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    • 1. 发明授权
    • Cmos gate architecture for integration of salicide process in sub 0.1    .
.muM devices
    • Cmos门结构,用于将0.1%以上设备的自杀过程整合
    • US6010954A
    • 2000-01-04
    • US156359
    • 1998-09-18
    • Chaw Sing HoR. P. G. KarunasiriSoo Jin ChuaKin Leong PeyKong Hean Lee
    • Chaw Sing HoR. P. G. KarunasiriSoo Jin ChuaKin Leong PeyKong Hean Lee
    • H01L21/28H01L21/336H01L29/423H01L21/18H01L21/283H01L21/335H01L21/461
    • H01L29/665H01L21/28114H01L29/42376H01L29/66545
    • A method to form a "mushroom shaped" gate structure 18 22 44A 70 that increases the top gate silicide contact area and improves the salicide process, especially TiSi.sub.2 salicide. The novel upper gate extensions 44A increase the top gate surface area so that the silicide gate contacts 70 will have a low resistivity. The invention includes forming a gate stack 18 22 26 comprised of a gate oxide layer 18, a center gate portion 22 and a hard mask 26. Next, we form a first insulating layer 40 over the gate stack 22 26 18. The hard mask 26 and a first thickness of the first insulating layer 40 are removed to expose sidewalls of the center gate portion 22. A second conductive layer 44 is formed over the first insulating layer 46 and the center gate portion 22. The second conductive layer 44 is etched to form critical rounded upper gate extensions 44A on the sidewalls of the center gate portion 22. Lower rectangular sidewall spacers 52 are formed on the sidewalls of the center gate portion 22. Source/drain regions 54 are formed. A salicide process forms silicide source/drain contacts 64 and forms extra large silicided gate contacts 70 to reduce parasitic resistance.
    • 形成增加顶栅硅化物接触面积并改善自对准硅化物工艺的“蘑菇形”门结构18 22 44A 70的方法,特别是TiSi 2自对准硅化物。 新颖的上部栅极延伸部分44A增加了顶部栅极表面积,使得硅化物栅极接触70将具有低电阻率。 本发明包括形成由栅极氧化物层18,中心栅极部分22和硬掩模26组成的栅极堆叠18 22 26.接下来,我们在栅极叠层22 26上形成第一绝缘层40.硬掩模26 并且去除第一绝缘层40的第一厚度以暴露中心栅极部分22的侧壁。第二导电层44形成在第一绝缘层46和中心栅极部分22上。第二导电层44被蚀刻到 在中心栅极部分22的侧壁上形成关键的圆形上部栅极延伸部分44A。下部矩形侧壁间隔件52形成在中心栅极部分22的侧壁上。形成源极/漏极区域54。 自对准硅化物工艺形成硅化物源极/漏极触点64并形成特大的硅化物栅极触点70以减小寄生电阻。
    • 2. 发明授权
    • Method for fabricating void-free epitaxial-CoSi2 with ultra-shallow junctions
    • 具有超浅结的无空隙外延CoSi2的制造方法
    • US06410429B1
    • 2002-06-25
    • US09795113
    • 2001-03-01
    • Chaw Sing HoKheng Chok TeeKin Leong PeyG. KarunasiriSoo Jin ChuaKong Hean LeeAlex Kalhung See
    • Chaw Sing HoKheng Chok TeeKin Leong PeyG. KarunasiriSoo Jin ChuaKong Hean LeeAlex Kalhung See
    • H01L2144
    • H01L29/6659H01L21/2257H01L21/28518H01L29/665
    • A method for forming a void-free epitaxial cobalt silicide (CoSi2) layer on an ultra-shallow source/drain junction. A patterned silicon structure is cleaned using HF. A first titanium layer, a cobalt layer, and a second titanium layer are successively formed on the patterned silicon substrate. The patterned silicon substrate is annealed at a temperature of between about 550° C. and 580° C. in a nitrogen ambient at atmospheric pressure; whereby the cobalt migrates downward and reacts with the silicon structure to form a CoSi2/CoSi layer, and the first titanium layer migrates upward and the first titanium layer and the second titanium layer react with the nitrigen ambient to form TiN. The TiN and unreacted cobalt are removed. The silicon structure is annealed at a temperature of between about 825° C. and 875° C. to convert the CoSi2/CoSi layer to a CoSi2 layer. The CoSi2 layer can optionally be implanted with impurity ions which are subsequently diffused to form ultra-shallow junctions.
