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1. 发明授权

US08296940B2 Method of forming a micro pin hybrid interconnect array 有权
标题翻译：形成微针混合互连阵列的方法
公开(公告)号：US08296940B2
公开(公告)日：2012-10-30
申请号：US12762610
申请日：2010-04-19
申请人： Charles Gerard Woychik , John Eric Tkaczyk , Brian David Yanoff , Tan Zhang
发明人： Charles Gerard Woychik , John Eric Tkaczyk , Brian David Yanoff , Tan Zhang
IPC分类号： H05K3/34
CPC分类号： H01L24/16 , H01L21/563 , H01L22/20 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L24/83 , H01L27/14618 , H01L27/14636 , H01L2224/0381 , H01L2224/0401 , H01L2224/051 , H01L2224/05568 , H01L2224/0558 , H01L2224/056 , H01L2224/05644 , H01L2224/1134 , H01L2224/13007 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/1411 , H01L2224/1601 , H01L2224/16106 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/81011 , H01L2224/81121 , H01L2224/81143 , H01L2224/81191 , H01L2224/81194 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2224/8191 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15787 , H01L2924/351 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49162 , Y10T29/49179 , H01L2924/05432 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2224/05552
摘要： A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.
摘要翻译：微针混合互连阵列包括晶体阳极阵列和陶瓷衬底。使用具有高宽比大的纵横比的互连几何形状将阵列和衬底连接在一起。将互连连接到晶体阳极阵列的接头没有焊料。

2. 发明申请

US20110253430A1 MICRO PIN HYBRID INTERCONNECT ARRAY AND METHOD OF MANUFACTURING SAME 有权
标题翻译： MICRO PIN HYBRID INTERCONNECT ARRAY AND METHOD OF MANUIFACTURE OF SAME
公开(公告)号：US20110253430A1
公开(公告)日：2011-10-20
申请号：US12762610
申请日：2010-04-19
申请人： Charles Gerard Woychik , John Eric Tkaczyk , Brian David Yanoff , Tan Zhang
发明人： Charles Gerard Woychik , John Eric Tkaczyk , Brian David Yanoff , Tan Zhang
IPC分类号： H05K1/09 , H05K3/30 , H05K3/34 , H05K1/11
CPC分类号： H01L24/16 , H01L21/563 , H01L22/20 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L24/83 , H01L27/14618 , H01L27/14636 , H01L2224/0381 , H01L2224/0401 , H01L2224/051 , H01L2224/05568 , H01L2224/0558 , H01L2224/056 , H01L2224/05644 , H01L2224/1134 , H01L2224/13007 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/1411 , H01L2224/1601 , H01L2224/16106 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/81011 , H01L2224/81121 , H01L2224/81143 , H01L2224/81191 , H01L2224/81194 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2224/8191 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15787 , H01L2924/351 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155 , Y10T29/49162 , Y10T29/49179 , H01L2924/05432 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2224/05552
摘要： A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.
摘要翻译：微针混合互连阵列包括晶体阳极阵列和陶瓷衬底。使用具有高宽比大的纵横比的互连几何形状将阵列和衬底连接在一起。将互连连接到晶体阳极阵列的接头没有焊料。

3. 发明申请

US20120049079A1 ELECTRONIC ASSEMBLY 审中-公开
标题翻译：电子总成
公开(公告)号：US20120049079A1
公开(公告)日：2012-03-01
申请号：US12873107
申请日：2010-08-31
申请人： Brian David Yanoff , Charles Gerard Woychik , Yanfeng Du , James Wilson Rose
发明人： Brian David Yanoff , Charles Gerard Woychik , Yanfeng Du , James Wilson Rose
IPC分类号： G01T1/24
CPC分类号： G01T1/244 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/1319 , H01L2224/13561 , H01L2224/13582 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic assembly is provided. The assembly comprises a substrate having a plurality of conductive contacts disposed on a surface of the substrate. The substrate comprises a dielectric material. The assembly comprises a detector having a plurality of conductive contacts disposed on a surface of the detector which is adjacent to the surface of the substrate. At least one compliant interconnect is disposed between the substrate and the detector. The conductive contacts of the substrate and the conductive contacts of the detector are in electrical communication with the compliant interconnect via a conductive epoxy. The compliant interconnect comprises a polymer core having an electrically conductive outer surface. In certain embodiments, the assembly comprises an interposer. In certain embodiments, an under-fill is disposed between the surface of the substrate and the surface of the detector.
摘要翻译：提供电子组件。组件包括具有设置在基板的表面上的多个导电触点的基板。基板包括电介质材料。组件包括检测器，其具有设置在检测器的与衬底表面相邻的表面上的多个导电触点。在衬底和检测器之间设置至少一个兼容互连。衬底的导电触点和检测器的导电触点经由导电环氧树脂与柔性互连电连接。兼容互连包括具有导电外表面的聚合物芯。在某些实施例中，组件包括插入件。在某些实施例中，底部填充物设置在基板的表面和检测器的表面之间。

