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1. 发明授权

US07068107B2 Variable gain amplifier 有权
标题翻译：可变增益放大器
公开(公告)号：US07068107B2
公开(公告)日：2006-06-27
申请号：US10805297
申请日：2004-03-22
申请人： Wen-Chi Wang , Chao-Cheng Lee , Jui-Cheng Huang , Jui-Yuan Tsai
发明人： Wen-Chi Wang , Chao-Cheng Lee , Jui-Cheng Huang , Jui-Yuan Tsai
IPC分类号： H03F3/30
CPC分类号： H03G1/0088
摘要： The variable gain amplifier of the present invention includes at least an operation amplifier. By choosing one of output stages, a feedback resistor is selected and the gain of the variable gain amplifier is decided according to the resistance of the selected feedback resistor, as desired. By adjusting the gain of the variable gain amplifier, the received signals can be amplified or attenuated in accordance with design requirement. The variable gain amplifier can include a two-stage architecture, in which a first stage is used for coarse gain adjustment and a second stage is used for fine gain adjustment. The gain of the two-stage variable gain amplifier can be easily adjusted to a desired value.
摘要翻译：本发明的可变增益放大器至少包括一个运算放大器。通过选择输出级之一，根据需要选择反馈电阻，并根据所选反馈电阻的电阻决定可变增益放大器的增益。通过调整可变增益放大器的增益，接收信号可以根据设计要求进行放大或衰减。可变增益放大器可以包括两级架构，其中第一级用于粗增益调整，第二级用于精细增益调整。两级可变增益放大器的增益可以很容易地调整到所需的值。

2. 发明授权

US07496417B2 Audio processing system for use in multi-channel audio chip 有权
标题翻译：音频处理系统用于多声道音频芯片
公开(公告)号：US07496417B2
公开(公告)日：2009-02-24
申请号：US10734257
申请日：2003-12-15
申请人： Chao-Cheng Lee , Jui-Cheng Huang
发明人： Chao-Cheng Lee , Jui-Cheng Huang
IPC分类号： G06F17/00
CPC分类号： H04S3/00
摘要： An audio processing system for used in a multi-channel audio chip includes a multiplexer, a digital-to-analog converter, a de-multiplexer, a controller and N sample-and-hold circuits. The multiplexer receives N digital signals and outputs the digital signals one by one in a time-division manner. The digital-to-analog converter receives the digital signals from the multiplexer and converts them into corresponding N analog signals. The de-multiplexer outputs the analog signals one by one in a time-division manner. The controller generates control signals to control the selection of the multiplexer and the de-multiplexer. The sample-and-hold circuits hold the analog signals for a predetermined period of time and then outputs the signals, respectively.
摘要翻译：用于多声道音频芯片的音频处理系统包括多路复用器，数模转换器，去多路复用器，控制器和N个采样和保持电路。多路复用器接收N个数字信号并以时分方式逐个输出数字信号。数模转换器从多路复用器接收数字信号并将其转换成相应的N个模拟信号。解复用器以时分方式逐个输出模拟信号。控制器产生控制信号以控制多路复用器和解复用器的选择。采样保持电路将模拟信号保持预定的时间段，然后分别输出信号。

3. 发明授权

US07138869B2 Amplifier circuit 有权
标题翻译：放大器电路
公开(公告)号：US07138869B2
公开(公告)日：2006-11-21
申请号：US10748667
申请日：2003-12-31
申请人： Chao-Cheng Lee , Jui-Cheng Huang , Jui-Yuan Tsai , Wen-Chi Wang
发明人： Chao-Cheng Lee , Jui-Cheng Huang , Jui-Yuan Tsai , Wen-Chi Wang
IPC分类号： H03G3/12
CPC分类号： H03H11/126 , H03H7/24
摘要： An amplifier circuit having a high time constant. An operational amplifier includes a non-converting input terminal coupled to a ground, a converting input terminal and an output terminal. A first resistor network including at least one stage is coupled between the converting input terminal and the output terminal. Each stage of the first resistor network includes a first node, a first current path and a second current path connected to the first node. The first current path of each stage of the first resistor network is connected to the first node of the next stage, the second current path of each stage of the first resistor network is grounded, and the first current path of the first stage of the first resistor network is connected to the converting input terminal. A loading unit is coupled between the converting input terminal and the output terminal.
摘要翻译：具有高时间常数的放大器电路。运算放大器包括耦合到地的非转换输入端，转换输入端和输出端。包括至少一个级的第一电阻网络耦合在转换输入端和输出端之间。第一电阻网络的每个级包括连接到第一节点的第一节点，第一电流路径和第二电流路径。第一电阻网络的每个级的第一电流路径连接到下一级的第一节点，第一电阻网络的每一级的第二电流路径接地，并且第一电阻网络的第一级的第一电流路径电阻网络连接到转换输入端。加载单元耦合在转换输入端和输出端之间。

