专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080284019A1 CONDUCTOR-DIELECTRIC STRUCTURE AND METHOD FOR FABRICATING 失效
标题翻译：导电介质结构和制造方法
公开(公告)号：US20080284019A1
公开(公告)日：2008-11-20
申请号：US12128713
申请日：2008-05-29
申请人： Chih-Chao Yang , Shom Ponoth , David Rath , Keith Kwong Hon Wong
发明人： Chih-Chao Yang , Shom Ponoth , David Rath , Keith Kwong Hon Wong
IPC分类号： H01L21/768 , H01L23/532
CPC分类号： H01L21/76843 , H01L21/76865 , H01L21/76868 , H01L21/76873 , H01L2221/1089
摘要： A conductor-dielectric interconnect structure is fabricated by providing a structure comprising a dielectric layer having a patterned feature therein; depositing a plating seed layer on the dielectric layer in the patterned feature; depositing a sacrificial seed layer on the plating seed layer in the via; reducing the thickness of the sacrificial seed layer by reverse plating; and plating a conductive metal on the sacrificial seed layer in the patterned feature. Also provided is a dielectric layer having a via therein; a plating seed layer on the dielectric layer in the patterned feature; and a discontinuous sacrificial seed layer located in the patterned feature.
摘要翻译：通过提供包括其中具有图案化特征的电介质层的结构来制造导体 - 电介质互连结构; 在所述图案化特征中的所述电介质层上沉积电镀种子层; 在通孔的电镀种子层上沉积牺牲种子层; 通过反向电镀减少牺牲种子层的厚度; 以及在所述图案化特征中的所述牺牲种子层上镀覆导电金属。还提供了其中具有通孔的电介质层; 图案化特征中的电介质层上的电镀种子层; 以及位于图案化特征中的不连续牺牲种子层。

2. 发明授权

US07960276B2 Conductor-dielectric structure and method for fabricating 失效
标题翻译：导体 - 电介质结构及其制造方法
公开(公告)号：US07960276B2
公开(公告)日：2011-06-14
申请号：US12128713
申请日：2008-05-29
申请人： Shom Ponoth , David L. Rath , Chih-Chao Yang , Keith Kwong Hon Wong
发明人： Shom Ponoth , David L. Rath , Chih-Chao Yang , Keith Kwong Hon Wong
IPC分类号： H01L21/4763
CPC分类号： H01L21/76843 , H01L21/76865 , H01L21/76868 , H01L21/76873 , H01L2221/1089
摘要： A conductor-dielectric interconnect structure is fabricated by providing a structure comprising a dielectric layer having a patterned feature therein; depositing a plating seed layer on the dielectric layer in the patterned feature; depositing a sacrificial seed layer on the plating seed layer in the via; reducing the thickness of the sacrificial seed layer by reverse plating; and plating a conductive metal on the sacrificial seed layer in the patterned feature. Also provided is a dielectric layer having a via therein; a plating seed layer on the dielectric layer in the patterned feature; and a discontinuous sacrificial seed layer located in the patterned feature.
摘要翻译：通过提供包括其中具有图案化特征的电介质层的结构来制造导体 - 电介质互连结构; 在所述图案化特征中的所述电介质层上沉积电镀种子层; 在通孔的电镀种子层上沉积牺牲种子层; 通过反向电镀减少牺牲种子层的厚度; 以及在所述图案化特征中的所述牺牲种子层上镀覆导电金属。还提供了其中具有通孔的电介质层; 图案化特征中的电介质层上的电镀种子层; 以及位于图案化特征中的不连续牺牲种子层。

3. 发明申请

US20070117377A1 Conductor-dielectric structure and method for fabricating 审中-公开
标题翻译：导体 - 电介质结构及其制造方法
公开(公告)号：US20070117377A1
公开(公告)日：2007-05-24
申请号：US11286093
申请日：2005-11-23
申请人： Chih-Chao Yang , Shom Ponoth , David Rath , Keith Wong
发明人： Chih-Chao Yang , Shom Ponoth , David Rath , Keith Wong
IPC分类号： H01L21/4763
CPC分类号： H01L21/76843 , H01L21/76865 , H01L21/76868 , H01L21/76873 , H01L2221/1089
摘要： A conductor-dielectric interconnect structure is fabricated by providing a structure comprising a dielectric layer having a patterned feature therein; depositing a plating seed layer on the dielectric layer in the patterned feature; depositing a sacrificial seed layer on the plating seed layer in the via; reducing the thickness of the sacrificial seed layer by reverse plating; and plating a conductive metal on the sacrificial seed layer in the patterned feature. Also provided is a dielectric layer having a via therein; a plating seed layer on the dielectric layer in the patterned feature; and a discontinuous sacrificial seed layer located in the patterned feature.
摘要翻译：通过提供包括其中具有图案化特征的电介质层的结构来制造导体 - 电介质互连结构; 在所述图案化特征中的所述电介质层上沉积电镀种子层; 在通孔的电镀种子层上沉积牺牲种子层; 通过反向电镀减少牺牲种子层的厚度; 以及在所述图案化特征中的所述牺牲种子层上镀覆导电金属。还提供了其中具有通孔的电介质层; 图案化特征中的电介质层上的电镀种子层; 以及位于图案化特征中的不连续牺牲种子层。

