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1. 发明授权

US08302298B2 Process for fabricating circuit substrate 有权
标题翻译：制造电路基板的工艺
公开(公告)号：US08302298B2
公开(公告)日：2012-11-06
申请号：US12835085
申请日：2010-07-13
申请人： Chen-Yueh Kung , Wei-Cheng Chen
发明人： Chen-Yueh Kung , Wei-Cheng Chen
IPC分类号： H01K3/10
CPC分类号： H05K3/4007 , H05K3/0035 , H05K3/108 , H05K3/421 , H05K2201/0367 , H05K2201/0376 , H05K2201/09436 , H05K2201/09545 , H05K2203/308 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.
摘要翻译：提供了一种用于制造电路基板的工艺。具有内垫的图案化导电层设置在基底层上，电介质层设置在基底层上并覆盖图案化的导电层，并且覆盖层设置在电介质层上。通过干蚀刻去除覆盖层的一部分以形成第一开口。去除由第一开口暴露的电介质层的一部分，以形成暴露一部分内垫的电介质开口。在覆盖层上形成具有第二开口以露出内部衬垫的一部分的图案化掩模。形成包括填充电介质开口的导电块，填充第一开口的外垫和填充第二开口的剩余层的导电结构。最后，去除图案化掩模，剩余层和覆盖层。

2. 发明申请

US20110108315A1 PROCESS FOR FABRICATING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE 有权
标题翻译：制造电路基板的方法和电路基板
公开(公告)号：US20110108315A1
公开(公告)日：2011-05-12
申请号：US12835085
申请日：2010-07-13
申请人： CHEN-YUEH KUNG , Wei-Cheng Chen
发明人： CHEN-YUEH KUNG , Wei-Cheng Chen
IPC分类号： H05K1/11 , H01B5/14 , B29C35/08
CPC分类号： H05K3/4007 , H05K3/0035 , H05K3/108 , H05K3/421 , H05K2201/0367 , H05K2201/0376 , H05K2201/09436 , H05K2201/09545 , H05K2203/308 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49165
摘要： A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.
摘要翻译：提供了一种用于制造电路基板的工艺。具有内垫的图案化导电层设置在基底层上，电介质层设置在基底层上并覆盖图案化导电层，并且覆盖层设置在电介质层上。通过干蚀刻去除覆盖层的一部分以形成第一开口。去除由第一开口暴露的电介质层的一部分，以形成暴露一部分内垫的电介质开口。在覆盖层上形成具有第二开口以露出内部衬垫的一部分的图案化掩模。形成包括填充电介质开口的导电块，填充第一开口的外垫和填充第二开口的剩余层的导电结构。最后，去除图案化掩模，多余层和覆盖层。

3. 发明申请

US20070268232A1 System for displaying image and driving method for liquid crystal displaying device 有权
标题翻译：用于显示液晶显示装置的图像和驱动方法的系统
公开(公告)号：US20070268232A1
公开(公告)日：2007-11-22
申请号：US11798876
申请日：2007-05-17
申请人： Ksuan-Chun Ku , Wei-Cheng Chen
发明人： Ksuan-Chun Ku , Wei-Cheng Chen
IPC分类号： G09G3/36
CPC分类号： G09G3/3688 , G09G2310/0289 , G09G2330/021
摘要： A system for displaying image includes a driving circuit of a liquid crystal displaying device. The driving circuit of the liquid crystal displaying device includes a shift register, a voltage booster and a sample switch. The shift register receives an input pulse signal and shifts the input pulse signal to output an output pulse signal. The voltage booster is electrically connected with the shift register to receive the output pulse signal, and generates a boost voltage to output a boost signal within the enable time of the output pulse signal. The sample switch is electrically connected with the voltage booster to receive the boost signal. The boost signal controls the sample switch to sample a data signal.
摘要翻译：一种用于显示图像的系统包括液晶显示装置的驱动电路。液晶显示装置的驱动电路包括移位寄存器，升压器和采样开关。移位寄存器接收输入脉冲信号并移位输入脉冲信号以输出输出脉冲信号。升压器与移位寄存器电连接以接收输出脉冲信号，并且在输出脉冲信号的使能时间内产生升压电压以输出升压信号。采样开关与升压器电连接以接收升压信号。升压信号控制采样开关采样数据信号。

