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1. 发明申请

US20060209032A1 HANDHELD ELECTRONIC DEVICE 审中-公开
标题翻译：手持电子设备
公开(公告)号：US20060209032A1
公开(公告)日：2006-09-21
申请号：US11162900
申请日：2005-09-27
申请人： Ching-Liang Chiang , Yi-Chen Chung
发明人： Ching-Liang Chiang , Yi-Chen Chung
IPC分类号： G09G5/00
CPC分类号： G06F1/1664 , G06F1/1626
摘要： A handheld electronic device including a main body, a display unit and a press-type keyboard is provided. The main body has a data process module, and the display unit is mounted on the main body. The press-type keyboard having a center and a plurality of keys is mounted on the main body and adjacent to the display unit. Moreover, the closer each key is to the center, the higher the apex of the key is protruding above the main body. Because the height of the keys varies with the distance between the keys and the center, it is more convenient for users when keying in data.
摘要翻译：提供了包括主体，显示单元和按压型键盘的手持式电子设备。主体具有数据处理模块，显示单元安装在主体上。具有中心和多个键的按压式键盘安装在主体上并与显示单元相邻。此外，每个键越靠近中心，键的顶点越高在主体上方突出。由于键的高度随键和中心之间的距离而变化，因此在键入数据时用户更方便。

2. 发明申请

US20050190686A1 Recordable optical disc and method for manufacturing a mother disc thereof 审中-公开
标题翻译：可记录光盘及其母盘的制造方法
公开(公告)号：US20050190686A1
公开(公告)日：2005-09-01
申请号：US10788359
申请日：2004-03-01
申请人： Wu-Hsuan Ho , Chung-Ping Wang , Yi-Chen Chung
发明人： Wu-Hsuan Ho , Chung-Ping Wang , Yi-Chen Chung
IPC分类号： G11B7/007 , G11B7/24 , G11B7/26
CPC分类号： G11B7/24082 , G11B7/261
摘要： A recordable optical disc and a method for manufacturing a mother disc thereof are proposed. The recordable optical disc comprises a substrate with a spiral groove wobbled in a fixed period. The recordable optical disc is characterized in that the spiral groove has a plurality of transient side-wobble regions not in the wobble period and used as recording regions of address data. In the method of manufacturing a mother disc of the optical disc, a spiral groove is first formed on a mother disc substrate by using an etching source wobbling in a fixed period. A transient side-wobble not in the wobble period is inserted between several wobble periods to form a spiral groove having transient side-wobble regions on the mother disc substrate. The stability of manufacture of the mother disc can thus be greatly enhanced, and the PI error rate of the optical disc can be lowered.
摘要翻译：提出了可记录光盘及其母盘的制造方法。可记录光盘包括在固定周期内摆动的螺旋槽的基板。可记录光盘的特征在于，螺旋槽具有不在摆动周期中的多个瞬态侧摆动区域，并且用作地址数据的记录区域。在制造光盘的母盘的方法中，首先通过在固定时间内使用蚀刻源摆动在母盘基板上形成螺旋槽。在摆动周期之间插入不在摆动周期内的瞬时侧摆，以在母盘基板上形成具有瞬时侧摆动区域的螺旋槽。因此，能够大幅提高母盘的制造稳定性，能够降低光盘的PI误差率。

3. 发明申请

US20050135228A1 Film structure of a rewritable compact disc 审中-公开
标题翻译：可重写光盘的胶片结构
公开(公告)号：US20050135228A1
公开(公告)日：2005-06-23
申请号：US10739161
申请日：2003-12-19
申请人： Wu Ho , Yi-Chen Chung , Shih Chou
发明人： Wu Ho , Yi-Chen Chung , Shih Chou
IPC分类号： G11B7/243 , G11B7/257 , G11B7/24
CPC分类号： G11B7/252 , G11B7/243 , G11B7/2534 , G11B7/257 , G11B7/259 , G11B2007/24308 , G11B2007/2431 , G11B2007/24314 , G11B2007/24316 , G11B2007/2571
摘要： The present invention discloses a film structure of a rewritable compact disc including a transparent substrate on which sequentially laminated a phase-change recording layer, a dielectric layer and a reflective layer; and a barrier layer located between the dielectric layer and the reflective layer to insulate the dielectric layer and the reflective layer, and the feature of the barrier layer is that the barrier layer is composed of a germanium compound. The present invention provides an easily controlled process of the film structure, which can effectively improve the weather-resistibility of the disc to extend the lifetime and the conserving time of the disc.
摘要翻译：本发明公开了一种包括透明基板的可重写光盘的薄膜结构，其上依次层叠有相变记录层，电介质层和反射层; 以及位于电介质层和反射层之间以使绝缘层和反射层绝缘的阻挡层，并且阻挡层的特征在于阻挡层由锗化合物构成。本发明提供一种容易控制的薄膜结构的方法，其可以有效地提高圆盘的耐候性，延长圆盘的使用寿命和节省时间。