4. 发明授权

US08877645B2 Integrated circuit structure having selectively formed metal cap 有权
标题翻译：具有选择性地形成的金属盖的集成电路结构
公开(公告)号：US08877645B2
公开(公告)日：2014-11-04
申请号：US13233064
申请日：2011-09-15
申请人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
发明人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
IPC分类号： H01L21/768 , H01L23/48 , H01L29/78
CPC分类号： H01L29/42372 , H01L21/28247 , H01L21/76834 , H01L21/7685 , H01L21/76856 , H01L21/76888 , H01L21/76897 , H01L29/495 , H01L29/517 , H01L29/78
摘要： Methods of forming an integrated circuit structure utilizing a selectively formed and at least partially oxidized metal cap over a gate, and associated structures. In one embodiment, a method includes providing a precursor structure including a transistor having a metal gate; forming an etch stop layer over an exposed portion of the metal gate; at least partially oxidizing the etch stop layer; and forming a dielectric layer over the at least partially oxidized etch stop layer.
摘要翻译：在栅极上利用选择性地形成和至少部分氧化的金属盖形成集成电路结构的方法以及相关联的结构。在一个实施例中，一种方法包括提供包括具有金属栅极的晶体管的前体结构; 在所述金属栅极的暴露部分上形成蚀刻停止层; 至少部分氧化所述蚀刻停止层; 以及在所述至少部分氧化的蚀刻停止层上形成介电层。

5. 发明授权

US08803321B2 Dual damascene dual alignment interconnect scheme 有权
标题翻译：双镶嵌双对准互连方案
公开(公告)号：US08803321B2
公开(公告)日：2014-08-12
申请号：US13490542
申请日：2012-06-07
申请人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
发明人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
IPC分类号： H01L23/535 , H01L21/283
CPC分类号： H01L21/76897 , H01L21/76807 , H01L21/76808 , H01L21/76811 , H01L21/76819 , H01L21/76831 , H01L21/76832 , H01L21/76834 , H01L21/76883 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A stack of a first metal line and a first dielectric cap material portion is formed within a line trench of first dielectric material layer. A second dielectric material layer is formed thereafter. A line trench extending between the top surface and the bottom surface of the second dielectric material layer is patterned. A photoresist layer is applied over the second dielectric material layer and patterned with a via pattern. An underlying portion of the first dielectric cap material is removed by an etch selective to the dielectric materials of the first and second dielectric material layer to form a via cavity that is laterally confined along the widthwise direction of the line trench and along the widthwise direction of the first metal line. A dual damascene line and via structure is formed, which includes a via structure that is laterally confined along two independent horizontal directions.
摘要翻译：在第一介电材料层的线沟槽内形成第一金属线和第一介电帽材料部分的堆叠。此后形成第二电介质材料层。在第二介电材料层的顶表面和底表面之间延伸的线沟槽被图案化。将光致抗蚀剂层施加在第二介电材料层上并用通孔图案构图。通过对第一和第二介电材料层的电介质材料的选择性蚀刻去除第一电介质盖材料的下部，以形成沿着线沟槽的宽度方向横向限制的通孔腔，并沿着宽度方向第一条金属线。形成双镶嵌线和通孔结构，其包括沿着两个独立的水平方向横向限制的通孔结构。

