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1. 发明授权

US08304666B2 Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof 有权
标题翻译：单个通孔中多个同轴引线在基片中的结构及其制造方法
公开(公告)号：US08304666B2
公开(公告)日：2012-11-06
申请号：US12468058
申请日：2009-05-19
申请人： Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
发明人： Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K3/429 , H05K2201/09636 , H05K2201/09645 , H05K2201/09809
摘要： A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
摘要翻译：多个同轴引线在电路基板中的单个通孔内形成，以增强垂直互连的密度，以便匹配在衬底的顶层电路层和底层电路层之间的较高密度多层电路互连的需求。同轴引线在单个通孔中提供多个同轴引线之间的电磁干扰屏蔽。

2. 发明申请

US20100163296A1 STRUCTURE OF MULTIPLE COAXIAL LEADS WITHIN SINGLE VIA IN SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：多个同轴引线在单片基板上的结构及其制造方法
公开(公告)号：US20100163296A1
公开(公告)日：2010-07-01
申请号：US12468058
申请日：2009-05-19
申请人： Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
发明人： Cheng-Ta Ko , Min-Lin Lee , Wei-Chung Lo , Shur-Fen Liu , Jinn-Shing King , Shinn-Juh Lai , Yu-Hua Chen
IPC分类号： H05K1/11 , B44C1/22
CPC分类号： H05K1/0222 , H05K3/429 , H05K2201/09636 , H05K2201/09645 , H05K2201/09809
摘要： A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
摘要翻译：多个同轴引线在电路基板中的单个通孔内形成，以增强垂直互连的密度，以便匹配在衬底的顶层电路层和底层电路层之间的较高密度多层电路互连的需求。同轴引线在单个通孔中的多个同轴引线之间提供电磁干扰屏蔽。

3. 发明申请

US20050146840A1 Structure of an interleaving striped capacitor substrate 失效
标题翻译：交错条纹电容器基板的结构
公开(公告)号：US20050146840A1
公开(公告)日：2005-07-07
申请号：US11039924
申请日：2005-01-24
申请人： Min-Lin Lee , Chin-Sun Shyu , Shur-Fen Liu , Jing-Pin Pan , Jinn-Shing King
发明人： Min-Lin Lee , Chin-Sun Shyu , Shur-Fen Liu , Jing-Pin Pan , Jinn-Shing King
IPC分类号： H01G4/20 , H01G4/35 , H05K1/16
CPC分类号： H01G4/35 , H01G4/20 , H05K1/162 , H05K2201/0187 , H05K2201/0195 , H05K2201/0355
摘要： An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.
摘要翻译：公开了一种用于按压式印刷电路板的交错条纹电容器基底结构。为了满足现代电子系统的高频，高速和高密度要求，交错条纹电容器基板结构使用不同介电系数的几种介电材料制成介电层。一个电介质层可以堆叠在另一个上以形成多层电容器基板，使得单个电容器基板可以提供去耦电容器所需的最高电容以抑制高频噪声信号，并且高电平基板所需的低介电系数基板，速度信号传输。这同时实现了降低高频传输时间并抑制高频噪声的效果。

4. 发明授权

US07102876B2 Structure of an interleaving striped capacitor substrate 失效
标题翻译：交错条纹电容器基板的结构
公开(公告)号：US07102876B2
公开(公告)日：2006-09-05
申请号：US11039924
申请日：2005-01-24
申请人： Min-Lin Lee , Chin-Sun Shyu , Shur-Fen Liu , Jing-Pin Pan , Jinn-Shing King
发明人： Min-Lin Lee , Chin-Sun Shyu , Shur-Fen Liu , Jing-Pin Pan , Jinn-Shing King
IPC分类号： H01G4/20
CPC分类号： H01G4/35 , H01G4/20 , H05K1/162 , H05K2201/0187 , H05K2201/0195 , H05K2201/0355
摘要： An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.
摘要翻译：公开了一种用于按压式印刷电路板的交错条纹电容器基底结构。为了满足现代电子系统的高频，高速和高密度要求，交错条纹电容器基板结构使用不同介电系数的几种介电材料制成介电层。一个电介质层可以堆叠在另一个上以形成多层电容器基板，使得单个电容器基板可以提供去耦电容器所需的最高电容以抑制高频噪声信号，并且高电平基板所需的低介电系数基板，速度信号传输。这同时实现了降低高频传输时间并抑制高频噪声的效果。