4. 发明申请

US20120133001A1 TILEABLE SENSOR ARRAY 有权
标题翻译：可传感器阵列
公开(公告)号：US20120133001A1
公开(公告)日：2012-05-31
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L27/00 , H01L31/18 , H01L21/60
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

5. 发明授权

US08659148B2 Tileable sensor array 有权
标题翻译：可分层传感器阵列
公开(公告)号：US08659148B2
公开(公告)日：2014-02-25
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L23/34
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

6. 发明授权

US08575558B2 Detector array with a through-via interposer 有权
标题翻译：带有通孔插入器的检测器阵列
公开(公告)号：US08575558B2
公开(公告)日：2013-11-05
申请号：US12956139
申请日：2010-11-30
申请人： John Eric Tkaczyk , James Wilson Rose , Jonathan David Short , Charles Gerard Woychik
发明人： John Eric Tkaczyk , James Wilson Rose , Jonathan David Short , Charles Gerard Woychik
IPC分类号： G01T1/24
CPC分类号： H01L31/085 , A61B6/4233 , G01T1/243 , H01L24/48 , H01L24/49 , H01L27/14636 , H01L27/14661 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.
摘要翻译：提出了一种形成传感器堆叠的方法。该方法包括提供具有第一侧和第二侧的衬底。此外，该方法包括在衬底的第一侧上设置具有第一侧和第二侧的集成电路，其中集成电路包括设置在集成电路的第一侧上的第一多个接触焊盘。该方法还包括提供具有多个传感器元件的传感器阵列，其中每个传感器元件具有第一侧和第二侧，并且其中传感器阵列包括设置在传感器的第二侧上的第二多个接触垫数组。此外，该方法包括设置具有一个或多个中介层元件和一个或多个通孔的插入件，该通孔设置在传感器阵列的一个或多个传感器元件与集成电路之间，以将传感器阵列远离集成的第一侧电路，使得所述一个或多个传感器元件的平面在局部垂直于传感器堆叠法线，其中所述插入器被配置为将所述传感器阵列中的所述传感器元件的第二侧可操作地耦合到所述集成电路的第一侧。此外，该方法包括将集成电路的第一侧上的第一多个接触焊盘操作地耦合到传感器阵列的第二侧上的第二多个接触焊盘，以形成可瓦片传感器堆叠。

7. 发明申请

US20120133054A1 DETECTOR ARRAY WITH A THROUGH-VIA INTERPOSER 有权
标题翻译：检测器阵列与通过间断器通过
公开(公告)号：US20120133054A1
公开(公告)日：2012-05-31
申请号：US12956139
申请日：2010-11-30
申请人： John Eric Tkaczyk , James Wilson Rose , Jonathan David Short , Charles Gerard Woychik
发明人： John Eric Tkaczyk , James Wilson Rose , Jonathan David Short , Charles Gerard Woychik
IPC分类号： H01L23/48 , H01L21/50 , H01L21/02
CPC分类号： H01L31/085 , A61B6/4233 , G01T1/243 , H01L24/48 , H01L24/49 , H01L27/14636 , H01L27/14661 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for forming a sensor stack is presented. The method includes providing a substrate having a first side and a second side. Furthermore, the method includes disposing an integrated circuit having a first side and a second side on the first side of the substrate, where the integrated circuit comprises a first plurality of contact pads disposed on the first side of the integrated circuit. The method also includes providing a sensor array having a plurality of sensor elements, wherein each of the sensor elements has a first side and a second side, and wherein the sensor array comprises a second plurality of contact pads disposed on the second side of the sensor array. Furthermore, the method includes disposing an interposer having one or more interposer elements and one or more through vias disposed therethrough between the one or more sensor elements of the sensor array and the integrated circuit to raise the sensor array away from the first side of the integrated circuit such that a plane of the one or more sensor elements is locally normal to a sensor stack normal, wherein the interposer is configured to operationally couple the second side of the sensor elements in the sensor array to the first side of the integrated circuit. In addition, the method includes operationally coupling the first plurality of contact pads on the first side of the integrated circuit to a second plurality of contact pads on the second side of the sensor array to form a tileable sensor stack.
摘要翻译：提出了一种形成传感器堆叠的方法。该方法包括提供具有第一侧和第二侧的衬底。此外，该方法包括在衬底的第一侧上设置具有第一侧和第二侧的集成电路，其中集成电路包括设置在集成电路的第一侧上的第一多个接触焊盘。该方法还包括提供具有多个传感器元件的传感器阵列，其中每个传感器元件具有第一侧和第二侧，并且其中传感器阵列包括设置在传感器的第二侧上的第二多个接触垫数组。此外，该方法包括设置具有一个或多个中介层元件和一个或多个通孔的插入件，该通孔设置在传感器阵列的一个或多个传感器元件与集成电路之间，以将传感器阵列远离集成的第一侧电路，使得所述一个或多个传感器元件的平面在局部垂直于传感器堆叠法线，其中所述插入器被配置为将所述传感器阵列中的所述传感器元件的第二侧可操作地耦合到所述集成电路的第一侧。此外，该方法包括将集成电路的第一侧上的第一多个接触焊盘操作地耦合到传感器阵列的第二侧上的第二多个接触焊盘，以形成可瓦片传感器堆叠。

