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1. 发明授权

US07723843B2 Multi-package module and electronic device using the same 有权
标题翻译：多包装模块和使用电子装置的电子装置
公开(公告)号：US07723843B2
公开(公告)日：2010-05-25
申请号：US12354152
申请日：2009-01-15
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/34
CPC分类号： H01L23/367 , H01L23/3677 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321
摘要： A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.
摘要翻译：一种用于多封装模块的封装衬底。封装衬底包括具有管芯区域和从管芯区域向外延伸到衬底的边缘的至少一个热通道区域的衬底。凸起之间的间隔比热通道区域的宽度窄，在芯片和热通道区域之外的基板上配置有凸块排列。还公开了一种具有封装基板的电子器件。

2. 发明授权

US07525182B2 Multi-package module and electronic device using the same 有权
标题翻译：多包装模块和使用电子装置的电子装置
公开(公告)号：US07525182B2
公开(公告)日：2009-04-28
申请号：US11243121
申请日：2005-10-04
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/495
CPC分类号： H01L23/367 , H01L23/3677 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321
摘要： A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.
摘要翻译：一种用于多封装模块的封装衬底。封装衬底包括具有管芯区域和从管芯区域向外延伸到衬底的边缘的至少一个热通道区域的衬底。凸起之间的间隔比热通道区域的宽度窄，在芯片和热通道区域之外的基板上配置有凸块排列。还公开了一种具有封装基板的电子器件。

3. 发明申请

US20090121352A1 MUTLI-PACKAGE MODULE AND ELECTRONIC DEVICE USING THE SAME 有权
标题翻译： MUTLI-PACKAGE模块和使用该模块的电子设备
公开(公告)号：US20090121352A1
公开(公告)日：2009-05-14
申请号：US12354152
申请日：2009-01-15
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/498
CPC分类号： H01L23/367 , H01L23/3677 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321
摘要： A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.
摘要翻译：一种用于多封装模块的封装衬底。封装衬底包括具有管芯区域和从管芯区域向外延伸到衬底的边缘的至少一个热通道区域的衬底。凸起之间的间隔比热通道区域的宽度窄，在芯片和热通道区域之外的基板上配置有凸块排列。还公开了一种具有封装基板的电子器件。

4. 发明申请

US20070045804A1 Printed circuit board for thermal dissipation and electronic device using the same 审中-公开
标题翻译：用于散热的印刷电路板和使用它的电子设备
公开(公告)号：US20070045804A1
公开(公告)日：2007-03-01
申请号：US11292631
申请日：2005-12-02
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/02
CPC分类号： H05K1/0209 , H01L23/367 , H01L23/3677 , H01L23/49838 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321 , H05K1/0206 , H05K1/0207 , H05K2201/066 , H05K2201/09309 , H05K2201/09781 , H05K2201/10734
摘要： A printed circuit board (PCB) with an improved thermal dissipating structure for a package substrate of a multi-package module (MPM). A first upper metal layer is on a substrate and corresponds to the package substrate. A second upper metal layer is on the substrate outside the package substrate. An inner metal layer is in the substrate. Pluralities of first and second heat conductive vias are in the substrate to thermally connect the inner metal layer to the first and second upper metal layers, respectively. An electronic device with an improved thermal dissipating structure is also disclosed.
摘要翻译：一种用于多封装模块（MPM）的封装衬底的具有改进的散热结构的印刷电路板（PCB）。第一上金属层位于衬底上并对应于封装衬底。第二上金属层位于封装衬底外的衬底上。内部金属层位于基板中。多个第一和第二导热通孔位于衬底中，以将内部金属层分别热连接到第一和第二上部金属层。还公开了一种具有改善的散热结构的电子设备。

5. 发明申请

US20060284314A1 Multi-package module and electronic device using the same 有权
公开(公告)号：US20060284314A1
公开(公告)日：2006-12-21
申请号：US11243121
申请日：2005-10-04
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/48
CPC分类号： H01L23/367 , H01L23/3677 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15321
摘要： A package substrate for a multi-package module. The package substrate comprises a substrate having a die region and at least one thermal channel region outwardly extending to an edge of the substrate from the die region. An array of bumps is arranged on the substrate except in the die and thermal channel regions, in which the interval between the bumps is narrower than the width of the thermal channel region. An electronic device with a package substrate is also disclosed.

6. 发明申请

US20070013045A1 Printed circuit board for thermal dissipation and electronic device using the same 有权
公开(公告)号：US20070013045A1
公开(公告)日：2007-01-18
申请号：US11257593
申请日：2005-10-24
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H05K1/0209 , H01L23/367 , H01L23/3735 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H05K2201/09772 , H05K2201/09781 , H05K2201/10734
摘要： A printed circuit board (PCB) for a package substrate of a multi-package module (MPM). The PCB comprises a substrate and a heat sink thereon. The heat sink comprises a first portion under the package substrate of the MPM. The heat sink further comprises a second portion adjacent to the first portion, comprising at least one fin.

