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    • 8. 发明申请
    • Hard Mask Removal for Semiconductor Devices
    • 半导体器件的硬掩模去除
    • US20110223753A1
    • 2011-09-15
    • US12724157
    • 2010-03-15
    • Sheng-Hsiung WangFu-Kai YangYuan-Ching PengChi-Cheng Hung
    • Sheng-Hsiung WangFu-Kai YangYuan-Ching PengChi-Cheng Hung
    • H01L21/3065H01L21/28
    • H01L21/31144H01L21/28017H01L21/31116H01L29/66795
    • A method of removing a hard mask during fabrication of semiconductor devices is provided. A protective layer, such as a bottom anti-reflective coating (BARC) layer or other dielectric layer, is formed over structures formed on a substrate, wherein spacers are formed alongside the structures. In an embodiment, the structures are gate electrodes having a hard mask formed thereon and the spacers are spacers formed alongside the gate electrodes. A photoresist layer is formed over the protective layer, and the photoresist layer may be patterned to remove a portion of the photoresist layer over portions of the protective layer. Thereafter, an etch-back process is performed, such that the protective layer adjacent to the spacers remains to substantially protect the spacers. The hard mask is then removed while the protective layer protects the spacers.
    • 提供了在制造半导体器件期间去除硬掩模的方法。 在衬底上形成的结构上形成诸如底部抗反射涂层(BARC)层或其它电介质层的保护层,其中间隔物沿着结构形成。 在一个实施例中,结构是具有形成在其上的硬掩模的栅电极,并且间隔物是与栅电极一起形成的间隔物。 在保护层上形成光致抗蚀剂层,并且可以对光致抗蚀剂层进行图案化以在保护层的部分上去除光致抗蚀剂层的一部分。 此后,执行回蚀处理,使得与间隔物相邻的保护层保持基本上保护间隔物。 然后去除硬掩模,同时保护层保护间隔物。