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1. 发明申请

US20050228284A1 System and method for power management in an ultrasound system 审中-公开
标题翻译：超声系统电源管理系统及方法
公开(公告)号：US20050228284A1
公开(公告)日：2005-10-13
申请号：US10814830
申请日：2004-03-31
申请人： Charles Edward Baumgartner , George Charles Sogoian , Robert Stephen Lewandowski
发明人： Charles Edward Baumgartner , George Charles Sogoian , Robert Stephen Lewandowski
IPC分类号： A61B8/00 , A61B8/08 , G01S15/89
CPC分类号： G01S15/899 , A61B5/6844 , A61B5/6886 , A61B8/08 , A61B8/4444 , A61B8/546 , G01S7/52096
摘要： An ultrasound system including an ultrasound probe, which has an ultrasonic transducer and a physical sensor adapted to sense engagement with a subject to be scanned by the ultrasonic transducer. The ultrasound system also includes a control system coupled to the ultrasound probe.
摘要翻译：一种包括超声波探头的超声波系统，其具有超声波换能器和物理传感器，该物理传感器适于感测与被超声换能器扫描的被摄体的接合。超声系统还包括耦合到超声波探头的控制系统。

2. 发明申请

US20080146924A1 System and method for actively cooling an ultrasound probe 有权
标题翻译：主动冷却超声波探头的系统和方法
公开(公告)号：US20080146924A1
公开(公告)日：2008-06-19
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
IPC分类号： A61B8/00 , A61H1/00
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译：提供用于对物体成像的超声系统。超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。

3. 发明授权

US08475375B2 System and method for actively cooling an ultrasound probe 有权
标题翻译：主动冷却超声波探头的系统和方法
公开(公告)号：US08475375B2
公开(公告)日：2013-07-02
申请号：US11639891
申请日：2006-12-15
申请人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
发明人： Lowell Scott Smith , Robert Stephen Lewandowski , Bruno Hans Haider , Charles Edward Baumgartner , George Charles Sogoian , Christopher Stephen Yetter , Douglas Glenn Wildes , Stephen Royal Kaiser , Svein Bergstoel , Reinhold Bruestle , Tunc Icoz , Steinar Bjaerum , Chester Frank Saj
IPC分类号： A61B8/00
CPC分类号： G01S7/52079 , G01S7/52017 , G10K11/004
摘要： An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
摘要翻译：提供用于对物体成像的超声系统。超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。

4. 发明授权

US08742646B2 Ultrasound acoustic assemblies and methods of manufacture 有权
标题翻译：超音波组件及其制造方法
公开(公告)号：US08742646B2
公开(公告)日：2014-06-03
申请号：US13433422
申请日：2012-03-29
申请人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
发明人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
IPC分类号： H01L41/08 , B06B1/06
CPC分类号： B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
摘要： An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
摘要翻译：超声波声学组件包括多个超声波阵列，每个阵列包括声叠层，声堆叠包括与至少一个声阻抗分配层和支撑层组装的压电层。声学堆叠限定了多个切割切口和多个声学元件，使得切割切口形成在相邻的声学元件之间。切割切口延伸穿过压电层并通过声阻抗分层，但仅部分延伸穿过支撑层。超声波组件还包括许多专用集成电路（ASIC）芯片。每个超声波阵列耦合到相应的ASIC管芯，以形成相应的声电传感器模块。还提供了制造方法。