4. 发明授权

US08969146B2 Array substrate and manufacturing method thereof 有权
标题翻译：阵列基板及其制造方法
公开(公告)号：US08969146B2
公开(公告)日：2015-03-03
申请号：US13615661
申请日：2012-09-14
申请人： Yi-Chen Chung , Chia-Yu Chen , Hui-Ling Ku , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
发明人： Yi-Chen Chung , Chia-Yu Chen , Hui-Ling Ku , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
IPC分类号： H01L21/84
CPC分类号： H01L27/1288 , H01L21/28008 , H01L21/31133 , H01L27/1222 , H01L27/1225 , H01L27/124 , H01L2227/323
摘要： A manufacturing method of an array substrate includes the following steps. A gate electrode and a gate insulator layer are successively formed on a substrate. A semiconductor layer, an etching stop layer, a hard mask layer, and a second patterned photoresist are successively formed on the gate insulator layer. The second patterned photoresist is employed for performing an over etching process to the hard mask layer to form a patterned hard mask layer. The second patterned photoresist is employed for performing a first etching process to the etching stop layer. The second patterned photoresist is then employed for performing a second etching process to the semiconductor layer to form a patterned semiconductor layer. The etching stop layer uncovered by the patterned hard mask layer is then removed for forming a patterned etching stop layer.
摘要翻译：阵列基板的制造方法包括以下步骤。在基板上依次形成栅极电极和栅极绝缘体层。在栅极绝缘体层上依次形成半导体层，蚀刻停止层，硬掩模层和第二图案化光致抗蚀剂。第二图案化的光致抗蚀剂用于对硬掩模层进行过蚀刻工艺以形成图案化的硬掩模层。第二图案化光刻胶用于对蚀刻停止层进行第一蚀刻处理。然后使用第二图案化的光致抗蚀剂来对半导体层执行第二蚀刻工艺以形成图案化的半导体层。由图案化的硬掩模层未覆盖的蚀刻停止层然后被去除以形成图案化的蚀刻停止层。

5. 发明申请

US20130134425A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：阵列基板及其制造方法
公开(公告)号：US20130134425A1
公开(公告)日：2013-05-30
申请号：US13615661
申请日：2012-09-14
申请人： Yi-Chen Chung , Chia-Yu Chen , Hui-Ling Ku , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
发明人： Yi-Chen Chung , Chia-Yu Chen , Hui-Ling Ku , Yu-Hung Chen , Chi-Wei Chou , Fan-Wei Chang , Hsueh-Hsing Lu , Hung-Che Ting
IPC分类号： H01L21/336 , H01L29/786 , H01L27/15 , H01L33/08
CPC分类号： H01L27/1288 , H01L21/28008 , H01L21/31133 , H01L27/1222 , H01L27/1225 , H01L27/124 , H01L2227/323
摘要： A manufacturing method of an array substrate includes the following steps. A gate electrode and a gate insulator layer are successively formed on a substrate. A semiconductor layer, an etching stop layer, a hard mask layer, and a second patterned photoresist are successively formed on the gate insulator layer. The second patterned photoresist is employed for performing an over etching process to the hard mask layer to form a patterned hard mask layer. The second patterned photoresist is employed for performing a first etching process to the etching stop layer. The second patterned photoresist is then employed for performing a second etching process to the semiconductor layer to form a patterned semiconductor layer. The etching stop layer uncovered by the patterned hard mask layer is then removed for forming a patterned etching stop layer.
摘要翻译：阵列基板的制造方法包括以下步骤。在基板上依次形成栅极电极和栅极绝缘体层。在栅极绝缘体层上依次形成半导体层，蚀刻停止层，硬掩模层和第二图案化光致抗蚀剂。第二图案化的光致抗蚀剂用于对硬掩模层进行过蚀刻工艺以形成图案化的硬掩模层。第二图案化光刻胶用于对蚀刻停止层进行第一蚀刻处理。然后使用第二图案化的光致抗蚀剂来对半导体层执行第二蚀刻工艺以形成图案化的半导体层。由图案化的硬掩模层未覆盖的蚀刻停止层然后被去除以形成图案化的蚀刻停止层。

6. 发明授权

US06643137B1 Heat-dissipating device with grounding capability 失效
标题翻译：具有接地能力的散热装置
公开(公告)号：US06643137B1
公开(公告)日：2003-11-04
申请号：US10318144
申请日：2002-12-13
申请人： Yi-Chen Chung , Hsuan-Cheng Wang , I-Sung Huang
发明人： Yi-Chen Chung , Hsuan-Cheng Wang , I-Sung Huang
IPC分类号： H05K720
CPC分类号： H01L23/367 , H01L23/4006 , H01L23/552 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connecting member. The heat-dissipating member is adapted to be disposed on a heat-radiating side of the electronic component. The grounding member includes a grounding tail and a grounding body connected to the grounding tail. The grounding tail is adapted to pass through the circuit board to connect electrically with the grounding layer and to dispose the grounding body between the heat-dissipating member and the circuit board. The connecting member interconnects the heat-dissipating member and the grounding member, and is adapted to be secured on the circuit board. The connecting member cooperates with the grounding member to make electrical connection between the heat-dissipating member and the grounding layer of the circuit board.
摘要翻译：散热装置适用于具有接地层的多层电路板，并且其上安装有电子部件。散热装置包括散热构件，接地构件和连接构件。散热构件适于设置在电子部件的散热侧。接地构件包括接地尾和连接到接地尾的接地体。接地尾部适于通过电路板与接地层电连接，并将接地体设置在散热构件和电路板之间。连接构件将散热构件和接地构件互连，并且适于固定在电路板上。连接构件与接地构件配合，以在散热构件和电路板的接地层之间形成电连接。

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