7. 发明授权

US07298028B2 Printed circuit board for thermal dissipation and electronic device using the same 有权
标题翻译：用于散热的印刷电路板和使用它的电子设备
公开(公告)号：US07298028B2
公开(公告)日：2007-11-20
申请号：US11257593
申请日：2005-10-24
申请人： Chih-Hsiung Lin , Nai-Shung Chang
发明人： Chih-Hsiung Lin , Nai-Shung Chang
IPC分类号： H01L23/495
CPC分类号： H05K1/0209 , H01L23/367 , H01L23/3735 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/15311 , H01L2924/1532 , H05K2201/09772 , H05K2201/09781 , H05K2201/10734
摘要： A printed circuit board (PCB) for a package substrate of a multi-package module (MPM). The PCB comprises a substrate and a heat sink thereon. The heat sink comprises a first portion under the package substrate of the MPM. The heat sink further comprises a second portion adjacent to the first portion, comprising at least one fin.
摘要翻译：一种用于多封装模块（MPM）的封装基板的印刷电路板（PCB）。 PCB包括衬底和其上的散热器。散热器包括在MPM的封装衬底下方的第一部分。散热器还包括邻近第一部分的第二部分，包括至少一个散热片。

8. 发明授权

US10467769B2 Thin plate imaging device 有权
公开(公告)号：US10467769B2
公开(公告)日：2019-11-05
申请号：US15584437
申请日：2017-05-02
申请人： Chih-Hsiung Lin , Chong-Hau Chou
发明人： Chih-Hsiung Lin , Chong-Hau Chou
IPC分类号： H04N5/225 , G06T7/70 , G02B6/42 , G06T7/20
摘要： A thin plate imaging device in accordance with the present invention comprises a guide light plate, at least an imaging unit, and at least a photosensitive unit; the guide light plate and the imaging unit are utilized to allow lights to conduct total internal reflection or reflection propagation in dimension, the photosensitive unit is placed in the path of the total internal reflection or reflection propagation and disposed at the image focus position of the imaging unit; clear images can be obtained without moving the imaging unit or the photosensitive unit back and forth, and objects with different object distances can be imaged on different spots of the photosensitive unit such that relative distances of the objects can be determined by image signals obtained via the photosensitive unit directly.

9. 发明授权

US08078864B2 Portable computer and method for preheating portable computer before booting 有权
标题翻译：便携式计算机和启动前预热便携式计算机的方法
公开(公告)号：US08078864B2
公开(公告)日：2011-12-13
申请号：US12360978
申请日：2009-01-28
申请人： Chih-Hsiung Lin , Jing-Rung Wang
发明人： Chih-Hsiung Lin , Jing-Rung Wang
IPC分类号： G06F9/00 , G06F15/177 , G05D23/00 , G01K7/00 , G01K17/00
CPC分类号： H01L23/345 , G06F1/206 , G06F1/26 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a portable computer. When a power input terminal of the portable computer is connected to a power source, a sensor senses the temperature of electronic components of the portable computer to provide a sensed temperature value. When the sensed temperature value is lower than a preset temperature value, a microprocessor controls an indication device to operate and controls the heating unit to heat the electronic components. When the sensed temperature value is higher than the preset temperature value, the microprocessor controls the indication device not to operate and controls the heating unit stop heating the electronic components.
摘要翻译：本发明提供一种便携式计算机。当便携式计算机的电源输入端子连接到电源时，传感器感测便携式计算机的电子部件的温度以提供感测的温度值。当感测到的温度值低于预设温度值时，微处理器控制指示装置来操作和控制加热单元以加热电子部件。当感测温度值高于预设温度值时，微处理器控制指示装置不工作，并控制加热单元停止加热电子部件。

10. 发明申请

US20100301674A1 CONTROL CIRCUIT AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
标题翻译：包括其的控制电路和电子设备
公开(公告)号：US20100301674A1
公开(公告)日：2010-12-02
申请号：US12790965
申请日：2010-05-31
申请人： Chih-Hsiung Lin
发明人： Chih-Hsiung Lin
IPC分类号： H02J9/00
CPC分类号： H02J7/0055 , G06F1/263 , H02J7/35 , Y10T307/625
摘要： This invention provides a control circuit and an electronic device including the same. The control circuit is disposed in an electronic device for connecting a power supply. The electronic device includes a battery module. The control circuit includes a detecting unit, a processing unit, a control unit, and a switch. When the power supply is connected to the electronic device, the detecting unit provides a detecting result. The processing unit determines a type of the power supply according to the detecting result. When the processing unit determines that the power supply is a solar power adapter, the processing unit outputs a first control signal and a turn-off signal. The control unit controls operation of the battery module according to the first control signal. Further, the switch is turned off according to the turn-off signal, preventing the power supply from supplying power to the electronic device.
摘要翻译：本发明提供一种控制电路和包括该控制电路的电子设备。控制电路设置在用于连接电源的电子设备中。电子设备包括电池模块。控制电路包括检测单元，处理单元，控制单元和开关。当电源连接到电子设备时，检测单元提供检测结果。处理单元根据检测结果确定电源的类型。当处理单元确定电源是太阳能电源适配器时，处理单元输出第一控制信号和关断信号。控制单元根据第一控制信号控制电池模块的操作。此外，根据关断信号关闭开关，防止电源向电子设备供电。

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