒部分中。电路板被设置为覆盖透镜座的敞开侧，并且经由弹性插入件与图像传感器单元电连接。

6. 发明授权

US08259482B2 Power adapter apparatus and power management method 失效
标题翻译：电源适配器和电源管理方法
公开(公告)号：US08259482B2
公开(公告)日：2012-09-04
申请号：US12782901
申请日：2010-05-19
申请人： Ching-Shun Wang , Chun-Hua Hsia
发明人： Ching-Shun Wang , Chun-Hua Hsia
IPC分类号： H02M1/00
CPC分类号： H02M1/00 , H02M2001/0032 , Y02B70/16
摘要： A power adapter apparatus and a power management method thereof are disclosed in the invention. The power adapter includes an output interface and a power modulation unit. The power adapter can be electrically connected with an electronic device through the output interface. There is a detective structure disposed on the output interface. The power management method includes steps of: 1) detecting whether the power adapter apparatus is electrically connected with the electronic device by the detective structure; and 2) when the output interface is detected to be disconnected from the electronic device, switching the power modulation unit to a standby state, so as to reduce a total power consumption of the power modulation unit.
摘要翻译：本发明公开了一种电源适配器装置及其电源管理方法。电源适配器包括输出接口和功率调制单元。电源适配器可以通过输出接口与电子设备电连接。在输出接口上设置有一个检测结构。电源管理方法包括以下步骤：1）通过检测结构检测电源适配器装置是否与电子设备电连接; 以及2）当检测到输出接口与电子设备断开连接时，将功率调制单元切换到待机状态，以减少功率调制单元的总功耗。

7. 发明申请

US20120025941A1 IRON-CORE COIL ASSEMBLY 审中-公开
标题翻译：铁芯线圈总成
公开(公告)号：US20120025941A1
公开(公告)日：2012-02-02
申请号：US12897832
申请日：2010-10-05
申请人： Ching-Shun Wang , Chun-Hua Hsia , Yuan-Bin Tang
发明人： Ching-Shun Wang , Chun-Hua Hsia , Yuan-Bin Tang
IPC分类号： H01F27/30
CPC分类号： H01F17/06 , H01F27/2804 , H01F27/306 , H01F2027/2814
摘要： An iron-core coil assembly is provided, which includes a substrate, a plurality of U-shaped wires, a first pin, a second pin, and an iron-core device. The substrate has a groove divided into a winding area and a non-winding area. The plurality of U-shaped wires is disposed in the winding area at a space from each other, and each U-shaped wire has an opening and a recess. The first pin and the second pin are respectively arranged at two ends of the opening, and the recess is located in the groove. The iron-core device is disposed in the groove, and passes through the recess of each U-shaped wire.
摘要翻译：提供一种铁芯线圈组件，其包括基板，多个U形导线，第一销，第二销和铁芯装置。衬底具有分为绕组区域和非绕组区域的槽。所述多个U字形线材彼此间隔设置在所述绕线区域中，并且每个所述U字形线材具有开口和凹部。第一销和第二销分别布置在开口的两端，凹槽位于槽中。铁芯装置设置在槽中，并穿过每个U形导线的凹部。

8. 发明申请

US20080289770A1 Adhesive tape cutting device 审中-公开
标题翻译：胶带切割装置
公开(公告)号：US20080289770A1
公开(公告)日：2008-11-27
申请号：US11802819
申请日：2007-05-25
申请人： Chun-Hua Hsia , Ching-Shun Wang , Ming-Chung Wang
发明人： Chun-Hua Hsia , Ching-Shun Wang , Ming-Chung Wang
IPC分类号： B32B38/10
CPC分类号： B65H35/002 , Y10T156/12
摘要： An adhesive tape cutting device includes: a sleeve body adapted to be sleeved on an adhesive tape roll and defining a channel that has opposite first and second open ends which open in opposite circumferential directions, the sleeve body further defining a tape-discharging slot that is disposed between the first and second open ends, that is in spatial communication with the channel, and that opens in a radial direction for extension of an unrolled end portion of an adhesive tape of the adhesive tape roll therethrough; and a cutting member mounted on the sleeve body.
摘要翻译：一种胶带切割装置包括：套筒主体，其适于套在胶带卷上并限定具有相反的第一和第二开口端的通道，所述相对的第一和第二开口端在相反的圆周方向上开口，所述套筒主体还限定带排放槽，设置在与通道空间连通的第一和第二开口端之间，并且在径向方向上开放，用于延伸粘合带卷的胶带的展开端部; 以及安装在套筒本体上的切割构件。

