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    • 1. 发明授权
    • Process to form narrow write track for magnetic recording
    • 形成用于磁记录的窄写轨的过程
    • US06821717B2
    • 2004-11-23
    • US10210955
    • 2002-08-02
    • Charles C. LinKochan JuJeiwei Chang
    • Charles C. LinKochan JuJeiwei Chang
    • G11B531
    • C25D5/022Y10T29/49032
    • As the recording density of magnetic disk drives approaches 100 Gbits/in2, write track lengths of about 0.10 microns will be required. This cannot be accomplished using conventional photolithography. The present invention solves this problem by first forming on the bottom pole of the write head a cavity in a layer of photoresist, using conventional means. A seed layer of non-magnetic material is electrolessly laid down, following which a second layer of photoresist is deposited and patterned to form a second cavity that symmetrically surrounds the first one, thereby forming a mold around it. Ferromagnetic metal is then electro-deposited in this mold to form the top magnetic pole. Following the removal of all photoresist and a brief selective etch of the bottom pole, an extremely narrow write head is obtained.
    • 由于磁盘驱动器的记录密度接近100G比特/英寸,所以需要大约0.10微米的写入磁道长度。 这不能用常规的光刻法来实现。 本发明通过使用常规方法首先在写入头的底极上形成光致抗蚀剂层中的空腔来解决这个问题。 非磁性材料的籽晶层被无电镀敷,随后沉积第二层光致抗蚀剂并图案化以形成对称地围绕第一腔的第二腔,从而在其周围形成模具。 然后将铁磁金属电沉积在该模具中以形成顶部磁极。 除去所有光致抗蚀剂和对底极进行短暂的选择性蚀刻之后,获得极窄的写入头。
    • 2. 发明授权
    • CPP head with parasitic shunting reduction
    • CPP头与寄生分流减少
    • US07279269B2
    • 2007-10-09
    • US10734422
    • 2003-12-12
    • Jeiwei ChangStuart KaoChao Peng ChenChunping LuoKochan JuMin Li
    • Jeiwei ChangStuart KaoChao Peng ChenChunping LuoKochan JuMin Li
    • G11B5/39
    • G11B5/3163G11B5/398Y10T428/1171
    • The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.
    • CPP GMR堆叠的串联电阻可以通过将其成形为较小的上部,在较小的较低部分上来减小。 由于涉及亚微米尺寸,这些之间的良好对准通常难以实现。 本发明公开了一种基于第一次铺设掩模的自对准过程,该掩模将确定顶部的形状。 然后开始离子束蚀刻,离子束最初仅从一侧以与表面法线成一定角度施加。 在蚀刻期间,掩模近侧的所有材料都被蚀刻,但在远侧,只有在掩模阴影之外的材料被去除,因此根据光束的角度,下部的尺寸被控制,并且上部 部分精确地集中在其上。
    • 5. 发明申请
    • CPP head with parasitic shunting reduction
    • CPP头与寄生分流减少
    • US20080050615A1
    • 2008-02-28
    • US11901584
    • 2007-09-18
    • Jeiwei ChangStuart KaoChao ChenChunping LuoKochan JuMin Li
    • Jeiwei ChangStuart KaoChao ChenChunping LuoKochan JuMin Li
    • G11B5/33
    • G11B5/3163G11B5/398Y10T428/1171
    • The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.
    • CPP GMR堆叠的串联电阻可以通过将其成形为较小的上部,在较小的较低部分上来减小。 由于涉及亚微米尺寸,这些之间的良好对准通常难以实现。 本发明公开了一种基于第一次铺设掩模的自对准过程,该掩模将确定顶部的形状。 然后开始离子束蚀刻,离子束最初仅从一侧以与表面法线成一定角度施加。 在蚀刻期间,掩模近侧的所有材料都被蚀刻,但在远侧,只有在掩模阴影之外的材料被去除,因此根据光束的角度,下部的尺寸被控制,并且上部 部分精确地集中在其上。
    • 7. 发明授权
    • CPP head with parasitic shunting reduction
    • CPP头与寄生分流减少
    • US07864490B2
    • 2011-01-04
    • US11901584
    • 2007-09-18
    • Jeiwei ChangStuart KaoChao Peng ChenChunping LuoKochan JuMin Li
    • Jeiwei ChangStuart KaoChao Peng ChenChunping LuoKochan JuMin Li
    • G11B5/33
    • G11B5/3163G11B5/398Y10T428/1171
    • The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.
    • CPP GMR堆叠的串联电阻可以通过将其成形为较小的上部,在较小的较低部分上来减小。 由于涉及亚微米尺寸,这些之间的良好对准通常难以实现。 本发明公开了一种基于第一次铺设掩模的自对准过程,该掩模将确定顶部的形状。 然后开始离子束蚀刻,离子束最初仅从一侧以与表面法线成一定角度施加。 在蚀刻期间,掩模近侧的所有材料都被蚀刻,但在远侧,只有在掩模阴影之外的材料被去除,因此根据光束的角度,下部的尺寸被控制,并且上部 部分精确地集中在其上。
    • 10. 发明申请
    • CPP head with parasitic shunting reduction
    • CPP头与寄生分流减少
    • US20050130070A1
    • 2005-06-16
    • US10734422
    • 2003-12-12
    • Jeiwei ChangStuart KaoChao ChenChunping LuoKochan JuMin Li
    • Jeiwei ChangStuart KaoChao ChenChunping LuoKochan JuMin Li
    • G03F7/00G11B5/31G11B5/39
    • G11B5/3163G11B5/398Y10T428/1171
    • The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.
    • CPP GMR堆叠的串联电阻可以通过将其成形为较小的上部,在较小的较低部分上来减小。 由于涉及亚微米尺寸,这些之间的良好对准通常难以实现。 本发明公开了一种基于第一次铺设掩模的自对准过程,该掩模将确定顶部的形状。 然后开始离子束蚀刻,离子束最初仅从一侧以与表面法线成一定角度施加。 在蚀刻期间,掩模近侧的所有材料都被蚀刻,但在远侧,只有在掩模阴影之外的材料被去除,因此根据光束的角度,下部的尺寸被控制,并且上部 部分精确地集中在其上。