    • 在超浅源极/漏极结上形成无空隙的外延钴硅化物(CoSi 2)层的方法。 使用HF清洁图案化的硅结构。 在图案化的硅衬底上依次形成第一钛层,钴层和第二钛层。 图案化的硅衬底在大气压下在氮气环境中在约550℃和580℃之间的温度下退火; 由此钴向下迁移并与硅结构反应以形成CoSi 2 / CoSi层,并且第一钛层向上迁移,并且第一钛层和第二钛层与硝化环境反应形成TiN。 去除TiN和未反应的钴。 将硅结构在约825℃和875℃之间的温度下退火,以将CoSi 2 / CoSi层转化为CoSi 2层。 CoSi2层可以任选地被杂质离子注入,后者被扩散以形成超浅结。
    • 7. 发明授权
    • Method for forming a modified semiconductor having a plurality of band gaps
    • 用于形成具有多个带隙的改性半导体的方法
    • US07223623B2
    • 2007-05-29
    • US10510357
    • 2003-04-04
    • Jing Hua TengSoo Jin ChuaJian Rong Dong
    • Jing Hua TengSoo Jin ChuaJian Rong Dong
    • H01L21/00
    • B82Y10/00B82Y20/00H01L21/182H01L29/122H01L29/125H01L29/127H01L33/0095H01S5/1003H01S5/1092H01S5/162H01S5/3412H01S5/3414H01S5/4087
    • A method for forming a modified semiconductor having a number of band gaps involves providing a semiconductor having a surface and a quantum region which emits photons in response to electrical or optical stimulation, the quantum region having an original band gap and being disposed under the surface and applying a number of layers of a number of materials to a number of selected regions of the surface, the materials being adapted to cause, upon thermal annealing, a number of different degrees of intermixing in a number of portions of the quantum region disposed immediately below each of the selected regions of the surface. The layers of materials can be applied in a dot or line pattern, or both, to increase the plurality of band gap tuning. The method includes thermally annealing the layers to the surface. The methods result in a modified semiconductor which exhibits a number of different band gaps in a number of portions of the quantum region depending upon the positioning of the layers of materials on the surface immediately above the respective portions of the quantum region.
    • 用于形成具有多个带隙的修改的半导体的方法涉及提供具有表面的半导体和响应于电或光刺激而发射光子的量子区域,该量子区域具有原始带隙并设置在该表面下方, 将多个材料层施加到表面的多个选定区域,该材料适于在热退火时引起在紧邻下面布置的量子区域的多个部分中的多个不同程度的混合 每个表面的选定区域。 可以以点或线图案或两者来施加材料层以增加多个带隙调谐。 该方法包括将层热层退火到表面。 该方法产生一种修饰的半导体,其取决于材料层在量子区的相应部分上方的表面上的位置,在量子区的多个部分中表现出许多不同的带隙。
    • 10. 发明申请
    • METHOD OF FORMING PHOTONIC CRYSTALS
    • 形成光子晶体的方法
    • US20120142170A1
    • 2012-06-07
    • US13377521
    • 2010-06-09
    • Jinghua TengEo LimSoo Jin ChuaSoo Seng Nirman Ang
    • Jinghua TengEo LimSoo Jin ChuaSoo Seng Nirman Ang
    • H01L21/20
    • G02B6/1225B82Y20/00G02B6/136G02B2006/12176
    • According to an embodiment of the present invention, a method of forming photonic crystals is provided. The method includes: forming a layer arrangement on a support substrate. The layer arrangement includes a first partial layer arrangement and a second partial layer arrangement, wherein the second partial layer arrangement is disposed over the first partial layer arrangement, wherein each partial layer arrangement comprises a first layer and a second layer, wherein the second layer is disposed over the first layer, and wherein the material of the second layer has a different etching characteristic than the material of the first layer. The method further includes removing at least one portion of the second layer and removing the first layer, wherein forming the layer arrangement occurs prior to removing the at least one portion of the second layer and the first layer.
    • 根据本发明的实施例,提供了形成光子晶体的方法。 该方法包括:在支撑衬底上形成层布置。 层布置包括第一部分层布置和第二部分层布置,其中第二部分层布置设置在第一部分层布置之上,其中每个部分层布置包括第一层和第二层,其中第二层是 设置在所述第一层上,并且其中所述第二层的材料具有与所述第一层的材料不同的蚀刻特性。 该方法还包括去除第二层的至少一部分并去除第一层,其中形成层布置发生在去除第二层和第一层的至少一部分之前。