专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080024995A1 THERMAL CONDUCTING MEDIUM PROTECTOR 失效
标题翻译：导热介质保护器
公开(公告)号：US20080024995A1
公开(公告)日：2008-01-31
申请号：US11692926
申请日：2007-03-29
申请人： Chi-Wei Tien , Chang-Yuan Wu , Ching Ya Tu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Ching Ya Tu
IPC分类号： H05K7/20
CPC分类号： H01L23/40 , H01L21/4882 , H01L23/3737 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.
摘要翻译：热传导介质保护器适用于组装到载体上，以保护设置在载体上的导热介质。导热介质保护器包括外壳和盖板。壳体在壳体的一侧具有第一弯曲部分和开口。当载体放置在壳体的侧表面上时，导热介质位于开口中。盖板具有第二弯曲部分，第一侧面，第二弯曲部分位于该第一弯曲部分上，第二侧面与第一侧相对并且枢转到壳体。当盖板沿着第二侧旋转，然后穿过设置在壳体的侧表面上的载体时，该弯曲部分彼此弯曲以将托架保持在壳体和盖板之间。

2. 发明授权

US07623350B2 Thermal conducting medium protector 失效
标题翻译：导热介质保护器
公开(公告)号：US07623350B2
公开(公告)日：2009-11-24
申请号：US11692926
申请日：2007-03-29
申请人： Chi-Wei Tien , Chang-Yuan Wu , Ching-Ya Tu
发明人： Chi-Wei Tien , Chang-Yuan Wu , Ching-Ya Tu
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/40 , H01L21/4882 , H01L23/3737 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.
摘要翻译：热传导介质保护器适用于组装到载体上，以保护设置在载体上的导热介质。导热介质保护器包括外壳和盖板。壳体在壳体的一侧具有第一弯曲部分和开口。当载体放置在壳体的侧表面上时，导热介质位于开口中。盖板具有第二弯曲部分，第一侧面，第二弯曲部分位于该第一弯曲部分上，第二侧面与第一侧相对并且枢转到壳体。当盖板沿着第二侧旋转，然后穿过设置在壳体的侧表面上的载体时，该弯曲部分彼此弯曲以将托架保持在壳体和盖板之间。

3. 发明授权

US09226427B2 Docking station 有权
标题翻译：对接站
公开(公告)号：US09226427B2
公开(公告)日：2015-12-29
申请号：US13710475
申请日：2012-12-11
申请人： Chung-Luen Liu , Jenq-Haur Pan , Chang-Yuan Wu , Ching-Ya Tu , Ching-Chung Chen
发明人： Chung-Luen Liu , Jenq-Haur Pan , Chang-Yuan Wu , Ching-Ya Tu , Ching-Chung Chen
IPC分类号： H05K7/20 , G06F1/20 , G06F1/16 , H01L23/473
CPC分类号： H05K7/20145 , G06F1/1632 , G06F1/20
摘要： A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.
摘要翻译：适用于便携式电子设备的坞站包括基座，支撑部件和第一风扇。基座包括气流引导斜面。支撑部件设置在基座上并具有气流引导结构，其中便携式电子设备被配置为支撑在支撑部件上。第一风扇设置在基座中并且提供冷却气流，其中气流引导斜面和气流引导结构引导冷却气流流入便携式电子设备。

4. 发明申请

US20130027873A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20130027873A1
公开(公告)日：2013-01-31
申请号：US13558359
申请日：2012-07-26
申请人： Ying-Shan Chen , Ching-Ya Tu , Chang-Yuan Wu , Hui-Lian Chang
发明人： Ying-Shan Chen , Ching-Ya Tu , Chang-Yuan Wu , Hui-Lian Chang
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/203
摘要： An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.
摘要翻译：电子设备包括主体和旋转底座。旋转底座具有第一通气口并且在主体处枢转并且适于相对于主体在操作位置和缩回位置之间旋转。当旋转底座位于操作位置时，第一排气孔露出主体，当旋转底座位于缩回位置时，第一排气口缩回主体。

