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1. 发明授权

US08659148B2 Tileable sensor array 有权
标题翻译：可分层传感器阵列
公开(公告)号：US08659148B2
公开(公告)日：2014-02-25
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L23/34
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

2. 发明申请

US20120133001A1 TILEABLE SENSOR ARRAY 有权
标题翻译：可传感器阵列
公开(公告)号：US20120133001A1
公开(公告)日：2012-05-31
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L27/00 , H01L31/18 , H01L21/60
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

3. 发明申请

US20080296708A1 Integrated sensor arrays and method for making and using such arrays 审中-公开
标题翻译：集成传感器阵列和制造和使用这种阵列的方法
公开(公告)号：US20080296708A1
公开(公告)日：2008-12-04
申请号：US11809165
申请日：2007-05-31
申请人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
发明人： Robert Gideon Wodnicki , Wei-Cheng Tian , Kevin Matthew Durocher , Charles Gerard Woychik , Rayette Ann Fisher , Stacey Joy Kennerly , Lowell Scott Smith , Douglas Glenn Wildes
IPC分类号： H01L21/50 , H01L23/00
CPC分类号： G01N29/2406 , B06B1/0292 , G01N2291/106 , H01L2224/04105 , H01L2224/24 , H01L2224/73267 , H01L2224/82
摘要： The present invention relates to a method for making an integrated sensor comprising providing a sensor array fabricated on a top surface of a bulk silicon wafer having a top surface and a bottom surface, and comprising a plurality of sensors fabricated on the top surface of the bulk silicon wafer. The method further comprises coupling an SOI wafer to the top surface of the bulk silicon wafer, thinning the back surface of the bulk silicon wafer, coupling a plurality of integrated circuit die to the back surface of the bulk silicon wafer, and removing the SOI wafer from the top surface of the bulk silicon wafer.
摘要翻译：本发明涉及一种用于制造集成传感器的方法，其包括提供制造在具有顶表面和底表面的体硅晶片的顶表面上的传感器阵列，并且包括在本体的顶表面上制造的多个传感器硅晶片。该方法还包括将SOI晶片耦合到体硅晶片的顶表面，使体硅晶片的背表面变薄，将多个集成电路管芯耦合到体硅晶片的背面，以及去除SOI晶片从体硅晶片的顶表面。

4. 发明授权

US07353056B2 Optimized switching configurations for reconfigurable arrays of sensor elements 失效
标题翻译：用于可重构阵列传感器元件的优化开关配置
公开(公告)号：US07353056B2
公开(公告)日：2008-04-01
申请号：US10978175
申请日：2004-10-29
申请人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
发明人： Christopher Robert Hazard , Robert Gideon Wodnicki , Rayette Ann Fisher , Kai E. Thomenius , Lowell Scott Smith , David Martin Mills
IPC分类号： A61B5/05 , A61B8/00
CPC分类号： G10K11/34 , A61B2562/028 , B06B1/0292 , G01S7/52046 , G01S15/8925
摘要： The reconfigurable ultrasound array disclosed herein is one that allows groups of subelements to be connected together dynamically so that the shape of the resulting element can be made to match the shape of the wave front. This can lead to improved performance and/or reduced channel count. Reconfigurability can be achieved using a switching network. A methodology and an algorithm are disclosed that allows the performance of this switching network to be improved by properly choosing the configuration of the switching network.
摘要翻译：本文公开的可重构超声波阵列是允许一组子元件动态地连接在一起的结构，使得所得元件的形状可以与波前的形状相匹配。这可以导致改进的性能和/或减少的通道数。可以使用交换网络实现可重构性。公开了一种通过适当选择交换网络的配置来改善该交换网络的性能的方法和算法。

5. 发明授权

US07443765B2 Reconfigurable linear sensor arrays for reduced channel count 有权
标题翻译：可重构线性传感器阵列，减少通道数
公开(公告)号：US07443765B2
公开(公告)日：2008-10-28
申请号：US11018238
申请日：2004-12-21
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , Bruno Hans Haider , Kenneth Wayne Rigby
IPC分类号： G10K11/00 , H04R17/00
CPC分类号： B06B1/0292 , A61B2562/028 , G01N29/0609 , G01N29/069 , G01N29/245 , G01N2291/0423 , G01N2291/106
摘要： A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
摘要翻译：传感器的可重构线性阵列（例如光学，热学，压力，超声波）。可重新配置允许传感器元件的尺寸和间距是与梁中心距离的函数。该功能提高了具有有限通道数的成像系统的性能。对于使用多个透射聚焦区域的应用而言，改进的性能来自于为特定深度调整孔径的能力。