4. 发明授权

US08569808B1 Temperature stabilitized MEMS 有权
标题翻译：温度稳定的MEMS
公开(公告)号：US08569808B1
公开(公告)日：2013-10-29
申请号：US13441134
申请日：2012-04-06
申请人： Tung-Tsun Chen , Chia-Hua Chu , Chung-Hsien Lin , Jui-Cheng Huang
发明人： Tung-Tsun Chen , Chia-Hua Chu , Chung-Hsien Lin , Jui-Cheng Huang
IPC分类号： H01L29/66
CPC分类号： H01L23/34 , B81B7/0096 , B81B2201/0278 , B81C1/0023 , H01L23/345 , H01L27/0629 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device with temperature control system. Embodiments of the device may include a MEMS chip including a first heater with a dedicated first temperature control loop and a CMOS chip including a second heater with a dedicated second temperature control loop. Each control loop may have a dedicated temperature sensor for controlling the thermal output of each heater. The first heater and sensor are disposed proximate to a MEMS device in the MEMS chip for direct heating thereof. The temperature of the MEMS chip and CMOS chip are independently controllable of each other via the temperature control loops.
摘要翻译：具有温度控制系统的半导体器件。该装置的实施例可以包括包括具有专用第一温度控制回路的第一加热器和包括具有专用第二温度控制回路的第二加热器的CMOS芯片的MEMS芯片。每个控制回路可以具有用于控制每个加热器的热输出的专用温度传感器。第一加热器和传感器靠近MEMS芯片中的MEMS器件设置，用于直接加热MEMS芯片。 MEMS芯片和CMOS芯片的温度可以通过温度控制回路彼此独立控制。

5. 发明申请

US20090194852A1 SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING 有权
标题翻译：具有电磁干扰屏蔽的半导体器件封装
公开(公告)号：US20090194852A1
公开(公告)日：2009-08-06
申请号：US12336407
申请日：2008-12-16
申请人： Chi-Tsung Chiu , Chih-Pin Hung , Jui-Cheng Huang
发明人： Chi-Tsung Chiu , Chih-Pin Hung , Jui-Cheng Huang
IPC分类号： H01L23/552 , H01L21/50
CPC分类号： H01L24/97 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49805 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2221/68331 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
摘要翻译：这里描述的是具有EMI屏蔽和相关方法的半导体器件封装。在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）接地元件，其设置在所述基板单元的周边附近并从所述基板单元的上表面向上延伸; （3）邻近上表面设置的半导体器件; （4）与所述上表面相邻并且覆盖所述半导体器件和所述接地元件的封装体; 和（5）邻近封装体的外表面设置并电连接到接地元件的侧表面的EMI屏蔽。封装主体的侧表面基本上与衬底单元的侧表面对准。接地元件对应于导电凸块的残余物，并且提供了入射到EMI屏蔽上的接地电磁辐射的电路径。