5. 发明申请

US20180228050A1 ELECTRONIC DEVICE AND METHOD FOR CONTROLLING FAN OPERATION 审中-公开
公开(公告)号：US20180228050A1
公开(公告)日：2018-08-09
申请号：US15854828
申请日：2017-12-27
申请人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
发明人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00
摘要： An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

6. 发明申请

US20170034901A1 HEAT DISSIPATION STRUCTURE 审中-公开
标题翻译：散热结构
公开(公告)号：US20170034901A1
公开(公告)日：2017-02-02
申请号：US15293303
申请日：2016-10-14
申请人： Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
发明人： Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
IPC分类号： H05K1/02 , H01L23/367 , H01L23/373 , G06F1/20
CPC分类号： H05K1/0203 , F28F3/00 , G06F1/203 , H01L23/367 , H01L23/3675 , H01L23/3733 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
摘要翻译：散热结构包括第一导热片，第二导热片和网状导热层。网状导热层粘接在第一导热片和第二导热片之间。网状导热层包括多个第一导热介质和多个第二导热介质，第一导热介质和第二导热介质交替布置，并且每个的导热性第一导热介质小于第二导热介质的热导率。

7. 发明申请

US20130148298A1 DOCKING STATION 有权
标题翻译：锁定站
公开(公告)号：US20130148298A1
公开(公告)日：2013-06-13
申请号：US13710475
申请日：2012-12-11
申请人： Chung-Luen Liu , Jenq-Haur Pan , Chang-Yuan Wu , Ching-Ya Tu , Ching-Chung Chen
发明人： Chung-Luen Liu , Jenq-Haur Pan , Chang-Yuan Wu , Ching-Ya Tu , Ching-Chung Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20145 , G06F1/1632 , G06F1/20
摘要： A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.
摘要翻译：适用于便携式电子设备的坞站包括底座，支撑部件和第一风扇。基座包括气流引导斜面。支撑部件设置在基座上并具有气流引导结构，其中便携式电子设备被配置为支撑在支撑部件上。第一风扇设置在基座中并且提供冷却气流，其中气流引导斜面和气流引导结构引导冷却气流流入便携式电子设备。

8. 发明申请

US20190059177A1 HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20190059177A1
公开(公告)日：2019-02-21
申请号：US15894886
申请日：2018-02-12
申请人： Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh
发明人： Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh
IPC分类号： H05K7/20 , G06F1/20 , F04D29/28 , F04D29/42
摘要： A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.

9. 发明申请

US20140076529A1 HEAT DISSIPATION STRUCTURE 审中-公开
标题翻译：散热结构
公开(公告)号：US20140076529A1
公开(公告)日：2014-03-20
申请号：US14016212
申请日：2013-09-02
申请人： Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
发明人： Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
IPC分类号： F28F3/00
CPC分类号： H05K1/0203 , F28F3/00 , G06F1/203 , H01L23/367 , H01L23/3675 , H01L23/3733 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
摘要翻译：散热结构包括第一导热片，第二导热片和网状导热层。网状导热层粘接在第一导热片和第二导热片之间。网状导热层包括多个第一导热介质和多个第二导热介质，第一导热介质和第二导热介质交替布置，并且每个的导热性第一导热介质小于第二导热介质的热导率。

10. 发明授权

US10936028B2 Electronic device having a deformation sensor on a fan module of a fan and using a controller to monitor the deformation sensor and control operation of the fan based on a deformation signal of the sensor 有权
公开(公告)号：US10936028B2
公开(公告)日：2021-03-02
申请号：US15854828
申请日：2017-12-27
申请人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
发明人： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
IPC分类号： G06F1/20 , H05K7/20 , H05K5/00 , F04D27/00 , F04D25/08
摘要： An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式