4. 发明申请

US20070047352A1 CHARGE PUMP 审中-公开
标题翻译：电荷泵
公开(公告)号：US20070047352A1
公开(公告)日：2007-03-01
申请号：US11467303
申请日：2006-08-25
申请人： Hsiao-Yi Lin , C.M. Chiu , Wei-Cheng Chen
发明人： Hsiao-Yi Lin , C.M. Chiu , Wei-Cheng Chen
IPC分类号： G11C7/00
CPC分类号： H02M3/073 , H02M2003/075
摘要： A charge pump is disclosed, comprising a plurality of sub-charge pumps connected in series, each comprising a charging switch module turned on or off according to a charging clock signal and a capacitor connected between the charging switch module and a reference clock signal. The charge pump further comprises at least one additional switch module connecting to a reference-clock-providing sub-charge pump and a reference-clock-accepting sub-charge pump among the sub-charge pumps to provide the reference clock signal of the reference-clock-accepting sub-charge pump according to an additional clock signal.
摘要翻译：公开了一种电荷泵，包括串联连接的多个子电荷泵，每个包括根据充电时钟信号导通或关断的充电开关模块以及连接在充电开关模块和参考时钟信号之间的电容器。电荷泵还包括至少一个额外的开关模块，连接到子电荷泵中的参考时钟提供子电荷泵和参考时钟接收子电荷泵，以提供参考时钟提供子电荷泵的参考时钟接收子电荷泵，时钟接收子电荷泵根据额外的时钟信号。

5. 发明授权

US07135798B2 Magnetic suspension bearing 有权
标题翻译：磁悬浮轴承
公开(公告)号：US07135798B2
公开(公告)日：2006-11-14
申请号：US11059522
申请日：2005-02-17
申请人： Chien-Chang Wang , Wei-Cheng Chen , Chau-Shin Jang , Chun-Min Chen
发明人： Chien-Chang Wang , Wei-Cheng Chen , Chau-Shin Jang , Chun-Min Chen
IPC分类号： H02K7/09
CPC分类号： H02K7/09 , F16C17/08 , F16C32/0402 , F16C32/0425 , F16C39/063
摘要： A magnetic suspension bearing located between the spindle and stator of a rotational device includes stator magnetic units mounted on the top side and bottom side of the stator and spindle magnetic units, which are mounted on two ends of the spindle. One end of the spindle has a loading section to support the spindle. The stator magnetic units and the spindle magnetic units generate a repulsive magnetic force to separate the spindle and stator from one another at a selected distance to avoid vibration and noise caused by obliquity and to increase the service life of products.
摘要翻译：位于旋转装置的主轴和定子之间的磁悬浮轴承包括安装在定子和主轴磁性单元的顶侧和底侧上的定子磁性单元，其安装在主轴的两端。主轴的一端具有支撑主轴的装载部分。定子磁性单元和主轴磁性单元产生排斥磁力，以使主轴和定子彼此间隔一定距离，以避免因倾斜引起的振动和噪音，并增加产品的使用寿命。

6. 发明授权

US10043653B2 Maranagoni dry with low spin speed for charging release 有权
公开(公告)号：US10043653B2
公开(公告)日：2018-08-07
申请号：US13595787
申请日：2012-08-27
申请人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
发明人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
IPC分类号： B08B3/02 , H01L21/02 , H01L21/67 , C11D11/00 , C11D7/26
CPC分类号： H01L21/02052 , C11D7/261 , C11D11/0047 , H01L21/67028
摘要： A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.

7. 发明申请

US20140053869A1 Maranagoni Dry with Low Spin Speed for Charging Release 审中-公开
标题翻译： Maranagoni干燥与低旋转速度充电释放
公开(公告)号：US20140053869A1
公开(公告)日：2014-02-27
申请号：US13595787
申请日：2012-08-27
申请人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
发明人： Wei-Cheng Chen , Ling-Sung Wang , Chih-Hsun Lin , Tzu kai Lin
IPC分类号： B08B3/02 , H01L21/02
CPC分类号： H01L21/02052 , C11D7/261 , C11D11/0047 , H01L21/67028
摘要： A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.
摘要翻译：一种清洁和干燥半导体晶片的方法，包括将半导体晶片插入清洁工具的腔室中，将半导体晶片在约300转/分钟至约1600转/分钟的范围内旋转，同时用de 去离子水和异丙醇和氮气的混合物。

