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1. 发明申请

US20060033188A1 Electronic component packaging 审中-公开
标题翻译：电子元件包装
公开(公告)号：US20060033188A1
公开(公告)日：2006-02-16
申请号：US11011426
申请日：2004-12-14
申请人： Chien-Hua Chen , Troy Schwinabart , David Craig
发明人： Chien-Hua Chen , Troy Schwinabart , David Craig
IPC分类号： H01L23/02 , H01L21/52
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01033 , H01L2924/01049 , H01L2924/01067 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/3011 , H01L2924/00
摘要： One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component and including a mechanically planarized sealing surface, and a lid including a mechanically planarized sealing surface sealed to the planarized sealing surface of the base so as to define a hermetic seal therebetween.
摘要翻译：电子部件包装系统的一个实施例包括适于支撑电子部件并包括机械平面化的密封表面的基座和包括密封到基座的平坦化密封表面的机械平面化的密封表面的盖子，以便限定气密密封之间。

2. 发明申请

US20070274669A1 Fabrication tool for bonding 有权
标题翻译：用于粘接的加工工具
公开(公告)号：US20070274669A1
公开(公告)日：2007-11-29
申请号：US11413333
申请日：2006-04-28
申请人： Chien-Hua Chen , Troy Schwinabart , William Atkinson
发明人： Chien-Hua Chen , Troy Schwinabart , William Atkinson
IPC分类号： G02B6/00
CPC分类号： H01L21/67092
摘要： A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
摘要翻译：在第一和第二装置表面已被等离子体激活之后，制造工具将第一装置表面压靠第二装置表面，以将第一装置表面与第二装置表面结合。制造工具包括粘合活塞，以在第一装置表面施加力以将第一装置表面压靠第二装置表面。制造工具还包括位于接合活塞和第一装置表面之间的压力板。制造工具还包括机构，以确保由第一装置表面经由压板施加的结合活塞的力最初施加在第一装置表面上的一个或多个第一位置上，随后在一个或多个第二位置上施加第一个设备表面。

3. 发明申请

US20060189035A1 Placement of Absorbing Material in a Semiconductor Device 有权
标题翻译：吸收材料放置在半导体器件中
公开(公告)号：US20060189035A1
公开(公告)日：2006-08-24
申请号：US11276875
申请日：2006-03-17
申请人： Chien-Hua Chen , David Crald , Troy Schwinabart
发明人： Chien-Hua Chen , David Crald , Troy Schwinabart
IPC分类号： H01L21/52
CPC分类号： H01L23/26 , H01L2224/48091 , H01L2224/73265 , H01L2924/15312 , H01L2924/00014
摘要： A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.
摘要翻译：提供一种半导体器件，其包括具有顶部构件和底部构件的气密密封的壳体。将半导体管芯封装在壳体内，并且吸收材料位于半导体管芯下方。

4. 发明申请

US20070087462A1 Method of forming a device package having edge interconnect pad 失效
标题翻译：形成具有边缘互连焊盘的器件封装的方法
公开(公告)号：US20070087462A1
公开(公告)日：2007-04-19
申请号：US11251412
申请日：2005-10-14
申请人： Charles Haluzak , Chien-Hua Chen , David Craig
发明人： Charles Haluzak , Chien-Hua Chen , David Craig
IPC分类号： H01L21/00
CPC分类号： B81C1/00301 , B81B2207/092 , H05K3/3442 , H05K2201/10454 , H05K2201/1053 , Y02P70/613
摘要： A method of forming a device package having an edge interconnect pad includes forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer. The method continues with depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via. The method also includes covering the array of MEMS devices and the conductive material with a passivation layer.
摘要翻译：形成具有边缘互连焊盘的器件封装的方法包括形成覆盖至少一个电连接到下层的导电通孔的MEMS器件的阵列。该方法继续通过镶嵌工艺沉积与MEMS器件阵列共面的衬底上的导电材料，该导电材料耦合到至少一个导电通孔。该方法还包括用钝化层覆盖MEMS器件阵列和导电材料。

5. 发明申请

US20060146426A1 Micro-optoelectromechanical system packages for a light modulator and methods of making the same 有权
标题翻译：用于光调制器的微光机电系统封装及其制造方法
公开(公告)号：US20060146426A1
公开(公告)日：2006-07-06
申请号：US11029316
申请日：2005-01-04
申请人： Chien-Hua Chen , David Craig , Charles Haluzak
发明人： Chien-Hua Chen , David Craig , Charles Haluzak
IPC分类号： G02B7/02
CPC分类号： H01L31/0203 , H01L2224/48091 , H04N5/7458 , H01L2924/00014
摘要： A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package, the secondary package comprising a seal and a second transparent lid; and an optical material disposed between the first transparent lid and the second transparent lid, where the optical material is a solid or liquid. An alternatively micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger package containing the sealed modulator package; and a desiccant or getter material disposed inside the secondary package with the modulator package.
摘要翻译：用于光调制器的微光电机电系统（MOEMS）封装包括密封的调制器封装，其包含密封在第一透明盖下的光调制器; 包含密封调制器封装件的次级较大封装，所述二次封装包括密封件和第二透明盖; 以及设置在第一透明盖和第二透明盖之间的光学材料，其中光学材料是固体或液体。用于光调制器的替代的微光电机电系统（MOEMS）封装包括密封的调制器封装，其包含密封在第一透明盖下的光调制器; 包含密封调制器封装的二次，较大封装; 以及设置在具有调制器封装的二次封装内的干燥剂或吸气材料。

