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1. 发明授权

US09051429B2 Polyamic acid resin composition and method for forming polyimide resin 有权
标题翻译：聚酰胺酸树脂组合物和聚酰亚胺树脂的形成方法
公开(公告)号：US09051429B2
公开(公告)日：2015-06-09
申请号：US12605787
申请日：2009-10-26
申请人： Li-Ming Chang , Charng-Shing Lu , Shur-Fen Liu , Jinn-Shing King
发明人： Li-Ming Chang , Charng-Shing Lu , Shur-Fen Liu , Jinn-Shing King
IPC分类号： C08K5/00 , C08G73/10 , B32B7/12 , B32B15/08 , B32B27/34 , C08L79/08 , C08K5/134 , C08K5/3432 , C08K5/3437 , C08K5/3445 , C08K5/3447 , C08K5/3492
CPC分类号： C08G73/1071 , B32B7/12 , B32B15/08 , B32B27/18 , B32B27/281 , B32B27/34 , B32B2307/206 , B32B2307/306 , B32B2307/50 , B32B2307/546 , B32B2457/00 , C08G73/1067 , C08K5/1345 , C08K5/3432 , C08K5/3437 , C08K5/3445 , C08K5/3447 , C08K5/3492 , C08L79/08 , C08L2203/20
摘要： Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.
摘要翻译：公开了聚酰胺酸树脂组合物的添加剂，其包括酯 - 酚化合物，咪唑化合物和咪唑化合物以外的杂环芳族胺化合物。常规聚酰胺酸树脂组合物的高环化温度和长的环化时间可以通过本发明添加剂降低和缩短。此外，金属箔和由环化形成的聚酰亚胺树脂具有优异的粘合强度，高平坦度和优异的电性能。

2. 发明申请

US20110054124A1 POLYAMIC ACID RESIN COMPOSITION AND METHOD FOR FORMING POLYIMIDE RESIN 有权
标题翻译：聚酰胺树脂组合物和形成聚酰胺树脂的方法
公开(公告)号：US20110054124A1
公开(公告)日：2011-03-03
申请号：US12605787
申请日：2009-10-26
申请人： Li-Ming Chang , Charng-Shing Lu , Shur-Fen Liu , Jinn-Shing King
发明人： Li-Ming Chang , Charng-Shing Lu , Shur-Fen Liu , Jinn-Shing King
IPC分类号： C08L77/06
CPC分类号： C08G73/1071 , B32B7/12 , B32B15/08 , B32B27/18 , B32B27/281 , B32B27/34 , B32B2307/206 , B32B2307/306 , B32B2307/50 , B32B2307/546 , B32B2457/00 , C08G73/1067 , C08K5/1345 , C08K5/3432 , C08K5/3437 , C08K5/3445 , C08K5/3447 , C08K5/3492 , C08L79/08 , C08L2203/20
摘要： Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property
摘要翻译：公开了聚酰胺酸树脂组合物的添加剂，其包括酯 - 酚化合物，咪唑化合物和咪唑化合物以外的杂环芳族胺化合物。常规聚酰胺酸树脂组合物的高环化温度和长的环化时间可以通过本发明添加剂降低和缩短。此外，金属箔和由环化形成的聚酰亚胺树脂具有优异的粘合强度，高平坦度和优异的电性能

