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    • 9. 发明授权
    • Projection exposure system
    • 投影曝光系统
    • US5386266A
    • 1995-01-31
    • US155003
    • 1993-11-22
    • Ho-young Kang
    • Ho-young Kang
    • H01L21/30G02B3/02G03F7/20H01L21/027G03B27/54
    • G03F7/70108G02B3/02
    • A projection exposure system includes a light source, a parallel-light forming lens and a fly's eyes lens which are sequentially disposed along a light traveling path. Between the parallel-light forming lens and fly's eyes lens is provided a light dispersing device which is composed of a first light dispersing lens with a concave lens or a second light dispersing lens with multiple small convex lenses. The light dispersing device diverges central light incident on the fly's eyes lens, to thereby increase peripheral light intensity. Accordingly, in tilted illumination, which uses peripheral light, light utilizing efficiency is raised.
    • 投影曝光系统包括依次沿光行进路径设置的光源,平行光形成透镜和蝇眼透镜。 在平行光形成透镜和蝇眼透镜之间设置有由具有凹透镜的第一光分散透镜或具有多个小凸透镜的第二光分散透镜构成的光分散装置。 光分散装置使入射在飞瞳透镜上的中心光发散,从而增加周边光强度。 因此,在使用周边光的倾斜照明中,提高了光的利用效率。
    • 10. 发明授权
    • Methods of fabricating phase shift masks by controlling exposure doses
    • 通过控制暴露剂量制造相移掩模的方法
    • US5853921A
    • 1998-12-29
    • US905792
    • 1997-07-28
    • Seong-yong MoonIn-kyun ShinHo-young Kang
    • Seong-yong MoonIn-kyun ShinHo-young Kang
    • G03F1/30G03F1/68G03F1/80H01L21/027G03F9/00
    • G03F1/30
    • A phase shift mask is fabricated by forming a radiation blocking layer on a phase shift mask substrate and forming a photoresist layer on the radiation blocking layer. First portions of the photoresist layer are exposed at a first exposure dose. Second portions of the photoresist layer are exposed at a second exposure dose that is greater than the first exposure dose, such that the second portions of the photoresist layer are wider than the first portions of the photoresist layer. The radiation blocking layer is etched using the photoresist layer as an etch mask, to thereby produce first apertures in the radiation blocking layer beneath the first portions of the photoresist layer and second apertures in the radiation blocking layer which are wider than the first apertures, beneath the second portions of the photoresist layer. The phase shift mask substrate is then etched beneath the second apertures. The first and second exposures are preferably performed by exposing the photoresist layer to electron beams of first and second exposure doses. The first and second portions of the photoresist layer may be overlapping or nonoverlapping. The first and second exposure doses may be multiple exposure doses which cumulatively provide the first and second exposure doses.
    • 通过在相移掩模基板上形成辐射阻挡层并在辐射阻挡层上形成光致抗蚀剂层来制造相移掩模。 光致抗蚀剂层的第一部分以第一曝光剂量曝光。 光致抗蚀剂层的第二部分以比第一曝光剂量大的第二曝光剂量曝光,使得光致抗蚀剂层的第二部分比光致抗蚀剂层的第一部分宽。 使用光致抗蚀剂层作为蚀刻掩模蚀刻辐射阻挡层,从而在光致抗蚀剂层的第一部分下方的辐射阻挡层和辐射阻挡层中的第二孔之下产生比第一孔更宽的第一孔,下面 光致抗蚀剂层的第二部分。 然后在第二孔下方蚀刻相移掩模衬底。 第一和第二曝光优选通过将光致抗蚀剂层暴露于第一和第二曝光剂量的电子束来进行。 光致抗蚀剂层的第一和第二部分可以是重叠的或不重叠的。 第一和第二暴露剂量可以是累积提供第一和第二暴露剂量的多次暴露剂量。