6. 发明授权

US06911927B2 Over-sampling digital-to-analog converter with variable sampling frequencies 有权
标题翻译：具有可变采样频率的过采样数模转换器
公开(公告)号：US06911927B2
公开(公告)日：2005-06-28
申请号：US10310323
申请日：2002-12-05
申请人： Wen-Chi Wang , Shih-Yu Ku , Jui-Cheng Huang , Yi-Shu Chang
发明人： Wen-Chi Wang , Shih-Yu Ku , Jui-Cheng Huang , Yi-Shu Chang
IPC分类号： H03M3/00
CPC分类号： H03M3/50
摘要： The present invention offers an over-sampling digital-to-analog converter with variable sampling frequencies to process input signals of variable sampling frequencies. The over-sampling digital-to-analog converter comprises an expander, which expands said input signals with a fixed rate of M to produce over-sampling signals; a digital low-pass filter, which filters out high-frequency ingredients of over-sampling signals and then outputs data with a first rate; a data buffer, which receives the outputted data by said digital low-pass filter with the first rate and outputs the data with a second rate; a modulator, which reads data in said data buffer with the second rate and modulates the data; a digital-to-analog converter, which converts the modulated data to analog signals; and an analog low-pass filter, which filters out high-frequency ingredients of said analog signals for producing output signals. No matter how the sampling frequency of the input signals is, due to reading rates of the modulator are the same, the over-sampling digital-to-analog converter ensures that noise is mostly distributed in the high-frequency band.
摘要翻译：本发明提供具有可变采样频率的过采样数模转换器来处理可变采样频率的输入信号。过采样数模转换器包括扩展器，其以固定速率M扩展所述输入信号以产生过采样信号; 数字低通滤波器，滤除过采样信号的高频成分，然后以第一速率输出数据; 数据缓冲器，其以所述第一速率由所述数字低通滤波器接收输出的数据，并以第二速率输出数据; 调制器，以第二速率读取所述数据缓冲器中的数据并调制数据; 数模转换器，其将调制数据转换为模拟信号; 以及模拟低通滤波器，其滤除所述模拟信号的高频成分以产生输出信号。无论输入信号的采样频率如何，由于调制器的读取速率相同，过采样数模转换器可确保噪声主要分布在高频段。

7. 发明授权

US08022511B2 Semiconductor device packages with electromagnetic interference shielding 有权
标题翻译：具有电磁干扰屏蔽的半导体器件封装
公开(公告)号：US08022511B2
公开(公告)日：2011-09-20
申请号：US12336407
申请日：2008-12-16
申请人： Chi-Tsung Chiu , Chih-Pin Hung , Jui-Cheng Huang
发明人： Chi-Tsung Chiu , Chih-Pin Hung , Jui-Cheng Huang
IPC分类号： H01L23/552
CPC分类号： H01L24/97 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49805 , H01L23/552 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2221/68331 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) a grounding element disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface; (4) a package body disposed adjacent to the upper surface and covering the semiconductor device and the grounding element; and (5) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a lateral surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The grounding element corresponds to a remnant of a conductive bump, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
摘要翻译：这里描述的是具有EMI屏蔽和相关方法的半导体器件封装。在一个实施例中，半导体器件封装包括：（1）衬底单元; （2）接地元件，其设置在所述基板单元的周边附近并从所述基板单元的上表面向上延伸; （3）邻近上表面设置的半导体器件; （4）与所述上表面相邻并且覆盖所述半导体器件和所述接地元件的封装体; 和（5）邻近封装体的外表面设置并电连接到接地元件的侧表面的EMI屏蔽。封装主体的侧表面基本上与衬底单元的侧表面对准。接地元件对应于导电凸块的残余物，并且提供了入射到EMI屏蔽上的接地电磁辐射的电路径。