5. 发明授权

US09051429B2 Polyamic acid resin composition and method for forming polyimide resin 有权
标题翻译：聚酰胺酸树脂组合物和聚酰亚胺树脂的形成方法
公开(公告)号：US09051429B2
公开(公告)日：2015-06-09
申请号：US12605787
申请日：2009-10-26
申请人： Li-Ming Chang , Charng-Shing Lu , Shur-Fen Liu , Jinn-Shing King
发明人： Li-Ming Chang , Charng-Shing Lu , Shur-Fen Liu , Jinn-Shing King
IPC分类号： C08K5/00 , C08G73/10 , B32B7/12 , B32B15/08 , B32B27/34 , C08L79/08 , C08K5/134 , C08K5/3432 , C08K5/3437 , C08K5/3445 , C08K5/3447 , C08K5/3492
CPC分类号： C08G73/1071 , B32B7/12 , B32B15/08 , B32B27/18 , B32B27/281 , B32B27/34 , B32B2307/206 , B32B2307/306 , B32B2307/50 , B32B2307/546 , B32B2457/00 , C08G73/1067 , C08K5/1345 , C08K5/3432 , C08K5/3437 , C08K5/3445 , C08K5/3447 , C08K5/3492 , C08L79/08 , C08L2203/20
摘要： Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.
摘要翻译：公开了聚酰胺酸树脂组合物的添加剂，其包括酯 - 酚化合物，咪唑化合物和咪唑化合物以外的杂环芳族胺化合物。常规聚酰胺酸树脂组合物的高环化温度和长的环化时间可以通过本发明添加剂降低和缩短。此外，金属箔和由环化形成的聚酰亚胺树脂具有优异的粘合强度，高平坦度和优异的电性能。

6. 发明授权

US08101038B2 Double-sided metal clad laminate and fabrication method thereof 有权
标题翻译：双面金属包覆层压板及其制造方法
公开(公告)号：US08101038B2
公开(公告)日：2012-01-24
申请号：US12404311
申请日：2009-03-15
申请人： Charng-Shing Lu , Shu-Chu Shih , Jinn-Shing King , Shur-Fen Liu
发明人： Charng-Shing Lu , Shu-Chu Shih , Jinn-Shing King , Shur-Fen Liu
IPC分类号： B32B37/00 , B32B37/02 , B32B37/10 , B32B37/15
CPC分类号： B32B15/08 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/24 , B32B27/281 , B32B27/34 , B32B37/02 , B32B37/153 , B32B2250/40 , B32B2264/02 , B32B2264/104 , B32B2264/107 , B32B2307/306 , B32B2307/734 , B32B2309/105 , B32B2379/08 , B32B2457/00 , H05K1/036 , H05K3/022 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , Y10T156/1089 , Y10T156/1092 , Y10T428/24942 , Y10T428/31522 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.
摘要翻译：本发明公开了双面金属包覆层压板及其制造方法。将多个聚酰胺酸涂层共挤出在第一金属箔上并加热酰亚胺化以提供多层聚酰亚胺膜。将第二金属箔热压在多层聚酰亚胺膜上，从而提供双面金属箔层压板。聚酰胺酸涂料包括分别具有S1，S2和S3的表面张力的第一，第二和第三聚酰胺酸涂料，其满足S1> S2> S3的关系，其中第一聚酰胺酸涂层是直接涂覆的涂层在第一金属箔上。

7. 发明授权

US07271206B2 Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有足够柔韧性，高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US07271206B2
公开(公告)日：2007-09-18
申请号：US11003411
申请日：2004-12-06
申请人： Shur-Fen Liu , Meng-Huei Chen , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Jinn-Shing King
IPC分类号： C08L63/00
CPC分类号： C08K3/08 , C08K3/34 , H01G4/206 , H05K1/162 , H05K2201/0209 , H05K2201/0323 , H05K2201/09309 , C08L63/00
摘要： The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.
摘要翻译：本发明公开了具有足够的柔软性，高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的结合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）导电粉末，例如导电炭黑; d）至少一种大分子增韧剂; e）大分子分散剂; 和f）添加剂如稀释剂，粘合促进剂，硬化剂，硬化剂促进剂和有机溶剂。