3. 发明授权

US08101038B2 Double-sided metal clad laminate and fabrication method thereof 有权
标题翻译：双面金属包覆层压板及其制造方法
公开(公告)号：US08101038B2
公开(公告)日：2012-01-24
申请号：US12404311
申请日：2009-03-15
申请人： Charng-Shing Lu , Shu-Chu Shih , Jinn-Shing King , Shur-Fen Liu
发明人： Charng-Shing Lu , Shu-Chu Shih , Jinn-Shing King , Shur-Fen Liu
IPC分类号： B32B37/00 , B32B37/02 , B32B37/10 , B32B37/15
CPC分类号： B32B15/08 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/24 , B32B27/281 , B32B27/34 , B32B37/02 , B32B37/153 , B32B2250/40 , B32B2264/02 , B32B2264/104 , B32B2264/107 , B32B2307/306 , B32B2307/734 , B32B2309/105 , B32B2379/08 , B32B2457/00 , H05K1/036 , H05K3/022 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , Y10T156/1089 , Y10T156/1092 , Y10T428/24942 , Y10T428/31522 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.
摘要翻译：本发明公开了双面金属包覆层压板及其制造方法。将多个聚酰胺酸涂层共挤出在第一金属箔上并加热酰亚胺化以提供多层聚酰亚胺膜。将第二金属箔热压在多层聚酰亚胺膜上，从而提供双面金属箔层压板。聚酰胺酸涂料包括分别具有S1，S2和S3的表面张力的第一，第二和第三聚酰胺酸涂料，其满足S1> S2> S3的关系，其中第一聚酰胺酸涂层是直接涂覆的涂层在第一金属箔上。

4. 发明申请

US20120156459A1 POLYIMIDE FILM LAMINATE AND METAL LAMINATE EMPLOYING THE SAME 有权
标题翻译：聚酰亚胺薄膜和采用其的金属层压板
公开(公告)号：US20120156459A1
公开(公告)日：2012-06-21
申请号：US13158703
申请日：2011-06-13
申请人： Charng-Shing Lu , Si-Yi Chin , Shur-Fen Liu , Jinn-Shing King
发明人： Charng-Shing Lu , Si-Yi Chin , Shur-Fen Liu , Jinn-Shing King
IPC分类号： B32B15/088 , B32B15/00 , B32B27/20 , B32B7/02
CPC分类号： B32B15/08 , B32B7/02 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B2262/106 , B32B2264/10 , B32B2264/105 , B32B2307/20 , B32B2307/302 , B32B2307/306 , B32B2307/50 , B32B2457/00 , Y10T428/24942 , Y10T428/2495 , Y10T428/24975 , Y10T428/31681 , Y10T428/31721
摘要： The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.
摘要翻译：本发明提供一种聚酰亚胺膜层压体和使用其的金属覆层层压体。聚酰亚胺膜层压体包括第一聚酰亚胺膜，设置在第一聚酰亚胺膜上的第二聚酰亚胺膜和设置在第二聚酰亚胺膜上的第三聚酰亚胺膜。特别地，第一聚酰亚胺膜具有介于约0.2-0.9瓦特/米K之间的热导率和大于约3KV的击穿电压，第二聚酰亚胺膜具有大于约1瓦/米·K的热导率，以及第三聚酰亚胺膜具有介于约0.2-0.9瓦特/米K之间的热导率和大于约3KV的击穿电压。

5. 发明授权

US08652622B2 Polyimide film laminate and metal laminate employing the same 有权
标题翻译：聚酰亚胺膜层叠体及使用其的金属层叠体
公开(公告)号：US08652622B2
公开(公告)日：2014-02-18
申请号：US13158703
申请日：2011-06-13
申请人： Charng-Shing Lu , Si-Yi Chin , Shur-Fen Liu , Jinn-Shing King
发明人： Charng-Shing Lu , Si-Yi Chin , Shur-Fen Liu , Jinn-Shing King
IPC分类号： B32B7/02
CPC分类号： B32B15/08 , B32B7/02 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B2262/106 , B32B2264/10 , B32B2264/105 , B32B2307/20 , B32B2307/302 , B32B2307/306 , B32B2307/50 , B32B2457/00 , Y10T428/24942 , Y10T428/2495 , Y10T428/24975 , Y10T428/31681 , Y10T428/31721
摘要： The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.
摘要翻译：本发明提供一种聚酰亚胺膜层压体和使用其的金属覆层层压体。聚酰亚胺膜层压体包括第一聚酰亚胺膜，设置在第一聚酰亚胺膜上的第二聚酰亚胺膜和设置在第二聚酰亚胺膜上的第三聚酰亚胺膜。特别地，第一聚酰亚胺膜具有介于约0.2-0.9瓦特/米K之间的热导率和大于约3KV的击穿电压，第二聚酰亚胺膜具有大于约1瓦/米·K的热导率，以及第三聚酰亚胺膜具有介于约0.2-0.9瓦特/米K之间的热导率和大于约3KV的击穿电压。

