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1. 发明授权

US08674507B2 Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer 有权
标题翻译：晶圆级处理方法和结构，在一个晶圆上制造金和焊料两种互连
公开(公告)号：US08674507B2
公开(公告)日：2014-03-18
申请号：US10855086
申请日：2004-05-27
申请人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Chu-Fu Lin
发明人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Chu-Fu Lin
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/48 , H01L24/73 , H01L2224/0231 , H01L2224/0347 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/0603 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11912 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/48091 , H01L2224/48453 , H01L2224/48463 , H01L2224/731 , H01L2224/73207 , H01L2224/81411 , H01L2224/85444 , H01L2225/0651 , H01L2225/06513 , H01L2924/00013 , H01L2924/00014 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/14 , H01L2924/01016 , H01L2224/13099 , H01L2224/45099
摘要： A chip structure comprising a substrate, a plurality of wire bonding pads and a plurality of solder pads is provided. Gold bumps or gold pads can be formed on the wire bonding pads while solder bumps can be formed on the solder pads concurrently. Alternatively, both wire bonding pads and solder pads can be formed of the same metal stack.
摘要翻译：提供了包括基板，多个引线接合焊盘和多个焊盘的芯片结构。可以在引线接合焊盘上形成金焊盘或金焊盘，同时可以在焊盘上形成焊料凸块。或者，两个引线接合焊盘和焊盘可以由相同的金属堆叠形成。

2. 发明申请

US20050017355A1 Water level processing method and structure to manufacture two kinds of bumps, gold and solder, on one wafer 有权
标题翻译：水位处理方法和结构在一个晶圆上制造两种凸块，金和焊料
公开(公告)号：US20050017355A1
公开(公告)日：2005-01-27
申请号：US10855086
申请日：2004-05-27
申请人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Chu-Fu Lin
发明人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Chu-Fu Lin
IPC分类号： H01L21/60 , H01L23/485 , H01L25/065 , H01L23/48
CPC分类号： H01L25/0657 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/48 , H01L24/73 , H01L2224/0231 , H01L2224/0347 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/0603 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11912 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/48091 , H01L2224/48453 , H01L2224/48463 , H01L2224/731 , H01L2224/73207 , H01L2224/81411 , H01L2224/85444 , H01L2225/0651 , H01L2225/06513 , H01L2924/00013 , H01L2924/00014 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/14 , H01L2924/01016 , H01L2224/13099 , H01L2224/45099
摘要： A chip structure comprising a substrate, a plurality of wire bonding pads and a plurality of solder pads is provided. Gold bumps or gold pads can be formed on the wire bonding pads while solder bumps can be formed on the solder pads concurrently. Alternatively, both wire bonding pads and solder pads can be formed of the same metal stack.
摘要翻译：提供了包括基板，多个引线接合焊盘和多个焊盘的芯片结构。可以在引线接合焊盘上形成金焊盘或金焊盘，同时可以在焊盘上形成焊料凸块。或者，两个引线接合焊盘和焊盘可以由相同的金属堆叠形成。

