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1. 发明授权

US06338813B1 Molding method for BGA semiconductor chip package 有权
标题翻译： BGA半导体芯片封装的成型方法
公开(公告)号：US06338813B1
公开(公告)日：2002-01-15
申请号：US09418569
申请日：1999-10-15
申请人： Kao-Yu Hsu , Chun Hung Lin , Tao-Yu Chen
发明人： Kao-Yu Hsu , Chun Hung Lin , Tao-Yu Chen
IPC分类号： B29C4502
CPC分类号： B29C45/14655 , H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0652 , H01L2224/05599 , H01L2224/32145 , H01L2224/45099 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01079 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A molding method for a BGA semiconductor chip package comprising a substrate supporting an array of chips having two lines of bonding pads formed at two respective side thereof. The molding method comprises the steps of: (A) providing a molding apparatus comprising a molding die having a molding cavity and at least two runners connected to the molding cavity; (B) closing and clamping the molding die in a manner that the chips are located in the molding cavity thereof; (C) transferring a molding compound into the molding cavity wherein each chip is arranged in a manner that the two lines of bonding pads thereof are substantially perpendicular to the flowing direction of the molding compound; (D) curing the molding compound; and (E) unclamping and opening the molding die to take out the molded product.
摘要翻译：一种用于BGA半导体芯片封装的模制方法，其包括支撑形成在其两侧的两行接合焊盘的芯片阵列的衬底。成型方法包括以下步骤：（A）提供模制设备，其包括具有模制腔的模制模具和连接到模腔的至少两个浇道; （B）以芯片位于其模腔内的方式封闭和夹紧模具; （C）将模塑料转移到模制腔中，其中每个芯片以这样的方式排列，使得其两条接合焊盘基本上垂直于模塑料的流动方向; （D）固化模塑料; 和（E）松开和打开模具以取出模制产品。

2. 发明授权

US06316828B1 Structure of a solder mask for the circuit module of a BGA substrate 有权
标题翻译： BGA基板的电路模块的焊接掩模的结构
公开(公告)号：US06316828B1
公开(公告)日：2001-11-13
申请号：US09436657
申请日：1999-11-09
申请人： Su Tao , Tao-Yu Chen , Kao-Yu Hsu
发明人： Su Tao , Tao-Yu Chen , Kao-Yu Hsu
IPC分类号： H01L2334
CPC分类号： H01L23/50 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/10162 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The structure of a solder mask for the circuit module of a BGA substrate mainly comprises a power ring, a ground ring, a plurality of holes, a plurality of first holes and a plurality of second holes. The power ring and the ground ring are arranged between the chip area and the wire bonding area; the first openings are arranged on the power ring and the ground ring for receiving the electronic part. Thus the substrate meets the requirement of keeping the electronic part close to the chip. The second openings are arranged over the associated holes which electrically connect to the power ring and the ground ring by traces; these holes do need not to electrically connect the power layer and the ground layer of the substrate. The openings of the present invention use the power ring, ground ring and the holes of the substrate to electrically connect to the electronic parts, so that the present invention does not need to provide other holes or traces thus simplifying the structure of the substrate. The distance of two openings of the present invention can, moreover, be adjusted according to the length of the electronic part.
摘要翻译：用于BGA基板的电路模块的焊料掩模的结构主要包括电源环，接地环，多个孔，多个第一孔和多个第二孔。电源环和接地环布置在芯片区域和引线接合区域之间; 第一开口布置在电源环和用于接收电子部件的接地环上。因此，基板满足保持电子部件靠近芯片的要求。第二开口布置在相关联的孔上，其通过迹线电连接到电源环和接地环; 这些孔不需要电连接基板的功率层和接地层。本发明的开口使用功率环，接地环和基板的孔电连接到电子部件，使得本发明不需要提供其它孔或迹线，因此简化了基板的结构。此外，本发明的两个开口的距离可以根据电子部件的长度进行调整。

3. 发明授权

US5982625A Semiconductor packaging device 失效
标题翻译：半导体封装器件
公开(公告)号：US5982625A
公开(公告)日：1999-11-09
申请号：US44076
申请日：1998-03-19
申请人： Kun-Ching Chen , Tao-Yu Chen , Yung-I Yeh , Wu-Chang Wang , Chun-Che Lee , Chun-Hsiung Huang , Shyh-Ing Wu
发明人： Kun-Ching Chen , Tao-Yu Chen , Yung-I Yeh , Wu-Chang Wang , Chun-Che Lee , Chun-Hsiung Huang , Shyh-Ing Wu
IPC分类号： H01L21/56 , H05K7/02 , H01L23/28
CPC分类号： H01L21/565 , H01L2924/0002
摘要： A semiconductor packaging device includes a printed circuit board substrate, a mold gate formed on a periphery of the printed circuit board substrate through which a package encapsulant is poured to enclose electric elements mounted on a side of the printed circuit board, and a layer of non-metallic material covered on the side of the printed circuit board substrate in the mold gate area. The package encapsulant, after hardened, is bonded with the layer of non-metallic material, and the bonded package encapsulant/the layer of non-metallic material is degatable from the mold gate.
摘要翻译：半导体封装装置包括印刷电路板基板，形成在印刷电路板基板周边上的模具浇口，通过该模具浇注封装密封剂以封装安装在印刷电路板一侧的电气元件，金属材料覆盖在模具浇口区域中的印刷电路板基板的侧面上。封装密封剂在硬化之后与非金属材料层结合，并且结合的封装密封剂/非金属材料层可从模具浇口脱模。

4. 发明授权

US07168352B2 Process for sawing substrate strip 有权
标题翻译：锯切基板条的工艺
公开(公告)号：US07168352B2
公开(公告)日：2007-01-30
申请号：US09394918
申请日：1999-09-13
申请人： Jau-Yuen Su , Tao-Yu Chen , Su Tao
发明人： Jau-Yuen Su , Tao-Yu Chen , Su Tao
IPC分类号： B26D1/00
CPC分类号： H01L21/67092 , B23D59/002 , Y10T83/04 , Y10T83/0495 , Y10T83/05 , Y10T83/0548 , Y10T83/0572 , Y10T83/531
摘要： A process for sawing a substrate strip marks corresponding to substrate areas of substrate strips which are arranged side-by-side on a plate. A saw machine is mechanically moved to the substrate areas and positioned by the alignment marks of corresponding substrate areas for cutting the substrate areas of the substrate strips in the first phase. Then the saw machine is further mechanically moved to the substrate areas again and is positioned by the alignment marks of corresponding substrate areas again for cutting the substrate areas of the substrate strips in the second phase. Therefore, an error in any of the substrate areas in the first phase and second phase will not accumulate to the subsequent substrate areas in the substrate strip.
摘要翻译：用于锯切对应于在板上并排布置的衬底条的衬底区域的衬底条的标记的方法。锯床机械地移动到基板区域并且由对应的基板区域的对准标记定位，以便在第一阶段中切割基板条的基板区域。然后再次将锯床机械地移动到基板区域，并再次通过对应基板区域的对准标记定位，以在第二阶段中切割基板条带的基板区域。因此，第一相和第二相中的任何一个衬底区域中的误差将不会累积到衬底条中的随后的衬底区域。

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