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    • 10. 发明授权
    • Method for forming a pattern by silylation
    • 通过甲硅烷基形成图案的方法
    • US5427649A
    • 1995-06-27
    • US153928
    • 1993-11-18
    • Cheol-hong KimWoo-sung Sung
    • Cheol-hong KimWoo-sung Sung
    • G03F7/26G03F7/075G03F7/09G03F7/095H01L21/30H01L21/00
    • G03F7/0755G03F7/094G03F7/095
    • A method for forming a mask pattern using a multi-layer photoresist film process is disclosed. The processing is simplified from known processes by using a silylated photoresist film. A first photoresist layer is formed on substrate and part of the surface of the photoresist layer is silylated to thereby form a silylation layer. Then, a second photoresist layer is formed on the silylation layer, which is then exposed through the photo mask having a predetermined pattern. A second photoresist pattern is then formed after development. Then, a silylation layer pattern is formed by etching-back the silylation layer using the second photoresist pattern as an etching mask. The silylation pattern is then oxidized, and the first photoresist layer is etched using the oxidized silylation pattern, thereby forming a first photoresist pattern. A resolution increasing effect can be maintained using the two layer photoresist film structure without the need for an intermediate oxide film. Thus, the process is simplified and less undesired polymers are generated.
    • 公开了一种使用多层光致抗蚀剂膜工艺形成掩模图案的方法。 通过使用甲硅烷基化的光致抗蚀剂膜,从已知方法简化了处理。 在基板上形成第一光致抗蚀剂层,将光致抗蚀剂层的表面的一部分甲硅烷基化从而形成甲硅烷基层。 然后,在甲硅烷基层上形成第二光致抗蚀剂层,然后通过具有预定图案的光掩模曝光。 然后在显影后形成第二光致抗蚀剂图案。 然后,通过使用第二光致抗蚀剂图案作为蚀刻掩模蚀刻甲硅烷基层来形成甲硅烷基层图案。 然后将甲硅烷基化图案氧化,并且使用氧化的甲硅烷基化图案蚀刻第一光致抗蚀剂层,由此形成第一光致抗蚀剂图案。 可以使用双层光致抗蚀剂膜结构保持分辨率增加效果,而不需要中间氧化膜。 因此,该方法被简化并且产生较少不期望的聚合物。