6. 发明授权

US07280435B2 Switching circuitry for reconfigurable arrays of sensor elements 有权
标题翻译：用于可重构阵列的传感器元件的开关电路
公开(公告)号：US07280435B2
公开(公告)日：2007-10-09
申请号：US10978196
申请日：2004-10-29
申请人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
发明人： Kai Erik Thomenius , Rayette Ann Fisher , Robert Gideon Wodnicki , Christopher Robert Hazard , Lowell Scott Smith , David Martin Mills
IPC分类号： H04R17/00 , A61B8/00
CPC分类号： H03M11/00 , B06B1/0207 , B06B1/0292 , G01N29/262 , G01N2291/044 , G01N2291/106
摘要： A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.
摘要翻译：一种包括可通过交换网络重新配置的传感器阵列的设备。传感器可以是光学，热或压力传感器或超声换能器。更具体地，该装置包括：多个传感器元件; 多条总线; 一组接入开关，用于选择性地将一行中的传感器元件连接到总线，其中一个接入开关连接到第一传感器元件; 多个矩阵开关组，每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件，矩阵开关中的一个连接到第一传感器元件，并且第二传感器元件，其不是该组传感器元件的构件; 以及控制电路，其根据选择的开关配置来控制接入开关和矩阵开关，使得第一传感器元件经由所述一个接入开关连接到总线，同时第二传感器元件连接到所述一个接入开关经由所述一个矩阵开关。

7. 发明授权

US07781238B2 Methods of making and using integrated and testable sensor array 有权
标题翻译：制作和使用集成和可测量传感器阵列的方法
公开(公告)号：US07781238B2
公开(公告)日：2010-08-24
申请号：US11951360
申请日：2007-12-06
申请人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
发明人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
IPC分类号： H01L21/66
CPC分类号： H01L22/20 , H01L22/14
摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.
摘要翻译：提供了制造可测试的传感器组件的方法。该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

8. 发明申请

US20090148967A1 METHODS OF MAKING AND USING INTEGRATED AND TESTABLE SENSOR ARRAY 有权
标题翻译：制造和使用集成和可测传感器阵列的方法
公开(公告)号：US20090148967A1
公开(公告)日：2009-06-11
申请号：US11951360
申请日：2007-12-06
申请人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
发明人： Robert Gideon Wodnicki , Stacey Joy Kennerly , Wei-Cheng Tian , Kevin Matthew Durocher , David Martin Mills , Charles Gerard Woychik , Lowell Scott Smith
IPC分类号： H01L21/66
CPC分类号： H01L22/20 , H01L22/14
摘要： A method for making a testable sensor assembly is provided. The method includes forming a first sensor array on a first substrate having a first side and a second side, wherein the first sensor array is formed on the first side of the first substrate, coupling a first semiconductor wafer having a first side and a second side to the first sensor array, wherein the first side of the first semiconductor wafer is coupled to the first sensor array, thinning one of the second side of the first substrate or the second side of the first semiconductor wafer, and testing the first sensor array to identify operational and non-operational units in the testable sensor assembly before integration of the sensor assembly with interface electronics.
摘要翻译：提供了制造可测试的传感器组件的方法。该方法包括在具有第一侧和第二侧的第一衬底上形成第一传感器阵列，其中第一传感器阵列形成在第一衬底的第一侧上，将具有第一侧和第二侧的第一半导体晶片到第一传感器阵列，其中第一半导体晶片的第一侧耦合到第一传感器阵列，使第一衬底的第二侧或第一半导体晶片的第二面之一变薄，并将第一传感器阵列测试为在将传感器组件与接口电子器件集成之前，确定可测试传感器组件中的操作和非操作单元。

9. 发明申请

US20100249598A1 ULTRASOUND PROBE WITH REPLACEABLE HEAD PORTION 审中-公开
标题翻译：超声波探头与可更换头部
公开(公告)号：US20100249598A1
公开(公告)日：2010-09-30
申请号：US12410525
申请日：2009-03-25
申请人： Lowell Scott Smith , Charles Edward Baumgartner , Charles Gerard Woychik , Warren Lee , Reinhold Bruestle , Ferdinand Puttinger
发明人： Lowell Scott Smith , Charles Edward Baumgartner , Charles Gerard Woychik , Warren Lee , Reinhold Bruestle , Ferdinand Puttinger
IPC分类号： A61B8/13 , H04R31/00
CPC分类号： B06B1/0622 , A61B8/00 , A61B8/0883 , A61B8/12 , A61B8/4411 , A61B8/4427 , A61B8/445 , A61B8/4455 , A61B8/483 , G01S7/52079 , G01S7/5208 , G01S7/52082 , Y10T29/49005
摘要： An ultrasound probe includes a transducer comprising an array of transducer elements removably disposed in a head portion. At least one or more stages of electronic circuit units is removably coupled to the transducer and configured to excite the transducer. A handle portion is detachably coupled to the head portion. The head portion and the handle portion are disposed enclosing the at least one or more stages of electronic circuit units. The ultrasound probe is used for one dimensional applications, two dimensional applications, and volumetric applications.
摘要翻译：超声波探头包括换能器，其包括可拆卸地设置在头部中的换能器元件阵列。电子电路单元的至少一个或多个级可移除地耦合到换能器并且被配置为激励换能器。手柄部分可拆卸地联接到头部。头部和把手部分被设置成包围至少一个或多个电子电路单元的阶段。超声波探头用于一维应用，二维应用和体积应用。

10. 发明授权

US08475375B2 System and method for actively cooling an ultrasound probe 有权
标题翻译：主动冷却超声波探头的系统和方法
公开(公告)号：US08475375B2
公开(公告)日：2013-07-02
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
IPC分类号： A61B8/00
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译：提供用于对物体成像的超声系统。超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。

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