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1. 发明授权

US08378382B2 High aspect-ratio PN-junction and method for manufacturing the same 有权
标题翻译：高纵横比PN结及其制造方法
公开(公告)号：US08378382B2
公开(公告)日：2013-02-19
申请号：US11027807
申请日：2004-12-30
申请人： Chao-I Wu , Ming Hsiu Lee
发明人： Chao-I Wu , Ming Hsiu Lee
IPC分类号： H01L29/66 , H01L29/861
CPC分类号： H01L27/0814 , H01L27/1021 , H01L29/8613
摘要： A semiconductor device having high-aspect-ratio PN-junctions is provided. The semiconductor device includes a conducting layer. The semiconductor device further includes a plurality of first doped regions formed over the conducting layer. The sidewalls of the doped regions are doped to form PN-junctions. The semiconductor device also includes a plurality of second doped regions over the first doped regions.
摘要翻译：提供了具有高纵横比PN结的半导体器件。半导体器件包括导电层。半导体器件还包括形成在导电层上的多个第一掺杂区域。掺杂区域的侧壁被掺杂以形成PN结。半导体器件还包括在第一掺杂区域上的多个第二掺杂区域。

2. 发明授权

US08363463B2 Phase change memory having one or more non-constant doping profiles 有权
标题翻译：具有一个或多个非恒定掺杂分布的相变存储器
公开(公告)号：US08363463B2
公开(公告)日：2013-01-29
申请号：US12729837
申请日：2010-03-23
申请人： Yen-Hao Shih , Huai-Yu Cheng , Chieh-Fang Chen , Chao-I Wu , Ming Hsiu Lee , Hsiang-Lan Lung , Matthew J. Breitwisch , Simone Raoux , Chung H Lam
发明人： Yen-Hao Shih , Huai-Yu Cheng , Chieh-Fang Chen , Chao-I Wu , Ming Hsiu Lee , Hsiang-Lan Lung , Matthew J. Breitwisch , Simone Raoux , Chung H Lam
IPC分类号： G11C11/00
CPC分类号： H01L45/1625 , G11C13/0004 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/144 , H01L45/1641
摘要： A phase change memory device with a memory element including a basis phase change material, such as a chalcogenide, and one or more additives, where the additive or additives have a non-constant concentration profile along an inter-electrode current path through a memory element. The use of “non-constant” concentration profiles for additives enables doping the different zones with different materials and concentrations, according to the different crystallographic, thermal and electrical conditions, and different phase transition conditions.
摘要翻译：一种具有存储元件的相变存储器件，该存储元件包括诸如硫族化物的基本相变材料和一种或多种添加剂，其中所述添加剂或添加剂沿着穿过存储元件的电极间电流路径具有非恒定浓度分布。根据不同的晶体学，热学和电学条件以及不同的相变条件，使用非恒定浓度分布的添加剂可以使用不同的材料和浓度掺杂不同的区域。

3. 发明申请

US20110317480A1 PHASE CHANGE MEMORY CODING 有权
标题翻译：相变存储器编码
公开(公告)号：US20110317480A1
公开(公告)日：2011-12-29
申请号：US12823508
申请日：2010-06-25
申请人： HSIANG-LAN LUNG , Ming Hsiu Lee , Yen-Hao Shih , Tien-Yen Wang , Chao-I Wu
发明人： HSIANG-LAN LUNG , Ming Hsiu Lee , Yen-Hao Shih , Tien-Yen Wang , Chao-I Wu
IPC分类号： G11C11/00 , H01L21/06
CPC分类号： G11C13/0004 , G11C11/5678 , G11C13/004 , G11C13/0069 , G11C2013/0092
摘要： An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.
摘要翻译：集成电路相变存储器可以通过在一些单元和存储器中引起第一电阻状态以及存储器中的第二电阻状态以及存储器中的一些其他单元来表示数据集而被预编码。在对数据集进行编码之后，将集成电路相变存储器安装在基板上。在安装集成电路相变存储器之后，通过感测第一和第二电阻状态以及将第一电阻状态下的单元改变为第三电阻状态并将第二电阻状态的单元改变为第四电阻状态来读取数据组。第一和第二电阻状态在焊接或其他热循环过程之后保持感测裕度。第三和第四电阻状态的特征在于能够使用更高速度和更低功率的转换，适用于电路的任务功能。

