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    • 9. 发明申请
    • DUAL CONTACT ETCH STOP LAYER PROCESS
    • 双重接触蚀刻停止层工艺
    • US20090215277A1
    • 2009-08-27
    • US12037089
    • 2008-02-26
    • Tung-Hsing LeeMing-Tzong YangChing-Chung KoTien-Chang ChangYu-Tung Chang
    • Tung-Hsing LeeMing-Tzong YangChing-Chung KoTien-Chang ChangYu-Tung Chang
    • H01L21/31
    • H01L21/823807H01L21/823871H01L29/7843
    • A dual CESL process includes: (1) providing a substrate having thereon a first device region, a second device region and a shallow trench isolation (STI) region between the first and second device regions; (2) forming a first-stress imparting film with a first stress over the substrate, wherein the first-stress imparting film does not cover the second device region; and (3) forming a second-stress imparting film with a second stress over the substrate, wherein the second-stress imparting film does not cover the first device region, an overlapped boundary between the first- and second-stress imparting films is created directly above the STI region, and wherein the overlapped boundary is placed in close proximity to the second device region in order to induce the first stress to a channel region thereof in a transversal direction.
    • 双CESL工艺包括:(1)提供其上具有第一和第二器件区域之间的第一器件区域,第二器件区域和浅沟槽隔离(STI)区域的衬底; (2)在所述基板上形成具有第一应力的第一应力赋予膜,其中所述第一应力赋予膜不覆盖所述第二器件区域; 和(3)在基板上形成具有第二应力的第二应力赋予膜,其中第二应力赋予膜不覆盖第一器件区域,直接产生第一和第二施加应力膜之间的重叠边界 在STI区域之上,并且其中重叠的边界被放置成紧邻第二器件区域,以便在横向方向上引起其沟道区域的第一应力。