6. 发明申请

US20100035066A1 DOUBLE-SIDED METAL CLAD LAMINATE AND FABRICATION METHOD THEREOF 有权
标题翻译：双面金属层压板及其制造方法
公开(公告)号：US20100035066A1
公开(公告)日：2010-02-11
申请号：US12404311
申请日：2009-03-15
申请人： Charng-Shing Lu , Shu-Chu Shih , Jinn-Shing King , Shur-Fen Liu
发明人： Charng-Shing Lu , Shu-Chu Shih , Jinn-Shing King , Shur-Fen Liu
IPC分类号： B32B27/38 , B32B15/08 , B32B37/06 , B32B37/10
CPC分类号： B32B15/08 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/24 , B32B27/281 , B32B27/34 , B32B37/02 , B32B37/153 , B32B2250/40 , B32B2264/02 , B32B2264/104 , B32B2264/107 , B32B2307/306 , B32B2307/734 , B32B2309/105 , B32B2379/08 , B32B2457/00 , H05K1/036 , H05K3/022 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , Y10T156/1089 , Y10T156/1092 , Y10T428/24942 , Y10T428/31522 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.
摘要翻译：本发明公开了双面金属包覆层压板及其制造方法。将多个聚酰胺酸涂层共挤出在第一金属箔上并加热酰亚胺化以提供多层聚酰亚胺膜。将第二金属箔热压在多层聚酰亚胺膜上，从而提供双面金属箔层压板。聚酰胺酸涂料包括分别具有S1，S2和S3的表面张力的第一，第二和第三聚酰胺酸涂料，其满足S1> S2> S3的关系，其中第一聚酰胺酸涂层是直接涂覆的涂层在第一金属箔上。

7. 发明申请

US20050282958A1 Coating composition of positive photosensitive polyimide 审中-公开
标题翻译：正光敏聚酰亚胺的涂料组合物
公开(公告)号：US20050282958A1
公开(公告)日：2005-12-22
申请号：US10868821
申请日：2004-06-17
申请人： Jyh-Long Jeng , Jinn-Shing King , Charng-Shing Lu
发明人： Jyh-Long Jeng , Jinn-Shing King , Charng-Shing Lu
IPC分类号： C08K3/00 , C08K5/42
CPC分类号： C08K5/42 , C08L79/08
摘要： A coating composition of positive photosensitive polyimide is disclosed, which includes an organic solvent and the following components dissolved in the organic solvent: (a) a polyimide having a phenolic hydroxyl group or carboxyl group at the end of a principal chain of the polymer; (b) a compound having a phenolic hydroxyl group; and (c) a quinonediazide sulfonate as a photosensitive agent. The amount of the components (b) and (c) are 1-50 parts by weight per 100 parts by weight the component (a) in the coating composition. A film of the coating composition can be developed with an alkaline aqueous solution, which has a high photosensitivity, excellent resolution, low post-cure temperature, high film residual rate in thickness, and a pattern having a tapered-angle at the cross section. The coating solution can be used for forming an insulating layer in displays or in other suitable applications.
摘要翻译：公开了一种正性感光性聚酰亚胺的涂料组合物，其包含有机溶剂和溶解在有机溶剂中的以下成分：（a）在聚合物主链末端具有酚羟基或羧基的聚酰亚胺; （b）具有酚羟基的化合物; 和（c）醌二叠氮化物磺酸盐作为感光剂。组分（b）和（c）的量相对于涂料组合物中的组分（a）每100重量份为1-50重量份。涂料组合物的膜可以用碱性水溶液显影，其具有高的光敏性，优异的分辨率，低固化温度，高的膜厚残留率和在截面上具有锥角的图案。涂布溶液可用于在显示器中或在其它合适的应用中形成绝缘层。