4. 发明申请

US20100328996A1 PHASE CHANGE MEMORY HAVING ONE OR MORE NON-CONSTANT DOPING PROFILES 有权
标题翻译：具有一个或多个不间断的配置文件的相位更改记忆
公开(公告)号：US20100328996A1
公开(公告)日：2010-12-30
申请号：US12729837
申请日：2010-03-23
申请人： YEN-HAO SHIH , Huai-Yu Cheng , Chieh-Fang Chen , Chao-I Wu , Ming-Hsiu Lee , Hsiang-Lan Lung , Matthew J. Breitwisch , Simone Raoux , Chung Hon Lam
发明人： YEN-HAO SHIH , Huai-Yu Cheng , Chieh-Fang Chen , Chao-I Wu , Ming-Hsiu Lee , Hsiang-Lan Lung , Matthew J. Breitwisch , Simone Raoux , Chung Hon Lam
IPC分类号： G11C11/00 , H01L45/00
CPC分类号： H01L45/1625 , G11C13/0004 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/144 , H01L45/1641
摘要： A phase change memory device with a memory element including a basis phase change material, such as a chalcogenide, and one or more additives, where the additive or additives have a non-constant concentration profile along an inter-electrode current path through a memory element. The use of “non-constant” concentration profiles for additives enables doping the different zones with different materials and concentrations, according to the different crystallographic, thermal and electrical conditions, and different phase transition conditions.
摘要翻译：一种具有存储元件的相变存储器件，该存储元件包括诸如硫族化物的基本相变材料和一种或多种添加剂，其中所述添加剂或添加剂沿着穿过存储元件的电极间电流路径具有非恒定浓度分布。根据不同的晶体学，热学和电学条件以及不同的相变条件，使用“非恒定”浓度分布的添加剂可以使用不同的材料和浓度掺杂不同的区域。

5. 发明申请

US20100328995A1 METHODS AND APPARATUS FOR REDUCING DEFECT BITS IN PHASE CHANGE MEMORY 有权
标题翻译：减少相变记忆中缺陷位的方法和装置
公开(公告)号：US20100328995A1
公开(公告)日：2010-12-30
申请号：US12715802
申请日：2010-03-02
申请人： YEN-HAO SHIH , Ming-Hsiu Lee , Chao-I Wu , Hsiang-Lan Lung , Chung Hon Lam , Roger Cheek , Matthew J. Breitwisch , Bipin Rajendran
发明人： YEN-HAO SHIH , Ming-Hsiu Lee , Chao-I Wu , Hsiang-Lan Lung , Chung Hon Lam , Roger Cheek , Matthew J. Breitwisch , Bipin Rajendran
IPC分类号： G11C11/00
CPC分类号： G11C13/0004 , G11C13/004 , G11C29/70 , G11C2213/79
摘要： Phase change memory devices and methods for operating described herein are based on the discovery that, following an initial high current operation applied to a phase change memory cell to establish the high resistance reset state, the current-voltage (I-V) behavior of the memory cell under different bias voltages can be used to detect if the memory cell is a defect cell having poor data retention characteristics.
摘要翻译：相位变化存储器件和这里描述的操作方法基于以下发现：在施加到相变存储器单元以建立高电阻复位状态的初始高电流操作之后，存储器单元的电流 - 电压（IV）行为可以使用不同的偏置电压来检测存储器单元是否具有差的数据保留特性的缺陷单元。

