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    • 4. 发明授权
    • Card reading device for a vehicle
    • 车载卡读取装置
    • US08104687B2
    • 2012-01-31
    • US12741122
    • 2008-10-29
    • Hailong HuLixin XiaoTang Yu
    • Hailong HuLixin XiaoTang Yu
    • G06K19/06
    • G06K13/08G06K13/0806
    • A card reading device for vehicles having a base plate, a sliding plate part, and a spring part. The base plate has a vaulted groove, an opening surface located at one end, and an annular groove provided on the base surface of said vaulted groove. The sliding plate part is provided above the vaulted groove of the base plate, A bulging structure, contacts an inserted card and drives the sliding plate part in a direction vertical to the opening phase and facing away from the opening surface. A sliding part is provided on the side of the sliding plate part pointing toward the vaulted roof of the base plate. The sliding part slides in the direction parallel to the opening surface and is guided by the annular groove and restricted in the positioning thereof. The spring element and the base plate and the sliding plate part have contact with one another, and force is applied to the directed vertically to the opening surface. Fixing of the card and also easy removal are made possible.
    • 一种用于具有基板,滑板部分和弹簧部分的车辆的卡读取装置。 基板具有拱形槽,位于一端的开口表面和设置在所述拱形槽的基面上的环形槽。 滑动板部分设置在基板的拱形槽的上方,凸出结构与插入的卡接触,并且在垂直于开放相位的方向上驱动滑板部分并且背离开口表面。 滑动部分设置在指向基板的拱顶的滑动板部分的侧面上。 滑动部件在平行于开口表面的方向上滑动并被环形槽引导并限制其定位。 弹簧元件和基板以及滑动板部彼此接触,并且向垂直于开口表面的方向施加力。 卡的固定也易于拆卸成为可能。
    • 7. 发明申请
    • Card Reading Device For A Vehicle
    • 车辆读卡器
    • US20100276494A1
    • 2010-11-04
    • US12741122
    • 2008-10-29
    • Tang YuLixin XiaoHailong Hu
    • Tang YuLixin XiaoHailong Hu
    • G06K7/015
    • G06K13/08G06K13/0806
    • A card reading device for vehicles having a base plate, a sliding plate part, and a spring part. The base plate has a vaulted groove, an opening surface located at one end, and an annular groove provided on the base surface of said vaulted groove, The sliding plate part is provided above the vaulted groove of the base plate, A bulging structure, contacts an inserted card and drives the sliding plate part in a direction vertical to the opening phase and facing away from the opening surface. A sliding part is provided on the side of the sliding plate part pointing toward the vaulted roof of the base plate. The sliding part slides in the direction parallel to the opening surface and is guided by the annular groove and restricted in the positioning thereof. The spring element and the base plate and the sliding plate part have contact with one another, and force is applied to the directed vertically to the opening surface. Fixing of the card and also easy removal are made possible.
    • 一种用于具有基板,滑板部分和弹簧部分的车辆的卡读取装置。 基板具有拱形槽,位于一端的开口表面和设置在所述拱形槽的基面上的环形槽。滑板部设置在基板的拱形槽的上方,凸出结构,触点 插入卡片,并且沿垂直于开放相位的方向驱动滑动板部件并且背离开口表面。 滑动部分设置在指向基板的拱顶的滑动板部分的侧面上。 滑动部件在平行于开口表面的方向上滑动并被环形槽引导并限制其定位。 弹簧元件和基板以及滑动板部彼此接触,并且向垂直于开口表面的方向施加力。 卡的固定也易于拆卸成为可能。
    • 8. 发明授权
    • Method for recycling monitoring control wafers
    • 回收监控控制晶片的方法
    • US6136613A
    • 2000-10-24
    • US82659
    • 1998-05-21
    • Jen-Tsung LinTsung-Hsien HanTang Yu
    • Jen-Tsung LinTsung-Hsien HanTang Yu
    • H01L23/544H01J37/317
    • H01L22/34H01J2237/31701Y10S134/902
    • A method for recycling monitoring control wafers includes cleaning the wafers after performing a sheet resistance (Rs) measurement on a bare silicon monitoring control wafer of an ion implanter, and then converting the wafer into a recyclable control wafer. A recyclable control wafer for a thermal wave (TW) measurement of destruction can be obtained by forming a screen layer on the wafer, performing a TW measurement, performing ion implantation by the monitoring recipe, performing TW measurement again, performing ion drive-in to drive implanted ions into the deeper areas of the substrate, removing the screen layer, and then forming another screen layer on the wafer to put the wafer into the recycling process of a TW measurement.
    • 回收监控控制晶片的方法包括在离子注入机的裸硅监控控制晶片上执行薄层电阻(Rs)测量之后清洗晶片,然后将晶片转换成可回收的控制晶片。 可以通过在晶片上形成屏幕层,执行TW测量,通过监视配方执行离子注入,再次执行TW测量,执行离子驱入,获得用于热波(TW)破坏测量的可回收控制晶片 将注入的离子驱动到衬底的较深区域,去除屏幕层,然后在晶片上形成另一个屏幕层,以将晶片放入TW测量的再循环过程中。