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    • 6. 发明授权
    • Process of fabricating photodiode integrated with MOS device
    • 制造与MOS器件集成的光电二极管的工艺
    • US6033232A
    • 2000-03-07
    • US172037
    • 1998-10-14
    • James H. C. LinChih-Wei Hsiung
    • James H. C. LinChih-Wei Hsiung
    • H01L27/06H01L27/144H01L21/8234
    • H01L27/0629H01L27/1443Y10S148/072
    • A method of fabricating a photodiode and at least one MOS device within a first active region and a second active region, respectively, of a substrate is disclosed. First, a gate structure is formed on the substrate within the second active region, and lightly-doped regions are formed by introducing first dopants into the substrate through the gate structure as masking. Then, a diffusion region is formed in the substrate within the first active region by ion implantation. Then, an insulating layer is formed to overlie the first and second active region, a portion of which within the second active region is thereafter patterned to sidewall spacers on the sidewalls of the gate structure. Subsequently, heavily-doped regions are formed by introducing second dopants throughout the second active region into the substrate by the gate structure and sidewall spacers as masking. In addition, the insulating layer can be thinned before the step of patterning the insulating layer to form the sidewall spacers is performed.
    • 公开了分别在衬底的第一有源区和第二有源区内制造光电二极管和至少一个MOS器件的方法。 首先,在第二有源区域中的衬底上形成栅极结构,并且通过栅极结构将第一掺杂剂引入到衬底中作为掩模形成轻掺杂区域。 然后,通过离子注入在第一有源区内的衬底中形成扩散区。 然后,形成绝缘层以覆盖第一和第二有源区域,其中第二有源区域中的一部分此后被图案化为栅极结构的侧壁上的侧壁间隔物。 随后,通过栅极结构和侧壁间隔物将第二掺杂剂通过第二有源区域引入衬底而形成重掺杂区域作为掩模。 此外,在图案化绝缘层以形成侧壁间隔物的步骤之前,可以使绝缘层变薄。
    • 8. 发明申请
    • METHOD FOR FABRICATING A VERTICAL TRANSISTOR
    • 用于制造垂直晶体管的方法
    • US20130230955A1
    • 2013-09-05
    • US13410102
    • 2012-03-01
    • Meng-Hsien CHENChung-Yung AiChih-Wei Hsiung
    • Meng-Hsien CHENChung-Yung AiChih-Wei Hsiung
    • H01L21/336
    • H01L27/10876H01L29/66666
    • A method for fabricating a vertical transistor comprises steps: forming a plurality of first trenches in a substrate; sequentially epitaxially growing a first polarity layer and a channel layer inside the first trenches, and forming a first retard layer on the channel layer; etching the first retard layer and the channel layer along the direction vertical to the first trenches to form a plurality of pillars; respectively forming a gate on a first sidewall and a second sidewall of each pillar; removing the first retard layer on the pillar; and epitaxially growing a second polarity layer on the pillar. The present invention is characterized by using an epitaxial method to form the first polarity layer, the channel layer and the second polarity layer and has the advantage of uniform ion concentration distribution. Therefore, the present invention can fabricate a high-quality vertical transistor.
    • 制造垂直晶体管的方法包括以下步骤:在衬底中形成多个第一沟槽; 在所述第一沟槽内依次外延生长第一极性层和沟道层,以及在所述沟道层上形成第一延迟层; 沿着与第一沟槽垂直的方向蚀刻第一延迟层和沟道层以形成多个柱; 分别在每个支柱的第一侧壁和第二侧壁上形成栅极; 去除柱上的第一延迟层; 并在柱上外延生长第二极性层。 本发明的特征在于使用外延法形成第一极性层,沟道层和第二极性层,并且具有均匀的离子浓度分布的优点。 因此,本发明可以制造高质量的垂直晶体管。
    • 9. 发明授权
    • Method of controlling a vertical dual-gate dynamic random access memory
    • 控制垂直双栅极动态随机存取存储器的方法
    • US08437184B1
    • 2013-05-07
    • US13312074
    • 2011-12-06
    • Chih-Wei Hsiung
    • Chih-Wei Hsiung
    • G11C11/34
    • H01L27/10823H01L27/10876H01L27/10885
    • A method of controlling a vertical dual-gate DRAM provides a short circuit state, a clearing state and a false broken circuit state. In the short circuit state, a first gate and a second gate at two sides of a first pillar are controlled to respectively have a turn-on voltage to form electric connection between a drain and a source at two ends of the first pillar. In the clearing state, the first gate and second gate are controlled to respectively have a clearing voltage to disconnect electric connection between the drain and source at two ends of the first pillar. The false broken circuit state is entered after the clearing state has been finished. The invention does not separate gates between neighboring pillars, but controls ON/OFF of transistors electrically so that no current leakage is generated in the clearing state and problem of inaccurate data reading can be prevented.
    • 控制垂直双栅极DRAM的方法提供短路状态,清零状态和假断路状态。 在短路状态下,控制第一支柱两侧的第一栅极和第二栅极分别具有导通电压,以在第一支柱的两端形成漏极与源极之间的电连接。 在清除状态下,控制第一栅极和第二栅极分别具有清除电压,以在第一支柱的两端断开漏极和源极之间的电连接。 在清除状态结束后进入错误的断路状态。 本发明不在相邻柱之间分隔栅极,而是电连接晶体管的导通/截止,从而在清除状态下不产生电流泄漏,并且可以防止数据读取不准确的问题。
    • 10. 发明授权
    • Three-dimensional dynamic random access memory with an ancillary electrode structure
    • 具有辅助电极结构的三维动态随机存取存储器
    • US08357964B1
    • 2013-01-22
    • US13227315
    • 2011-09-07
    • Chih-Yuan ChenMeng-Hsien ChenChih-Wei Hsiung
    • Chih-Yuan ChenMeng-Hsien ChenChih-Wei Hsiung
    • H01L27/108H01L29/94
    • H01L27/10876H01L27/10885
    • A three-dimensional dynamic random access memory with an ancillary electrode structure includes a substrate, at least one bit line formed on the substrate, at least one pillar element formed on a growth zone of the bit line, an ancillary electrode, a character line parallel with the substrate and perpendicular to the bit line, and at least one capacitor connecting to the pillar element. The bit line is formed on the substrate by doping and diffusing a doping element. The ancillary electrode is located on a separation zone of the bit line and adjacent to the pillar element. The character line is insulated from the ancillary electrode and incorporates with the bit line to output or input electronic data to the capacitor. Through the ancillary electrode, impedance of the bit line can be controlled to enhance conductivity of the bit line.
    • 具有辅助电极结构的三维动态随机存取存储器包括衬底,形成在衬底上的至少一个位线,形成在位线生长区上的至少一个柱元件,辅助电极,字符线平行 与基板并且垂直于位线,以及连接到柱元件的至少一个电容器。 通过掺杂和扩散掺杂元素在衬​​底上形成位线。 辅助电极位于位线的分离区并与柱元件相邻。 字符线与辅助电极绝缘,并与位线结合以将电子数据输出或输入到电容器。 通过辅助电极,可以控制位线的阻抗,以提高位线的电导率。