8. 发明授权

US07008981B2 Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US07008981B2
公开(公告)日：2006-03-07
申请号：US10742815
申请日：2003-12-23
申请人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
IPC分类号： C08L63/00
CPC分类号： C08G59/3218 , H01G4/206 , H05K1/162 , H05K2201/0209
摘要： The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
摘要翻译：本发明公开了具有高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的粘合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）至少一种大分子增韧剂; d）大分子分散剂; 和e）添加剂如稀释剂，粘合促进剂，催化剂和有机溶剂。

9. 发明申请

US20050137293A1 Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof 有权
标题翻译：具有高介电常数和高热稳定性的有机 - 无机杂化组合物及其固化组合物
公开(公告)号：US20050137293A1
公开(公告)日：2005-06-23
申请号：US10742815
申请日：2003-12-23
申请人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
发明人： Shur-Fen Liu , Meng-Huei Chen , Bih-Yih Chen , Yi-Kai Chang , Jinn-Shing King
IPC分类号： C08G59/32 , C08L63/00 , H01G4/20 , H05K1/16
CPC分类号： C08G59/3218 , H01G4/206 , H05K1/162 , H05K2201/0209
摘要： The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
摘要翻译：本发明公开了具有高介电常数的有机 - 无机杂化组合物，其可以用作具有高热稳定性和高介电常数的粘合层。组合物包括a）高Tg环氧树脂体系; b）具有两个粒度分布的铁电陶瓷颗粒，其中一个属于纳米级; c）至少一种大分子增韧剂; d）大分子分散剂; 和e）添加剂如稀释剂，粘合促进剂，催化剂和有机溶剂。

10. 发明授权

US6117951A Polyimide composition for LOC adhesive tapes 有权
标题翻译： LOC胶带的聚酰亚胺组合物
公开(公告)号：US6117951A
公开(公告)日：2000-09-12
申请号：US253836
申请日：1999-02-19
申请人： Shur-Fen Liu , Jinn-Shing King , Jing-Pin Pan
发明人： Shur-Fen Liu , Jinn-Shing King , Jing-Pin Pan
IPC分类号： C09J179/08 , C08L79/08
CPC分类号： C09J179/08
摘要： An adhesive tape for lead-on-chip (LOC) IC applications containing a polyamide-based adhesive composition which is the reaction product from a reaction mixture of: (a) a pre-imidized polyamic acid; and (b) a bismaleimide that has been modified by a barbituric acid of a derivative of barbituric acid to become a barbituric acid modified bismaleimide. The pre-imidized polyamic acid is a reaction product from a reaction mixture that contains a polyamic acid and a cyclizing agent. The polyamide-based adhesive composition provides all the desirable heat resistance and other mechanical and dielectric characteristics. But, most significantly, its microscopic rheological properties are adjusted such that excellent contact is achieved between the resin molecules and the lead frame surface while eliminating or at least minimizing the extent of adhesive overflow, which can substantially reduce the reliability of the final IC product.
摘要翻译：一种用于片上（LOC）IC应用的胶带，其包含聚酰胺基粘合剂组合物，其为来自以下反应混合物的反应产物：（a）预酰亚胺化的聚酰胺酸; 和（b）已经被巴比妥酸衍生物的巴比妥酸改性成为巴比妥酸改性双马来酰亚胺的双马来酰亚胺。预酰亚胺化聚酰胺酸是含有聚酰胺酸和环化剂的反应混合物的反应产物。聚酰胺基粘合剂组合物提供所有期望的耐热性和其它机械和介电特性。但是，最显着的是，其微观流变特性被调节，使得在树脂分子和引线框架表面之间获得良好的接触，同时消除或至少最小化粘合剂溢出的程度，这可以显着降低最终IC产品的可靠性。

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