6. 发明申请

US20060094149A1 Micro electrical mechanical system 有权
标题翻译：微机电系统
公开(公告)号：US20060094149A1
公开(公告)日：2006-05-04
申请号：US10976452
申请日：2004-10-29
申请人： Chien-Hua Chen , David Craig , Charles Haluzak
发明人： Chien-Hua Chen , David Craig , Charles Haluzak
IPC分类号： H01L21/00
CPC分类号： B81B7/007 , H01L2924/16235
摘要： This disclosure relates to lids and methods for forming and using them. One embodiment of these lids enables MEMS protected by the lids to be smaller. Another of these lids enables testing of a group of conjoined, lidded MEMS. Also, processes for forming and using these lids are also disclosed. One of these processes forms lids from a lid precursor residing over an assembly MEMS.
摘要翻译：本公开涉及用于形成和使用它们的盖和方法。这些盖子的一个实施例使得由盖子保护的MEMS更小。这些盖子中的另一个使得能够测试一组结合的有盖MEMS。此外，还公开了用于形成和使用这些盖的方法。这些过程中的一个从位于组件MEMS上的盖子前体形成盖子。

7. 发明申请

US20060081994A1 Assembly 有权
标题翻译：部件
公开(公告)号：US20060081994A1
公开(公告)日：2006-04-20
申请号：US11038374
申请日：2005-01-18
申请人： David Craig , Chien-Hua Chen , Charles Haluzak , Ronnie Yenchik
发明人： David Craig , Chien-Hua Chen , Charles Haluzak , Ronnie Yenchik
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： B81C1/00269 , B81C2203/019 , H01L2924/0002 , H01L2924/00
摘要： An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
摘要翻译：组件包括衬底，耦合到衬底的器件; 形成在所述基板上的环; 以及形成在所述基板上的一个或多个接合焊盘，其中所述环和焊盘由相同的材料形成。

8. 发明申请

US20070015353A1 Electrically connecting substrate with electrical device 有权
标题翻译：电气连接基板与电气设备
公开(公告)号：US20070015353A1
公开(公告)日：2007-01-18
申请号：US11181479
申请日：2005-07-14
申请人： David Craig , Chien-Hua Chen
发明人： David Craig , Chien-Hua Chen
IPC分类号： H01L21/44
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/80 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48471 , H01L2224/48475 , H01L2224/48599 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85205 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
摘要翻译：基板与安装在基板上的电气装置电连接。在导线的第一端和基板的焊盘之间形成球接合。线内形成反向运动回路。在电线的第二端和电气装置的接合焊盘之间形成接合。

9. 发明申请

US20050045974A1 Die carrier 失效
标题翻译：模具载体
公开(公告)号：US20050045974A1
公开(公告)日：2005-03-03
申请号：US10650572
申请日：2003-08-27
申请人： Ronald Hellekson , Chien-Hua Chen , William Boucher , Joshua Smith , David Craig , Gary Watts
发明人： Ronald Hellekson , Chien-Hua Chen , William Boucher , Joshua Smith , David Craig , Gary Watts
IPC分类号： B81B7/02 , B81B7/00 , B81C99/00 , H01L23/473 , H01L27/14
CPC分类号： B81B7/0093 , B01L2200/10 , B01L2200/12 , B81B7/0058 , B81B7/0061 , H01L2924/0002 , H01L2924/00
摘要： A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.
摘要翻译：模具载体具有主体，该主体具有适于附接到基底模具的主表面。主体至少部分地限定流体室。填充口和排出口各自流体连接到流体室。

10. 发明申请

US20050275925A1 Light modulator 失效
标题翻译：光调制器
公开(公告)号：US20050275925A1
公开(公告)日：2005-12-15
申请号：US10855744
申请日：2004-05-27
申请人： Chien-Hua Chen , David Craig
发明人： Chien-Hua Chen , David Craig
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： G02B26/0833
摘要： A method for forming a light modulator includes supporting a plurality of optical devices on a substrate, and attaching a sheet of glass over the optical devices. The method also includes slicing the sheet of glass into a plurality of pieces of glass.
摘要翻译：一种形成光调制器的方法，包括在基片上支撑多个光学器件，并在玻璃器件上安装玻璃片。该方法还包括将玻璃片切成多个玻璃片。

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