3. 发明申请

US20070205520A1 CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：芯片包装及其制造方法
公开(公告)号：US20070205520A1
公开(公告)日：2007-09-06
申请号：US11681219
申请日：2007-03-02
申请人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Hsin-Jung Lo
发明人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Hsin-Jung Lo
IPC分类号： H01L23/48
CPC分类号： H01L24/12 , H01L23/3157 , H01L23/4985 , H01L23/66 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05024 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05558 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/05644 , H01L2224/05655 , H01L2224/06102 , H01L2224/1147 , H01L2224/11902 , H01L2224/11912 , H01L2224/13022 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13173 , H01L2224/13176 , H01L2224/13183 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48145 , H01L2224/48453 , H01L2224/48463 , H01L2224/48644 , H01L2224/48655 , H01L2224/48844 , H01L2224/48855 , H01L2224/73204 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06579 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： A chip package includes a semiconductor substrate, a first metal pad over the semiconductor substrate, and a second metal pad over the semiconductor substrate. In a case, the first metal pad is tape automated bonded thereto, and the second metal pad is solder bonded thereto. In another case, the first metal pad is tape automated bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is solder bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is solder bonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is wirebonded thereto.
摘要翻译：芯片封装包括半导体衬底，半导体衬底上的第一金属焊盘和半导体衬底上的第二金属焊盘。在这种情况下，第一金属焊盘是自动粘结到其上的，并且第二金属焊盘被焊接到其上。在另一种情况下，第一金属垫是胶带自动粘合到其上，并且第二金属垫与其键合。在另一种情况下，第一金属焊盘焊接到其上，并且第二金属焊盘与其键合。在另一种情况下，使用各向异性导电膜将第一金属焊盘接合到外部电路，并且将第二金属焊盘焊接到其上。在另一种情况下，使用各向异性导电膜将第一金属焊盘接合到外部电路，并且第二金属焊盘与其键合。

4. 发明授权

US08836146B2 Chip package and method for fabricating the same 有权
标题翻译：芯片封装及其制造方法
公开(公告)号：US08836146B2
公开(公告)日：2014-09-16
申请号：US11681219
申请日：2007-03-02
申请人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Hsin-Jung Lo
发明人： Chien-Kang Chou , Chiu-Ming Chou , Li-Ren Lin , Hsin-Jung Lo
IPC分类号： H01L23/48 , H01L23/00 , H01L23/31 , H01L25/065 , H01L23/66 , H01L23/498
CPC分类号： H01L24/12 , H01L23/3157 , H01L23/4985 , H01L23/66 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05024 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05558 , H01L2224/05559 , H01L2224/05568 , H01L2224/05572 , H01L2224/05644 , H01L2224/05655 , H01L2224/06102 , H01L2224/1147 , H01L2224/11902 , H01L2224/11912 , H01L2224/13022 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13173 , H01L2224/13176 , H01L2224/13183 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48145 , H01L2224/48453 , H01L2224/48463 , H01L2224/48644 , H01L2224/48655 , H01L2224/48844 , H01L2224/48855 , H01L2224/73204 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06579 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： A chip package includes a semiconductor substrate, a first metal pad over the semiconductor substrate, and a second metal pad over the semiconductor substrate. In a case, the first metal pad is tape automated bonded thereto, and the second metal pad is solder bonded thereto. In another case, the first metal pad is tape automated bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is solder bonded thereto, and the second metal pad is wirebonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is solder bonded thereto. In another case, the first metal pad is bonded to an external circuitry using an anisotropic conductive film, and the second metal pad is wirebonded thereto.
摘要翻译：芯片封装包括半导体衬底，半导体衬底上的第一金属焊盘和半导体衬底上的第二金属焊盘。在这种情况下，第一金属焊盘是自动粘结到其上的，并且第二金属焊盘被焊接到其上。在另一种情况下，第一金属垫是胶带自动粘合到其上，并且第二金属垫与其键合。在另一种情况下，第一金属焊盘焊接到其上，并且第二金属焊盘与其键合。在另一种情况下，使用各向异性导电膜将第一金属焊盘接合到外部电路，并且将第二金属焊盘焊接到其上。在另一种情况下，使用各向异性导电膜将第一金属焊盘接合到外部电路，并且第二金属焊盘与其键合。

5. 外观设计

USD585792S1 All terrain vehicle 有权
公开(公告)号：USD585792S1
公开(公告)日：2009-02-03
申请号：US29295070
申请日：2007-09-21
申请人： Chin-Wei Chao , Han-Pin Tsai , Li-Ren Lin , Kuo-Feng Huang , Cheng-Wei Lin , Nai-Yu Chen
设计人： Chin-Wei Chao , Han-Pin Tsai , Li-Ren Lin , Kuo-Feng Huang , Cheng-Wei Lin , Nai-Yu Chen