8. 发明授权

US08884797B2 Systems and methods providing active and passive charge sharing in a digital to analog converter 有权
标题翻译：在数模转换器中提供有源和无源电荷共享的系统和方法
公开(公告)号：US08884797B2
公开(公告)日：2014-11-11
申请号：US13035444
申请日：2011-02-25
申请人： Yung-Chow Peng , Jui-Cheng Huang , Ching-Ho Chang , Nang Ping Tu
发明人： Yung-Chow Peng , Jui-Cheng Huang , Ching-Ho Chang , Nang Ping Tu
IPC分类号： H03M1/66 , H03M1/68 , G09G3/36 , H03M1/80
CPC分类号： H03M1/68 , G09G3/3688 , G09G2300/023 , G09G2310/027 , G09G2330/023 , H03M1/804
摘要： A method for converting a multi-bit digital value to an analog value. The method includes, in a first conversion cycle, converting a first set of digital bits to a first analog voltage using passive charge-sharing. The method also includes, in a second conversion cycle, converting a second set of digital bits to a second analog voltage added to the first analog voltage using active charge-sharing. The first set of digital bits and the second set of digital bits are different bits of the multi-bit digital value.
摘要翻译：一种用于将多位数字值转换为模拟值的方法。该方法包括在第一转换周期中，使用无源电荷共享将第一组数字位转换为第一模拟电压。该方法还包括在第二转换周期中，使用有源电荷共享将第二组数字位转换为添加到第一模拟电压的第二模拟电压。第一组数字位和第二组数字位是多位数字值的不同位。

9. 发明申请

US20140092939A1 Thermal Sensor with Second-Order Temperature Curvature Correction 有权
标题翻译：具有二阶温度曲率校正的热传感器
公开(公告)号：US20140092939A1
公开(公告)日：2014-04-03
申请号：US13632498
申请日：2012-10-01
申请人： Ching-Ho Chang , Jui-Cheng Huang , Yung-Chow Peng
发明人： Ching-Ho Chang , Jui-Cheng Huang , Yung-Chow Peng
IPC分类号： G01K7/01 , H01L23/544
CPC分类号： G01K7/01 , G01K15/005
摘要： Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.
摘要翻译：本公开的一些实施例涉及具有检测一个或多个集成芯片的温度的热传感器的堆叠集成芯片结构。在一些实施例中，堆叠集成芯片结构具有位于插入器晶片上的主集成芯片和次集成芯片。主集成芯片具有产生偏置电流的参考电压源。次级集成芯片具有接收偏置电流的第二热二极管，并且基于此产生第二热感测电压和与次级集成芯片的温度成比例的第二参考电压。基于与第二热感测电压和参考电压的比较，主集成芯片内的数字热传感器确定二次集成芯片的温度。

10. 发明授权

US09383264B2 Small area high performance cell-based thermal diode 有权
标题翻译：小面积高性能基于电池的热二极管
公开(公告)号：US09383264B2
公开(公告)日：2016-07-05
申请号：US13428549
申请日：2012-03-23
申请人： Yung-Chow Peng , Ching-Ho Chang , Jui-Cheng Huang
发明人： Yung-Chow Peng , Ching-Ho Chang , Jui-Cheng Huang
IPC分类号： G01K7/00 , G01K7/01
CPC分类号： G01K7/01 , Y10T307/76
摘要： A thermal sensing system includes a circuit having a layout including standard cells arranged in rows and columns. First and second current sources provide first and second currents, respectively. The thermal sensing system includes thermal sensing units, first and second switching modules, and an analog to digital converter (ADC). Each thermal sensing unit is configured to provide a voltage drop dependent on a temperature at that thermal sensing unit. The first switching module is configured to select one of the thermal sensing units. The second switching module includes at least one switch controllable by a control signal. The at least one switch is configured to selectively couple the thermal sensing units, based on the control signal, to one of the first and second current sources, via the first switching module. The ADC is configured to convert an analog voltage, provided by the selected thermal sensing unit, to a digital value.
摘要翻译：热感测系统包括具有布置成行和列的标准单元的布局的电路。第一和第二电流源分别提供第一和第二电流。热感测系统包括热敏单元，第一和第二开关模块以及模数转换器（ADC）。每个热敏单元被配置成提供取决于该热感测单元处的温度的电压降。第一开关模块被配置为选择一个热感测单元。第二开关模块包括可由控制信号控制的至少一个开关。所述至少一个开关被配置为经由所述第一开关模块将所述热感测单元基于所述控制信号选择性地耦合到所述第一和第二电流源之一。 ADC配置为将所选热敏单元提供的模拟电压转换为数字值。

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