9. 发明授权

US08715010B2 Electric connector with multi-transmission interfaces 有权
标题翻译：带多路接口的电接头
公开(公告)号：US08715010B2
公开(公告)日：2014-05-06
申请号：US13549855
申请日：2012-07-16
申请人： Ching-Shun Wang , Chia-Ho Chang , Yuan-Bin Tang
发明人： Ching-Shun Wang , Chia-Ho Chang , Yuan-Bin Tang
IPC分类号： H01R24/00
CPC分类号： H01R27/00 , H01R13/7031 , H01R24/60 , H01R29/00
摘要： An electric connector includes a main body, a plurality of first terminals, a plurality of second terminals, and a plurality of third terminals. The main body includes a socket, a base, and a tongue. The base is disposed in the socket. The tongue includes a first tongue portion and a second tongue portion. The first tongue portion has a first thickness, and the second tongue portion has a second thickness different from the first thickness. The first terminals are disposed on the first tongue portion for transmitting a first signal meeting the first standard. The second terminals and the third terminals are respectively disposed on the two surface of the second tongue portion for transmitting a second signal meeting the second standard.
摘要翻译：电连接器包括主体，多个第一端子，多个第二端子和多个第三端子。主体包括插座，底座和舌头。基座设置在插座中。舌部包括第一舌部和第二舌部。第一舌部具有第一厚度，并且第二舌部具有不同于第一厚度的第二厚度。第一端子设置在第一舌部上，用于传送满足第一标准的第一信号。第二端子和第三端子分别设置在第二舌部的两个表面上，用于发送满足第二标准的第二信号。

10. 发明授权

US06907659B2 Method for manufacturing and packaging integrated circuit 失效
标题翻译：集成电路的制造和封装方法
公开(公告)号：US06907659B2
公开(公告)日：2005-06-21
申请号：US10358196
申请日：2003-02-05
申请人： Ching-Shun Wang
发明人： Ching-Shun Wang
IPC分类号： H01L23/498 , H01R43/00
CPC分类号： H01L23/49861 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/854 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/16195 , H01L2924/181 , Y10T29/49121 , Y10T29/49146 , Y10T29/49147 , Y10T29/49153 , Y10T29/49204 , Y10T29/4922 , Y10T29/49222 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A method for manufacturing and packaging an integrated circuit includes following steps: pressure a continuous pin material and a base board area at first; then cut off pin material into several pin units, accommodate each pin units into respective position in a mould, and ejecting plastic into the mould gap to shape a pin unit, then remove waste part of the pin material after removing down the mould parts; put four pin units and a base board into a rectangle mould, then eject plastic again into mould gap, after that cut off waste part of the base board to attain an IC socket; stick an IC chip on top of the base board of the IC socket and wire it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.
摘要翻译：一种用于制造和封装集成电路的方法包括以下步骤：首先对连续的引脚材料和基板区域进行加压; 然后将销钉材料切割成多个销钉单元，将每个销钉单元容纳在模具中的相应位置，并将塑料喷射到模具间隙中以成形销单元，然后在卸下模具部件之后移除销材料的废弃部分; 将四针单元和基板放入矩形模具中，然后将塑料再次弹出到模具间隙中，然后切断基板的废弃部分以获得IC插座; 将IC芯片放在IC插座的基板顶部并将其导线。最后，盖上IC卡插座上的面板，完成整个IC封装程序。

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