8. 发明授权

US07374861B2 Negative photoresist composition 有权
标题翻译：负光致抗蚀剂组合物
公开(公告)号：US07374861B2
公开(公告)日：2008-05-20
申请号：US11365489
申请日：2006-03-02
申请人： Jyh-Long Jeng , Jeng-Yu Tsai , Charng-Shing Lu , Jinn-Shing King
发明人： Jyh-Long Jeng , Jeng-Yu Tsai , Charng-Shing Lu , Jinn-Shing King
IPC分类号： G03F7/037 , G03F7/027
CPC分类号： G03F7/037 , G03F7/027 , H05K3/287 , Y10S430/117 , Y10S430/121 , Y10S430/148
摘要： The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C═C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.
摘要翻译：本发明涉及负光致抗蚀剂组合物，其主要由a）具有羧基侧基的聚酰亚胺组成，其中一部分羧基与（甲基）丙烯酸缩水甘油酯单体反应形成共价键。光致抗蚀剂组合物还含有b）具有叔氨基和C-C双键的单体，其与聚酰亚胺的剩余羟基形成离子键。光致抗蚀剂组合物还包含c）光引发剂，其也称为光敏剂。组分a）至c）都溶解在溶剂中。

9. 发明授权

US07459518B2 Thermoplastic polyimide composition 有权
标题翻译：热塑性聚酰亚胺组合物
公开(公告)号：US07459518B2
公开(公告)日：2008-12-02
申请号：US11543123
申请日：2006-10-05
申请人： Shu-Chu Shih , Charng-Shing Lu , Jinn-Shing King
发明人： Shu-Chu Shih , Charng-Shing Lu , Jinn-Shing King
IPC分类号： C08G73/10 , C08G69/16 , C08K3/26 , C08K3/34 , C08K3/36
CPC分类号： C08G73/106 , C08L79/08 , H05K3/386 , H05K3/389 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209
摘要： A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.
摘要翻译：一种热塑性聚酰亚胺组合物，其包含硅烷改性的聚酰亚胺（A）; 和极性溶剂（B），其中通过使聚酰亚胺（a）和含环氧基的硅烷（b）反应得到硅烷改性的聚酰亚胺（A）。聚酰亚胺（a）含有由通式I和II表示的重复单元，其中式II的重复单元的摩尔分数为至少10％，X表示四价芳基，Ar 1表示二价芳基，Ar 2 表示含有OH或COOH基团的二价芳基。

10. 发明申请

US20070166535A1 Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same 审中-公开
标题翻译：热塑性聚酰亚胺组合物和使用其的双面柔性覆铜层压板
公开(公告)号：US20070166535A1
公开(公告)日：2007-07-19
申请号：US11511314
申请日：2006-08-29
申请人： Charng-Shing Lu , Jinn-Shing King , Shu-Shu Shih
发明人： Charng-Shing Lu , Jinn-Shing King , Shu-Shu Shih
IPC分类号： B32B15/08 , B32B15/20
CPC分类号： B32B15/08 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/281 , B32B2307/306 , B32B2457/08 , C08G73/1042 , C08G73/16 , H05K1/0346 , H05K1/036 , H05K2201/0154 , H05K2201/068 , Y10T428/269 , Y10T428/31681 , Y10T428/31721
摘要： A thermoplastic polyimide composition characterized by improved thermal resistance, adhesion and flatness for use in copper clad laminates. The polyimide contains repeating units represented by the formulae I and II, wherein each of Ar1 and Ar2, independently, represents a bivalent aromatic group, and X represents a quadrivalent aromatic group.
摘要翻译：一种热塑性聚酰亚胺组合物，其特征在于用于铜包层压板中的耐热性，粘合性和平整性。聚酰亚胺含有由式I和II表示的重复单元，其中Ar 1和Ar 2各自独立地表示二价芳基，X表示四价芳族组。

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