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1. 外观设计

USD670681S1 Host for videophone 有权
标题翻译：主持视频电话
公开(公告)号：USD670681S1
公开(公告)日：2012-11-13
申请号：US29407042
申请日：2011-11-22
申请人： Chia-Yuan Chang , Ting-Han Huang , Kang-Wen Lin , Chih-Yin Lin , Ya-Chyi Chou , Kao-Yu Hsu
设计人： Chia-Yuan Chang , Ting-Han Huang , Kang-Wen Lin , Chih-Yin Lin , Ya-Chyi Chou , Kao-Yu Hsu

2. 外观设计

USD670674S1 Wireless telephone 有权
公开(公告)号：USD670674S1
公开(公告)日：2012-11-13
申请号：US29406996
申请日：2011-11-22
申请人： Ya-Chyi Chou , Kao-Yu Hsu , Kang-Wen Lin
设计人： Ya-Chyi Chou , Kao-Yu Hsu , Kang-Wen Lin

3. 外观设计

USD676017S1 Base for wireless telephone 有权
标题翻译：基地为无线电话
公开(公告)号：USD676017S1
公开(公告)日：2013-02-12
申请号：US29406997
申请日：2011-11-22
申请人： Ya-Chyi Chou , Kao-Yu Hsu , Kang-Wen Lin
设计人： Ya-Chyi Chou , Kao-Yu Hsu , Kang-Wen Lin

4. 外观设计

USD530316S1 Switch hub 有权
标题翻译：交换机集线器
公开(公告)号：USD530316S1
公开(公告)日：2006-10-17
申请号：US29233940
申请日：2005-07-13
申请人： Kao-Yu Hsu , Ya-Chyi Chou
设计人： Kao-Yu Hsu , Ya-Chyi Chou

5. 发明授权

US07009847B1 Connector concealment mechanism for computer peripheral device 失效
标题翻译：计算机外围设备连接器隐藏机制
公开(公告)号：US07009847B1
公开(公告)日：2006-03-07
申请号：US11018048
申请日：2004-12-20
申请人： Kuo-Chang Wu , Yi-Min Tseng , Hsin-Chiang Ho , Ya-Chyi Chou , Kao-Yu Hsu
发明人： Kuo-Chang Wu , Yi-Min Tseng , Hsin-Chiang Ho , Ya-Chyi Chou , Kao-Yu Hsu
IPC分类号： H05K7/16 , H01R13/44
CPC分类号： H01R13/60 , H01R13/44 , H01R35/00
摘要： A connector concealment mechanism for computer peripheral device is proposed, which is designed for use in conjunction with a computer peripheral device equipped with an external connector for the connector to be concealable into the casing of the computer peripheral device when not in use, and be easily ejected out of the computer casing for use to connect the computer peripheral device to a computer unit. This feature allows the computer peripheral device to be more advantageous to use than the prior art due to the fact that it allows the user to conceal the connector into the casing of the computer peripheral device when not in use, without having using a separable cap which would easily get lost as in the case of the prior art, thus making the use of the computer peripheral device more convenient and trouble-free than prior art.
摘要翻译：提出了一种用于计算机外围设备的连接器隐藏机构，其被设计用于配备有用于连接器的外部连接器的计算机外围设备，以便在不使用时隐藏到计算机外围设备的外壳中，并且容易从计算机外壳中弹出以用于将计算机外围设备连接到计算机单元。该特征允许计算机外围设备比现有技术更有利于使用它，因为它允许用户在不使用时将连接器隐藏在计算机外围设备的外壳中，而不使用可分离的帽，与现有技术的情况相比容易迷失，从而使计算机外围设备的使用比现有技术更方便和无故障。

6. 发明授权

US06462421B1 Multichip module 有权
标题翻译：多芯片模块
公开(公告)号：US06462421B1
公开(公告)日：2002-10-08
申请号：US09546627
申请日：2000-04-10
申请人： Kao-Yu Hsu , Su Tao
发明人： Kao-Yu Hsu , Su Tao
IPC分类号： H01L2940
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/30107 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A multichip module mainly comprises a first chip disposed on the upper surface of a substrate by wire bonding and a second chip disposed on the lower surface of the substrate by flip-chip bonding wherein the first chip and the second chip are of the same type. The upper surface of the substrate is provided with a plurality of wire bondable pads for electrical connecting to the first chip. The lower surface of the substrate is provided with a plurality of flip-chip pads for electrical connecting to the second chip. According to the present invention, the first and second chips are both oriented face up (with their bonding pads up with respect to the substrate) for bonding to the substrate. Thus, address assignment of the bonding pads on the two semiconductor chips conforms to each other. Consequently, circuit layout on the upper and lower surfaces of the substrate can use substantially the same design wherein common conductive traces on the upper and lower surfaces of the substrate are electrically connected by plated through holes.
摘要翻译：多芯片模块主要包括通过引线键合设置在基板的上表面上的第一芯片和通过倒装芯片接合设置在基板的下表面上的第二芯片，其中第一芯片和第二芯片是相同类型的。衬底的上表面设置有用于电连接到第一芯片的多个可焊接焊盘。衬底的下表面设置有用于电连接到第二芯片的多个倒装芯片焊盘。根据本发明，第一和第二芯片既面向上（其相对于基板的接合焊盘向上），用于粘合到基板。因此，两个半导体芯片上的接合焊盘的地址分配彼此一致。因此，在基板的上表面和下表面上的电路布局可以使用基本上相同的设计，其中基板的上表面和下表面上的公共导电迹线通过电镀通孔电连接。