6. 发明授权

US06779760B2 Safety system for overhead transport vehicle 失效
标题翻译：架空运输车辆安全系统
公开(公告)号：US06779760B2
公开(公告)日：2004-08-24
申请号：US10324407
申请日：2002-12-19
申请人： Cheng-Chang Chang , Li-Ren Lin , Chien-Jung Huang
发明人： Cheng-Chang Chang , Li-Ren Lin , Chien-Jung Huang
IPC分类号： G01N900
CPC分类号： H01L21/6773 , G01S17/88 , G01V8/10 , H01L21/67259 , H01L21/67733 , H01L21/67736
摘要： A safety system for an overhead transport (OHT) vehicle. In one embodiment, the safety system may include a pair of safety panels provided on opposite sides of the load and unload ports on a tool or stocker. An overhead sensor is provided on the OHT and is operably connected to a light curtain on the tool. In the event that the overhead sensor detects an obstruction in the travel path of the OHT during loading of a pod or cassette into the tool or stocker, the light curtain transmits an emergency stop signal to the tool or stocker controller, which terminates further loading operation of the OHT. In another embodiment, the light curtain assumes the look-down sensing function of the overhead sensor in the event that tool components interfere with the look-down function of the overhead sensor.
摘要翻译：架空运输（OHT）车辆的安全系统。在一个实施例中，安全系统可以包括设置在工具或储料器上的负载和卸载端口的相对侧上的一对安全面板。在OHT上设置一个顶置式传感器，并可操作地连接到工具上的光幕。如果架空传感器检测到将货舱或卡盘装载到工具或储料架内的OHT的行进路径中的障碍物，则光幕将紧急停止信号传送到工具或储料柜控制器，从而终止进一步的装载操作的OHT。在另一个实施例中，在工具部件干扰架空传感器的俯视功能的情况下，光幕采用架空传感器的俯视感测功能。

7. 发明授权

US06484113B1 Container inspection system and method of using in semiconductor manufacturing 有权
标题翻译：集装箱检验系统及半导体制造中使用的方法
公开(公告)号：US06484113B1
公开(公告)日：2002-11-19
申请号：US09325612
申请日：1999-06-03
申请人： Yuh-Dean Tsai , Li-Ren Lin , Chen-Chieh Lan
发明人： Yuh-Dean Tsai , Li-Ren Lin , Chen-Chieh Lan
IPC分类号： G01N3700
CPC分类号： H01L21/67294
摘要： An automatic inspecting system for detecting the presence of and identifying whether the proper replacement container has been installed at a work station in a processing line, which automatic container checking system is capable of reading identifying information on the container, e.g., a bar-code, and comparing the information read with stored information indicative of a desired identification to determine whether there is a match. In the absence of a match, an alarm or other means can be used, by way of notification of a problem or to automatically stop the processing line.
摘要翻译：一种自动检查系统，用于检测是否已经在处理线中的工作站中安装了适当的更换容器，并且识别该自动容器检查系统是否能够读取容器上的识别信息，例如条形码，以及将所读取的信息与指示所需标识的存储信息进行比较，以确定是否存在匹配。在没有比赛的情况下，可以使用报警或其他手段，通过问题的通知或自动停止处理线。