6. 发明授权

US08754483B2 Low-profile local interconnect and method of making the same 有权
标题翻译：薄型局部互连和制作相同的方法
公开(公告)号：US08754483B2
公开(公告)日：2014-06-17
申请号：US13169081
申请日：2011-06-27
申请人： Shom Ponoth , David V. Horak , Charles W. Koburger, III , Chih-Chao Yang
发明人： Shom Ponoth , David V. Horak , Charles W. Koburger, III , Chih-Chao Yang
IPC分类号： H01L29/788
CPC分类号： H01L21/76895 , H01L21/823475 , H04L45/58 , H04L49/15 , H04L49/45
摘要： Embodiments of the present invention provide a structure. The structure includes a plurality of field-effect-transistors having gate stacks formed on top of a semiconductor substrate, the gate stacks having spacers formed at sidewalls thereof; and one or more conductive contacts formed directly on top of the semiconductor substrate and interconnecting at least one source/drain of one of the plurality of field-effect-transistors to at least one source/drain of another one of the plurality of field-effect-transistors, wherein the one or more conductive contacts is part of a low-profile local interconnect that has a height lower than a height of the gate stacks.
摘要翻译：本发明的实施例提供一种结构。该结构包括多个场效应晶体管，其具有形成在半导体衬底顶部上的栅极叠层，该栅叠层具有形成在其侧壁上的隔离层; 以及直接形成在半导体衬底的顶部上并将多个场效应晶体管之一的至少一个源极/漏极互连到多个场效应中的另一个的至少一个源极/漏极的一个或多个导电触头晶体管，其中所述一个或多个导电触点是具有低于所述栅极堆叠的高度的高度的低轮廓局部互连的一部分。

7. 发明授权

US08629511B2 Mask free protection of work function material portions in wide replacement gate electrodes 有权
标题翻译：在宽的替代栅电极中，无功能保护功能材料部分
公开(公告)号：US08629511B2
公开(公告)日：2014-01-14
申请号：US13471852
申请日：2012-05-15
申请人： Charles W. Koburger, III , Marc A. Bergendahl , David V. Horak , Shom Ponoth , Chih-Chao Yang
发明人： Charles W. Koburger, III , Marc A. Bergendahl , David V. Horak , Shom Ponoth , Chih-Chao Yang
IPC分类号： H01L27/088
CPC分类号： H01L29/401 , E21B43/305 , E21B47/122 , H01L21/823431 , H01L21/823456 , H01L21/845 , H01L27/088 , H01L27/0886 , H01L27/1211
摘要： In a replacement gate scheme, after formation of a gate dielectric layer, a work function material layer completely fills a narrow gate trench, while not filling a wide gate trench. A dielectric material layer is deposited and planarized over the work function material layer, and is subsequently recessed to form a dielectric material portion overlying a horizontal portion of the work function material layer within the wide gate trench. The work function material layer is recessed employing the dielectric material portion as a part of an etch mask to form work function material portions. A conductive material is deposited and planarized to form gate conductor portions, and a dielectric material is deposited and planarized to form gate cap dielectrics.
摘要翻译：在替代栅极方案中，在形成栅极电介质层之后，功函数材料层完全填充窄栅极沟槽，同时不填充宽栅极沟槽。介电材料层在功函数材料层上沉积并平面化，随后凹入以形成覆盖宽栅极沟槽内的功函数材料层的水平部分的介电材料部分。使用介电材料部分作为蚀刻掩模的一部分来凹入功函数材料层以形成功函数材料部分。将导电材料沉积并平坦化以形成栅极导体部分，并且沉积和平坦化介电材料以形成栅极盖电介质。

8. 发明申请

US20130207270A1 DUAL-METAL SELF-ALIGNED WIRES AND VIAS 有权
标题翻译：双金属自对准线和VIAS
公开(公告)号：US20130207270A1
公开(公告)日：2013-08-15
申请号：US13371493
申请日：2012-02-13
申请人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
发明人： Steven J. Holmes , David V. Horak , Charles W. Koburger, III , Shom Ponoth , Chih-Chao Yang
IPC分类号： H01L21/768 , H01L23/49
CPC分类号： H01L23/485 , H01L21/76885 , H01L21/76897 , H01L23/5283 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： Method of forming a semiconductor structure which includes forming first conductive spacers on a semiconductor substrate; forming second conductive spacers with respect to the first conductive spacers, at least one of the second conductive spacers adjacent to and in contact with each of the first conductive spacers to form combined conductive spacers; recessing the second conductive spacers with respect to the first conductive spacers so that the first conductive spacers extend beyond the second conductive spacers; depositing an ILD to cover the first and second spacers except for an exposed edge of the first conductive spacers; patterning the exposed edges of the first conductive spacers to recess the edges of the first conductive spacers in predetermined locations to form recesses with respect to the ILD; and filling the recesses with an insulating material to leave unrecessed edges of the first conductive spacers as vias to subsequent wiring features.
摘要翻译：形成半导体结构的方法，包括在半导体衬底上形成第一导电间隔物; 相对于所述第一导电间隔物形成第二导电间隔物，所述第二导电间隔物中的至少一个与所述第一导电间隔物中的每一个相邻并与之接触以形成组合的导电间隔物; 相对于第一导电间隔物使第二导电间隔物凹陷，使得第一导电间隔物延伸超过第二导电间隔物; 沉积ILD以覆盖除了第一导电间隔物的暴露边缘之外的第一和第二间隔物; 图案化第一导电间隔物的暴露边缘以将预定位置中的第一导电间隔物的边缘凹入以形成相对于ILD的凹部; 并用绝缘材料填充凹槽，以将第一导电间隔物的未加工的边缘作为过孔留下以后的布线特征。