7. 发明授权

US06338813B1 Molding method for BGA semiconductor chip package 有权
标题翻译： BGA半导体芯片封装的成型方法
公开(公告)号：US06338813B1
公开(公告)日：2002-01-15
申请号：US09418569
申请日：1999-10-15
申请人： Kao-Yu Hsu , Chun Hung Lin , Tao-Yu Chen
发明人： Kao-Yu Hsu , Chun Hung Lin , Tao-Yu Chen
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0652 , H01L2224/05599 , H01L2224/32145 , H01L2224/45099 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01079 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A molding method for a BGA semiconductor chip package comprising a substrate supporting an array of chips having two lines of bonding pads formed at two respective side thereof. The molding method comprises the steps of: (A) providing a molding apparatus comprising a molding die having a molding cavity and at least two runners connected to the molding cavity; (B) closing and clamping the molding die in a manner that the chips are located in the molding cavity thereof; (C) transferring a molding compound into the molding cavity wherein each chip is arranged in a manner that the two lines of bonding pads thereof are substantially perpendicular to the flowing direction of the molding compound; (D) curing the molding compound; and (E) unclamping and opening the molding die to take out the molded product.
摘要翻译：一种用于BGA半导体芯片封装的模制方法，其包括支撑形成在其两侧的两行接合焊盘的芯片阵列的衬底。成型方法包括以下步骤：（A）提供模制设备，其包括具有模制腔的模制模具和连接到模腔的至少两个浇道; （B）以芯片位于其模腔内的方式封闭和夹紧模具; （C）将模塑料转移到模制腔中，其中每个芯片以这样的方式排列，使得其两条接合焊盘基本上垂直于模塑料的流动方向; （D）固化模塑料; 和（E）松开和打开模具以取出模制产品。

8. 发明授权

US07688971B2 Network telephone expansion seat 失效
标题翻译：网络电话扩展座
公开(公告)号：US07688971B2
公开(公告)日：2010-03-30
申请号：US11496494
申请日：2006-08-01
申请人： Chang-Hsiung Lee , Yi-Hsiu Tang , Kao-Yu Hsu
发明人： Chang-Hsiung Lee , Yi-Hsiu Tang , Kao-Yu Hsu
IPC分类号： H04M1/00 , H04M9/00
CPC分类号： H04M1/04
摘要： A network telephone expansion seat including a housing and a signal conversion module is provided. The housing has a bearing portion for disposing a network telephone thereon. The signal conversion module disposed inside the housing has a circuit substrate. At least one connection interface for transmitting data is disposed on the circuit substrate for connecting the network telephone to transmit data. Meanwhile, the circuit substrate is connected to peripherals such as a printer, a facsimile machine, a card reader, and an MP3 player via the connection interface, thereby expanding the functions of the network telephone.
摘要翻译：提供一种包括外壳和信号转换模块的网络电话扩展座。壳体具有用于在其上布置网络电话的轴承部分。设置在壳体内部的信号转换模块具有电路基板。用于发送数据的至少一个连接接口设置在电路基板上，用于连接网络电话以发送数据。同时，电路基板经由连接接口连接到诸如打印机，传真机，读卡器和MP3播放器的外围设备，从而扩展了网络电话的功能。

9. 外观设计

USD545768S1 Switch 有权
公开(公告)号：USD545768S1
公开(公告)日：2007-07-03
申请号：US29262534
申请日：2006-07-06
申请人： Kao-Yu Hsu
设计人： Kao-Yu Hsu

10. 发明授权

US06262490B1 Substrate strip for use in packaging semiconductor chips 有权
标题翻译：用于封装半导体芯片的衬底条
公开(公告)号：US06262490B1
公开(公告)日：2001-07-17
申请号：US09434261
申请日：1999-11-05
申请人： Kao-Yu Hsu , Shih Chang Lee , Wei-Chun Kung
发明人： Kao-Yu Hsu , Shih Chang Lee , Wei-Chun Kung
IPC分类号： H01L2302
CPC分类号： H01L23/13 , H01L21/565 , H01L23/4985 , H01L2924/0002 , H01L2924/00
摘要： A flexible substrate strip comprises a plurality of substrate units adapted for mounting semiconductor chips. The surface of the flexible substrate strip is provided with a plurality of degating regions at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips. The present invention is characterized in that each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation. The degating regions have a degating region material formed thereon with the buffer regions not coated with the degating region material. The adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate. The present invention also provides a method of making the flexible substrate strip.
摘要翻译：柔性衬底条包括适于安装半导体芯片的多个衬底单元。柔性衬底带的表面在位置处设置有多个脱色区域，使得当衬底条被放置时，用于将半导体芯片封装在密封材料中的模具浇口和浇口的边缘完全配合在脱气区域内在半导体芯片封装期间的模具中。本发明的特征在于，在封装期间，每个去角区域在对应于模具的浇口的位置处具有缓冲区域。脱墨区域具有形成在其上的脱气区域材料，其中缓冲区域未涂覆有脱色区域材料。密封剂材料和脱气区域材料之间的粘合力小于密封剂材料和基底之间的粘合力。本发明还提供了制造柔性衬底条的方法。

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