5. 发明申请

US20130257224A1 ULTRASOUND ACOUSTIC ASSEMBLIES AND METHODS OF MANUFACTURE 有权
标题翻译：超声波组件及其制造方法
公开(公告)号：US20130257224A1
公开(公告)日：2013-10-03
申请号：US13433422
申请日：2012-03-29
申请人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
发明人： Robert Gideon Wodnicki , Charles Edward Baumgartner , David Martin Mills , Kevin Matthew Durocher , William Hullinger Huber , George Charles Sogoian , Christopher James Kapusta
IPC分类号： H01L41/04 , H01L41/113 , H01L41/22 , H01L41/047
CPC分类号： B06B1/0622 , H01L41/338 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1433 , H01L2924/15321 , Y10T29/42 , H01L2924/00
摘要： An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
摘要翻译：超声波声学组件包括多个超声波阵列，每个阵列包括声叠层，声堆叠包括与至少一个声阻抗分配层和支撑层组装的压电层。声学堆叠限定了多个切割切口和多个声学元件，使得切割切口形成在相邻的声学元件之间。切割切口延伸穿过压电层并通过声阻抗分层，但仅部分延伸穿过支撑层。超声波组件还包括许多专用集成电路（ASIC）芯片。每个超声波阵列耦合到相应的ASIC管芯，以形成相应的声电传感器模块。还提供了制造方法。

6. 发明申请

US20120133001A1 TILEABLE SENSOR ARRAY 有权
标题翻译：可传感器阵列
公开(公告)号：US20120133001A1
公开(公告)日：2012-05-31
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L27/00 , H01L31/18 , H01L21/60
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

7. 发明授权

US07791252B2 Ultrasound probe assembly and method of fabrication 有权
标题翻译：超声探头组件及其制造方法
公开(公告)号：US07791252B2
公开(公告)日：2010-09-07
申请号：US11668656
申请日：2007-01-30
申请人： Charles Edward Baumgartner , Robert Stephen Lewandowski , Kevin Matthew Durocher , David Chartrand
发明人： Charles Edward Baumgartner , Robert Stephen Lewandowski , Kevin Matthew Durocher , David Chartrand
IPC分类号： H04R17/00
CPC分类号： G03B42/06 , A61B8/00 , B06B1/0629 , G01S15/8925
摘要： An ultrasonic imaging system wherein an exemplary system includes an array of transducer elements arranged along a first plane for transmitting first signals and receiving reflected signals for image processing. Circuit structures each have a major surface positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures in a stack-like formation. Electrical connections are formed between adjacent circuit structures in the sequence. A connector region on each circuit structure includes a distal portion extending away from the major surface-with distal portions of connector regions of adjacent structures spaced apart from one another. A first wiring pattern extends from the major surface to the distal portion of the connector region. The plurality of circuit structures are configured to provide a second wiring pattern including at least some of the electrical connections formed between the circuit structures, extending from one or more of the first wiring patterns to multiple of the transducer elements.
摘要翻译：一种超声波成像系统，其中示例性系统包括沿着第一平面布置的用于传输第一信号并接收用于图像处理的反射信号的换能器元件阵列。电路结构各自具有相对于另一电路结构的主表面位于共平面取向的主表面，以提供堆叠状结构中的结构序列。在相邻电路结构之间形成电连接。每个电路结构上的连接器区域包括远离主表面延伸的远端部分，相邻结构的连接器区域的远端部分彼此间隔开。第一布线图案从连接器区域的主表面延伸到远端部分。多个电路结构被配置为提供第二布线图案，其包括形成在电路结构之间的至少一些电连接，从一个或多个第一布线图案延伸到多个换能器元件。

8. 发明授权

US07622848B2 Transducer assembly with z-axis interconnect 有权
标题翻译：具有z轴互连的传感器组件
公开(公告)号：US07622848B2
公开(公告)日：2009-11-24
申请号：US11327779
申请日：2006-01-06
申请人： Warren Lee , Charles Edward Baumgartner , Douglas Glenn Wildes , Robert Stephen Lewandowski
发明人： Warren Lee , Charles Edward Baumgartner , Douglas Glenn Wildes , Robert Stephen Lewandowski
IPC分类号： H01L41/08
CPC分类号： G10K11/002 , A61B8/12 , A61B8/445 , B06B1/0629 , G10K11/34
摘要： A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.
摘要翻译：介绍了z轴互连的复合结构。复合结构包括交替布置在多个互连层之间的多层背衬材料，其中多个互连层被配置为便于将z轴互连的复合结构耦合到换能器阵列，其中复合结构 z轴互连配置用于侵入性探针。