9. 发明授权

US08482132B2 Pad bonding employing a self-aligned plated liner for adhesion enhancement 有权
公开(公告)号：US08482132B2
公开(公告)日：2013-07-09
申请号：US12575980
申请日：2009-10-08
申请人： Chih-Chao Yang , David V. Horak , Takeshi Nogami , Shom Ponoth
发明人： Chih-Chao Yang , David V. Horak , Takeshi Nogami , Shom Ponoth
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/80 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/82 , H01L24/92 , H01L25/50 , H01L2224/05007 , H01L2224/05014 , H01L2224/0502 , H01L2224/05099 , H01L2224/05547 , H01L2224/05554 , H01L2224/0556 , H01L2224/05599 , H01L2224/08121 , H01L2224/80001 , H01L2224/80345 , H01L2224/80357 , H01L2224/80359 , H01L2224/80895 , H01L2224/80896 , H01L2224/821 , H01L2224/9212 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/1305 , H01L2924/1306 , H01L2924/00 , H01L2224/80 , H01L2224/82
摘要： Two substrates are brought together and placed in a plating bath. In one embodiment, a conductive material is plated in microscopic cavities present at the interface between a first metal pad and a second metal pad to form at least one interfacial plated metal liner portion that adheres to a surface of the first metal pad and a surface of the second metal pad. In another embodiment, at least one metal pad is recessed relative to a dielectric surface before being brought together. The two substrates are placed in a plating bath and a conductive material is plated in the cavity between the first metal pad and the second metal pad to form a contiguous plated metal liner layer that adheres to a surface of the first metal pad and a surface of the second metal pad.

10. 发明申请

US20130026635A1 Hybrid Copper Interconnect Structure and Method of Fabricating Same 有权
标题翻译：混合铜互连结构及其制造方法
公开(公告)号：US20130026635A1
公开(公告)日：2013-01-31
申请号：US13191999
申请日：2011-07-27
申请人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
发明人： Chih-Chao Yang , David V. Horak , Charles W. Koburger, III , Shom Ponoth
IPC分类号： H01L23/52 , H01L21/768
CPC分类号： H01L23/53238 , H01L21/76841 , H01L21/76843 , H01L21/76847 , H01L21/76877 , H01L21/76882 , H01L2924/0002 , H01L2924/00
摘要： A hybrid interconnect structure containing copper regions that have different impurities levels within a same opening is provided. In one embodiment, the interconnect structure includes a patterned dielectric material having at least one opening located therein. A dual material liner is located at least on sidewalls of the patterned dielectric material within the at least one opening. The structure further includes a first copper region having a first impurity level located within a bottom region of the at least one opening and a second copper region having a second impurity level located within a top region of the at least one opening and atop the first copper region. In accordance with the present disclosure, the first impurity level of the first copper region is different from the second impurity level of the second copper region. The copper regions containing the different impurities levels can be achieved utilizing a combination of physical vapor deposition of a copper region having a low impurity level (i.e., less than 20 ppm) and copper reflow, with electroplating another copper region having a high impurity level (i.e., 100 ppm or greater).
摘要翻译：提供了包含在相同开口内具有不同杂质水平的铜区域的混合互连结构。在一个实施例中，互连结构包括具有位于其中的至少一个开口的图案化电介质材料。双材料衬垫至少位于所述至少一个开口内的图案化电介质材料的侧壁上。所述结构还包括具有位于所述至少一个开口的底部区域内的第一杂质水平的第一铜区域和具有位于所述至少一个开口的顶部区域内的第二杂质水平的第二铜区域和位于所述第一铜地区。根据本公开，第一铜区域的第一杂质水平不同于第二铜区域的第二杂质水平。可以利用具有低杂质水平（即小于20ppm）的铜区域和铜回流的物理气相沉积与电镀另一个具有高杂质水平的铜区域的组合来实现含有不同杂质水平的铜区域即100ppm以上）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式