8. 发明授权

US06256548B1 Method for controlling lots dispatches of tool groups 失效
标题翻译：控制工具组批量分配的方法
公开(公告)号：US06256548B1
公开(公告)日：2001-07-03
申请号：US09074539
申请日：1998-05-08
申请人： Li-Ren Lin
发明人： Li-Ren Lin
IPC分类号： G06F1900
CPC分类号： G05B19/418 , G05B2219/31266 , G06Q10/08 , Y02P90/02 , Y02P90/20 , Y02P90/28
摘要： The present invention discloses a method for controlling lots' dispatch of tool groups, and all the lots can be transferred to correct places for further processing. The lots are transferred to the storage places of the tool when there is only a single tool for the next process. A decision step is performed for deciding whether the storage places of the next tool group and the next-next tool group overlap when the next process contains a tool group. If there are overlapped storage places, then the lots will be moved to the overlapped storage place having minimum loading. When there is no overlapped storage place, the lots will be dispatched to the storage place having minimum loading among the next tool group. All the lots can be processed with at minimum moving steps, and all the tools perform their processes under balance loading whenever the productions increase or decrease.
摘要翻译：本发明公开了一种用于控制工具组批量分配的方法，所有批次都可以转移到正确的位置进行进一步处理。当只有一个工具用于下一个过程时，批次将被转移到工具的存储位置。执行决定步骤，用于当下一个进程包含工具组时，决定下一个工具组和下一个下一个工具组的存储位置是否重叠。如果存在重叠的存放位置，则批次将被移动到具有最小负载的重叠存储位置。当没有重叠的存放位置时，批次将被分派到下一个工具组中具有最小装载量的存储位置。所有的批次可以以最小的移动步骤进行处理，并且所有工具在生产增加或减少的情况下均衡加载。

9. 发明授权

US07261508B2 Method for aligning a loadport to an overhead hoist transport system 有权
标题翻译：将负载运动对准起重运输系统的方法
公开(公告)号：US07261508B2
公开(公告)日：2007-08-28
申请号：US10127111
申请日：2002-04-22
申请人： Li-Ren Lin , Shi-Ming Wang , Cheng-Chang Chang
发明人： Li-Ren Lin , Shi-Ming Wang , Cheng-Chang Chang
IPC分类号： H21L21/677
CPC分类号： H01L21/67775
摘要： A method for aligning a loadport of a process machine to an overhead hoist transport (OHT) system which can be carried out by first providing an OHT rail overhanging a cleanroom floor; setting a reference point in the cleanroom in proximity to the OHT rail; marking on the cleanroom floor boundary reference lines for each row of process machines based on the reference point; positioning a process machine on the cleanroom floor with a boundary line of the machine aligned to the boundary reference line; mounting a loadport onto the process machine; and fine tuning a center line of the loadport to a reference line on the floor that is 200 mm apart from and parallel to the boundary reference line.
摘要翻译：一种用于将加工机器的加载口与顶置式起重机运输（OHT）系统对准的方法，其可以通过首先提供悬挂在净室地板上的OHT导轨来执行; 在OHT铁路附近的无尘室设置参考点; 基于参考点，对每行加工机床的洁净室地板边界参考线进行标记; 将加工机器放置在洁净室地板上，机器的边界线与边界参考线对齐; 将加载端口安装到加工机器上; 并将负载端口的中心线微调到距离边界参考线200平方米的地板上的参考线。

10. 发明授权

US06318946B1 Interlock system for semiconductor wafer transport apparatus 有权
标题翻译：半导体晶圆输送装置的联锁系统
公开(公告)号：US06318946B1
公开(公告)日：2001-11-20
申请号：US09283064
申请日：1999-03-31
申请人： Yuh-Dean Tsay , Shih-Chieh Liao , Li-Ren Lin , Wen-Yao Chen
发明人： Yuh-Dean Tsay , Shih-Chieh Liao , Li-Ren Lin , Wen-Yao Chen
IPC分类号： B65H100
CPC分类号： H01L21/67276 , Y10S414/14
摘要： An interlock system prevents collision of handling equipment and damage to wafers in an automated wafer transport apparatus during manual control by an operator. Sensors are used to sense when wafer transport arms and wafer stage are both in their home positions. A controller is responsive to the sensors for operating the lockout system such that attempted activation of the transport arm by the operator is locked out unless both the stage and the arms are in their home positions. The lockout system preferably comprises normally closed electrical relays.
摘要翻译：互锁系统在操作者的手动控制期间防止处理设备的碰撞和自动晶片输送设备中的晶片损坏。传感器用于检测晶片传输臂和晶片台是否处于其原始位置。控制器响应于用于操作锁定系统的传感器，使得操作者对传送臂的尝试激活被锁定，除非平台和臂都处于其原始位置。锁定系统优选地包括常闭电继电器。

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