9. 发明申请

US20080178677A1 Ultrasound Probe Assembly and Method of Fabrication 有权
标题翻译：超声波探头组件及其制作方法
公开(公告)号：US20080178677A1
公开(公告)日：2008-07-31
申请号：US11668656
申请日：2007-01-30
申请人： Charles Edward Baumgartner , Robert Stephen Lewandowski , Kevin Matthew Durocher , David Chartrand
发明人： Charles Edward Baumgartner , Robert Stephen Lewandowski , Kevin Matthew Durocher , David Chartrand
IPC分类号： G01N29/04
CPC分类号： G03B42/06 , A61B8/00 , B06B1/0629 , G01S15/8925
摘要： An ultrasonic imaging system (200). An exemplary system includes an array of transducer elements (50) arranged along a first plane (P1) for transmitting first signals and receiving reflected signals for image processing. Circuit structures (10, 20, 30, 40) each have a major surface (1a) positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures (10, 20, 30, 40) in a stack-like formation. Electrical connections (34, 47) are formed between adjacent circuit structures in the sequence. A connector region (1b or 1b′) on each circuit structure includes a distal portion (1c or 1c′) extending away from the major surface (1a), with distal portions (1c, 1c′) of connector regions of adjacent structures spaced apart from one another. A first wiring pattern (41, 45, 46) extends from the major surface to the distal portion of the connector region. The plurality of circuit structures are configured to provide a second wiring pattern (34, 35, 37, 45, 47) including at least some of the electrical connections (34, 47) formed between the circuit structures, extending from one or more of the first wiring patterns to multiple of the transducer elements (50).
摘要翻译：超声波成像系统（200）。示例性系统包括沿着第一平面（P 1）布置的用于传输第一信号并接收用于图像处理的反射信号的换能器元件阵列（50）。电路结构（10,20,30,40）各自具有相对于另一个电路结构的主表面以共平面取向定位的主表面（1a），以提供结构（10,20）的序列，30,40）。电连接（34,47）按顺序形成在相邻电路结构之间。每个电路结构上的连接器区域（1b或1b'）包括远离主表面（1a）延伸的远端部分（1c或1c'），远端部分（1c，1c'）相邻结构的连接器区域彼此间隔开。第一布线图案（41,45,46）从连接器区域的主表面延伸到远端部分。多个电路结构被配置为提供第二布线图案（34,35,37,45,47），其包括形成在电路结构之间的至少一些电连接（34,47），所述电连接（34,47）从一个或多个第一布线图案到多个换能器元件（50）。

10. 发明授权

US08659148B2 Tileable sensor array 有权
标题翻译：可分层传感器阵列
公开(公告)号：US08659148B2
公开(公告)日：2014-02-25
申请号：US12956194
申请日：2010-11-30
申请人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
发明人： John Eric Tkaczyk , Lowell Scott Smith , Charles Edward Baumgartner , Robert Gideon Wodnicki , Rayette Ann Fisher , Charles Gerard Woychik , Robert Stephen Lewandowski
IPC分类号： H01L23/34
CPC分类号： H01L27/20 , A61B8/4483 , H01L27/14634 , H01L27/14658 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/00
摘要： A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.
摘要翻译：提出了一种形成可瓦片检测器阵列的方法。该方法包括形成检测器模块，其中形成检测器模块包括提供具有第一侧和第二侧的传感器阵列，其中传感器阵列包括设置在传感器阵列的第二侧上的第一组多个接触垫，传感器阵列，其中所述互连层包括具有第一侧和第二侧的再分配层，其中所述再分布层包括设置在所述第一侧上的第二多个接触焊盘，具有多个通孔的集成电路其中集成电路的第一侧可操作地耦合到再分布层的第二侧，其中传感器阵列设置在互连层上，使得传感器阵列的第二侧上的第一组多个接触焊盘是与再分配层的第一侧上的第二多个接触焊盘对准，可操作地连接冷杉传感器阵列的第二侧上的多个接触焊盘连接到再分配层上的第二多个接触焊盘，以形成传感器堆叠，将传感器堆叠耦合到衬底以形成检测器模块，并且平铺多个检测器模块在第二基板上形成可瓦片检测器阵列。

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