6. 发明申请

US20100290293A1 METHOD OF IDENTIFYING LOGICAL INFORMATION IN A PROGRAMMING AND ERASING CELL BY ON-SIDE READING SCHEME 审中-公开
标题翻译：通过边界读取方案识别编程和擦除单元中的逻辑信息的方法
公开(公告)号：US20100290293A1
公开(公告)日：2010-11-18
申请号：US12845064
申请日：2010-07-28
申请人： Chao-I Wu , Ming-Hsiu Lee , Tzu-Hsuan Hsu
发明人： Chao-I Wu , Ming-Hsiu Lee , Tzu-Hsuan Hsu
IPC分类号： G11C16/04
CPC分类号： G11C16/0475
摘要： A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要翻译：公开了一种识别单元中的逻辑信息的方法，特别是在通过单孔读取方案通过热空穴注入氮化物电子存储（PHINES）单元编程中的方法。该方法包括以下步骤：通过将局部阈值电压（Vt）增加到一定值来擦除PHINES单元的第一区域和第二区域; 通过热空穴注入来编程PHINES单元的第一区域和第二区域中的至少一个; 以及通过测量所述第一区域和所述第二区域之一的输出电流来读取所述PHINES单元的逻辑状态; 其中，通过存储在第一区域和第二区域中的不同量的热孔之间的相互作用引起不同量的输出电流，以便通过单面读取方案确定PHINES单元的逻辑状态。

7. 发明授权

US07495967B2 Method of identifying logical information in a programming and erasing cell by on-side reading scheme 有权
标题翻译：通过旁路读取方案识别编程和擦除单元中的逻辑信息的方法
公开(公告)号：US07495967B2
公开(公告)日：2009-02-24
申请号：US11601710
申请日：2006-11-20
申请人： Chao-I Wu , Ming-Hsiu Lee , Tzu-Hsuan Hsu
发明人： Chao-I Wu , Ming-Hsiu Lee , Tzu-Hsuan Hsu
IPC分类号： G11C11/34
CPC分类号： G11C16/0475
摘要： A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要翻译：公开了一种识别单元中的逻辑信息的方法，特别是在通过单孔读取方案通过热空穴注入氮化物电子存储（PHINES）单元编程中的方法。该方法包括以下步骤：通过将局部阈值电压（Vt）增加到一定值来擦除PHINES单元的第一区域和第二区域; 通过热空穴注入来编程PHINES单元的第一区域和第二区域中的至少一个; 以及通过测量所述第一区域和所述第二区域之一的输出电流来读取所述PHINES单元的逻辑状态; 其中，通过存储在第一区域和第二区域中的不同量的热孔之间的相互作用引起不同量的输出电流，以便通过单面读取方案确定PHINES单元的逻辑状态。

8. 发明申请

US20070296023A1 Charge Monitoring Devices and Methods for Semiconductor Manufacturing 审中-公开
标题翻译：充电监控设备和半导体制造方法
公开(公告)号：US20070296023A1
公开(公告)日：2007-12-27
申请号：US11425469
申请日：2006-06-21
申请人： Chao-I Wu , Ming Hsiu Lee
发明人： Chao-I Wu , Ming Hsiu Lee
IPC分类号： H01L29/792
CPC分类号： H01L29/7923 , H01L29/66833
摘要： A charge monitoring device is described for monitoring charging effect during semiconductor manufacturing. In a first aspect of the invention, a charge storage MOS memory structure comprises a substrate body, an oxide-nitride-oxide structure that overlays a top surface of the substrate and extends above the edges between a source region and a drain region, and a polygate formed over the oxide-nitride-oxide structure. When a charging source, such as UV light or plasma, is projected onto the charge storage device, the polygate of the charge storage device protects the nitride layer from charging effect The light source charges side walls of the oxide-nitride-oxide structure.
摘要翻译：描述了用于监视半导体制造期间的充电效果的充电监视装置。在本发明的第一方面中，电荷存储MOS存储器结构包括衬底主体，覆盖衬底的顶表面并在源极区域和漏极区域之间的边缘之上延伸的氧化物 - 氧化物 - 氧化物结构，以及在氧化物 - 氮化物 - 氧化物结构上形成多晶硅。当诸如UV光或等离子体的充电源投射到电荷存储装置上时，电荷存储装置的多晶硅保护氮化物层免受充电效应。光源对氧化物 - 氧化物 - 氧化物结构的侧壁充电。