8. 发明申请

US20100327173A1 Integrated Direct Conversion Detector Module 审中-公开
标题翻译：集成直接转换检测器模块
公开(公告)号：US20100327173A1
公开(公告)日：2010-12-30
申请号：US12494257
申请日：2009-06-29
申请人： Charles Gerard Woychik , James Rose , John Eric Tkaczyk , Jonathan Short , Yanfeng Du
发明人： Charles Gerard Woychik , James Rose , John Eric Tkaczyk , Jonathan Short , Yanfeng Du
IPC分类号： G01T1/24 , H01L21/50
CPC分类号： H01L27/14618 , H01L23/3677 , H01L23/42 , H01L24/48 , H01L25/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A detector module comprises: a direct conversion crystal for converting incident photons into electrical signals, the direct conversion crystal having an anode layer deposited on a first surface and a cathode layer deposited on a second surface; a redistribution layer deposited on the anode layer, the redistribution layer configured to adapt a pad array layout of the direct conversion crystal to a predetermined lead pattern; an integrated circuit in electrical communication with the direct conversion crystal; and a plurality of input/output electrical paths connected to the redistribution layer to provide connectivity between the imaging module and another level of interconnect.
摘要翻译：检测器模块包括：用于将入射光子转换成电信号的直接转换晶体，所述直接转换晶体具有淀积在第一表面上的阳极层和沉积在第二表面上的阴极层; 沉积在所述阳极层上的再分配层，所述再分配层被配置为使所述直接转换晶体的焊盘阵列布局适应于预定的引线图案; 与直接转换晶体进行电气通信的集成电路; 以及连接到再分配层的多个输入/输出电路径，以提供成像模块和另一级别的互连之间的连接。

9. 发明申请

US20080318413A1 METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS 审中-公开
标题翻译：制造互连结构和互连组件恢复过程的方法
公开(公告)号：US20080318413A1
公开(公告)日：2008-12-25
申请号：US11766302
申请日：2007-06-21
申请人： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
发明人： Raymond Albert Fillion , David Richard Esler , Jeffrey Scott Erlbaum , Ryan Christopher Mills , Charles Gerard Woychik
IPC分类号： H01L21/4763
CPC分类号： H01L24/19 , H01L21/563 , H01L23/3128 , H01L23/5389 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/20 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/97 , H01L24/98 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/051 , H01L2224/05155 , H01L2224/05166 , H01L2224/056 , H01L2224/05644 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/20 , H01L2224/2101 , H01L2224/221 , H01L2224/2919 , H01L2224/32221 , H01L2224/73204 , H01L2224/73267 , H01L2224/81815 , H01L2224/8185 , H01L2224/83132 , H01L2224/8385 , H01L2224/92135 , H01L2224/92144 , H01L2224/95 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2224/19 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/0105 , H01L2924/014
摘要： A method is provided for making an interconnect structure. The method includes applying a removable layer to an electronic device or to a base insulative layer; applying an adhesive layer to the electronic device or to the base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
摘要翻译：提供了一种制造互连结构的方法。该方法包括将可移除层应用于电子设备或基底绝缘层; 将粘合剂层施加到电子装置或基底绝缘层上; 以及使用所述粘合剂层将所述电子器件固定到所述基底绝缘层。

10. 发明授权

US07451651B2 Modular sensor assembly and methods of fabricating the same 有权
公开(公告)号：US07451651B2
公开(公告)日：2008-11-18
申请号：US11636822
申请日：2006-12-11
申请人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
发明人： Charles Gerard Woychik , Rayette Ann Fisher , David Martin Mills , Scott Cogan , David Richard Esler , Robert Gideon Wodnicki , Jeffrey Scott Erlbaum
IPC分类号： G01N29/00
CPC分类号： G01D11/245 , B06B1/0292 , B06B1/0629 , G01N29/2437 , G01N2291/106 , H01L2224/05001 , H01L2224/05009 , H01L2224/0557 , H01L2224/05571 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/16145 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014 , H01L2924/01322 , Y10T29/49004 , Y10T29/49007 , H01L2924/00 , H01L2224/05099
摘要： A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

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