8. 发明授权

US09610536B2 Recirculated-suspension pre-calciner system 有权
公开(公告)号：US09610536B2
公开(公告)日：2017-04-04
申请号：US13590126
申请日：2012-08-20
申请人： Wei-Cheng Chen , Wan-Hsia Liu , Chin-Ming Huang , Shoung Ouyang , Heng-Wen Hsu
发明人： Wei-Cheng Chen , Wan-Hsia Liu , Chin-Ming Huang , Shoung Ouyang , Heng-Wen Hsu
IPC分类号： C01B13/18 , B01J6/00 , B01J8/14 , C01F11/06 , B01D53/62 , B01J8/00 , C01F5/06 , C01G9/02 , C01G25/02 , C01G45/02 , C01G53/04 , C04B2/10 , B01D53/10 , B01D53/96 , C04B7/43 , C04B111/00
CPC分类号： B01D53/62 , B01D53/10 , B01D53/96 , B01D2251/402 , B01D2251/404 , B01D2251/602 , B01J6/004 , B01J8/0055 , B01J8/14 , C01B13/18 , C01F5/06 , C01F11/06 , C01G9/02 , C01G25/02 , C01G45/02 , C01G53/04 , C04B2/10 , C04B7/434 , C04B2111/00017 , Y02C10/04 , Y02E20/326 , Y02P40/18 , Y02P40/42
摘要： A recirculated-suspension pre-calciner system is disclosed, comprising: a vortex cyclone dust collecting equipment including a plurality of devices, wherein a top device of the vortex cyclone dust collecting equipment is used as a feed system; a vertical combustion kiln; a blower; and a powder purge system, wherein powders in the feed system fall into the vortex cyclone dust collecting equipment and pass through a plurality of the devices to mix and exchange heat with flue gas comprising CO2, generating calcination reaction and releasing CO2 into the flue gas. and the steam is separated and transported to the feed system by the blower and acts as a carrier gas of powders.

9. 发明授权

US08796848B2 Circuit board and chip package structure 有权
标题翻译：电路板和芯片封装结构
公开(公告)号：US08796848B2
公开(公告)日：2014-08-05
申请号：US13004242
申请日：2011-01-11
申请人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
发明人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
IPC分类号： H01L23/498 , H05K3/24 , H01L23/00 , H05K3/46 , H05K3/40 , H05K3/28
CPC分类号： H05K3/242 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16225 , H01L2224/81193 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0352 , H05K2201/0367 , H05K2201/09481 , H05K2201/09536 , H05K2201/09627 , H05K2203/054 , H05K2203/0723 , H01L2224/05099
摘要： A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.
摘要翻译：电路板包括具有彼此相对的顶表面和底表面的基底，至少设置在顶表面上的顶垫，设置在顶表面上并覆盖顶垫的一部分的顶部阻焊层，以及设置在顶垫上的预凸块。顶部阻焊层具有暴露顶部焊盘的一部分的第一开口。预凸块位于第一开口中并且具有从顶部阻焊层突出的突起。突起的最大宽度小于或等于顶垫的宽度。还提供了具有电路板的芯片封装结构。

10. 发明申请

US20110108984A1 CIRCUIT BOARD AND CHIP PACKAGE STRUCTURE 有权
标题翻译：电路板和芯片包装结构
公开(公告)号：US20110108984A1
公开(公告)日：2011-05-12
申请号：US13004242
申请日：2011-01-11
申请人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
发明人： Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
IPC分类号： H01L23/498 , H05K1/09
CPC分类号： H05K3/242 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16225 , H01L2224/81193 , H01L2224/81801 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K3/4602 , H05K2201/0352 , H05K2201/0367 , H05K2201/09481 , H05K2201/09536 , H05K2201/09627 , H05K2203/054 , H05K2203/0723 , H01L2224/05099
摘要： A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.
摘要翻译：电路板包括具有彼此相对的顶表面和底表面的基底，至少设置在顶表面上的顶垫，设置在顶表面上并覆盖顶垫的一部分的顶部阻焊层，以及设置在顶垫上的预凸块。顶部阻焊层具有暴露顶部焊盘的一部分的第一开口。预凸块位于第一开口中并且具有从顶部阻焊层突出的突起。突起的最大宽度小于或等于顶垫的宽度。还提供了具有电路板的芯片封装结构。

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