9. 发明申请

US20050124116A1 3D polysilicon ROM and method of fabrication thereof 有权
标题翻译： 3D多晶硅ROM及其制造方法
公开(公告)号：US20050124116A1
公开(公告)日：2005-06-09
申请号：US10728767
申请日：2003-12-08
申请人： Tzu-Hsuan Hsu , Ming-Hsiu Lee , Hsiang-Lan Lung , Chao-I Wu
发明人： Tzu-Hsuan Hsu , Ming-Hsiu Lee , Hsiang-Lan Lung , Chao-I Wu
IPC分类号： H01L21/336 , H01L27/06 , H01L31/113
CPC分类号： H01L27/0688
摘要： A 3D polysilicon read only memory at least including: a silicon substrate, an isolated silicon dioxide (SiO2) layer, a N-Type heavily doped (N+) polysilicon layer, a first oxide layer, a dielectric layer, a P-Type lightly doped (P−) polysilicon layer, at least a neck structure, and a second oxide layer. The isolated SiO2 layer is deposited on the silicon substrate, and the N+ polysilicon layer is deposited on the isolated SiO2 layer. The N+ polysilicon layer is further defined a plurality of parallel, separate word lines (WL), and the first oxide layer is filled in the space between the word lines. The dielectric layer is deposited on the word lines and the first oxide layer. The P-Type lightly doped (P−) polysilicon layer is deposited on the dielectric layer and is further defined a plurality of parallel, separate bit lines (BL). The bit lines overlap the word lines, from a top view, to form a shape approximately as a cross. There are at least a neck structure individually formed between the first polysilicon layer and the second polysilicon layer by isotropy wet etching the dielectric layer, with using dilute hydrofluoric acid (HF) as the example. The second oxide layer is filled in the space between the bit lines and is on the word lines and the first oxide layer.
摘要翻译：至少包括硅衬底，隔离二氧化硅（SiO 2）层，N型重掺杂（N +）多晶硅层，第一氧化物层，电介质层，P型轻掺杂（P）多晶硅层，至少颈部结构和第二氧化物层。隔离的SiO 2层沉积在硅衬底上，并且N +多晶硅层沉积在隔离的SiO 2层上。 N +多晶硅层进一步限定多个平行的单独的字线（WL），并且第一氧化物层被填充在字线之间的空间中。介电层沉积在字线和第一氧化物层上。 P型轻掺杂（P）多晶硅层沉积在电介质层上，并进一步限定多个平行的分开的位线（BL）。位线从顶视图与字线重叠，以形成大致为十字形的形状。通过使用稀氢氟酸（HF）作为实例，通过各向同性湿蚀刻介电层，至少在第一多晶硅层和第二多晶硅层之间形成颈部结构。第二氧化物层填充在位线之间的空间中，并且位于字线和第一氧化物层上。

10. 发明授权

US08238149B2 Methods and apparatus for reducing defect bits in phase change memory 有权
标题翻译：用于减少相变存储器中缺陷位的方法和装置
公开(公告)号：US08238149B2
公开(公告)日：2012-08-07
申请号：US12715802
申请日：2010-03-02
申请人： Yen-Hao Shih , Ming-Hsiu Lee , Chao-I Wu , Hsiang-Lan Lung , Chung Hon Lam , Roger Cheek , Matthew J. Breitwisch , Bipin Rajendran
发明人： Yen-Hao Shih , Ming-Hsiu Lee , Chao-I Wu , Hsiang-Lan Lung , Chung Hon Lam , Roger Cheek , Matthew J. Breitwisch , Bipin Rajendran
IPC分类号： G11C11/00
CPC分类号： G11C13/0004 , G11C13/004 , G11C29/70 , G11C2213/79
摘要： Phase change memory devices and methods for operating described herein are based on the discovery that, following an initial high current operation applied to a phase change memory cell to establish the high resistance reset state, the current-voltage (I-V) behavior of the memory cell under different bias voltages can be used to detect if the memory cell is a defect cell having poor data retention characteristics.
摘要翻译：相位变化存储器件和这里描述的操作方法基于以下发现：在施加到相变存储器单元以建立高电阻复位状态的初始高电流操作之后，存储器单元的电流 - 电压（IV）行为可以使用不同的偏置电压来检测存储器单元是否具有差的数据保留特性的缺陷单元。

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