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1. 发明授权

US07606035B2 Heat sink and memory module using the same 有权
标题翻译：散热器和内存模块使用相同
公开(公告)号：US07606035B2
公开(公告)日：2009-10-20
申请号：US11859564
申请日：2007-09-21
申请人： Chang-Yong Park , Yong-Hyun Kim , Kwang-Ho Chun , Hyun-Jong Oh
发明人： Chang-Yong Park , Yong-Hyun Kim , Kwang-Ho Chun , Hyun-Jong Oh
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
摘要翻译：提供了散热器和使用散热器的存储器模块。在一个实施例中，散热器包括分别设置在围绕待冷却物体放置的第一和第二散热器中的第一和第二引导销。第一和第二引导销有助于防止在第一和第二散热器之间发生不对准问题，以及当第一和第二散热器受到来自第一和第二散热器的压力施加压力时，有助于防止第一和第二散热器彼此接触外。

2. 发明申请

US20060228878A1 Semiconductor package repair method 审中-公开
标题翻译：半导体封装修复方法
公开(公告)号：US20060228878A1
公开(公告)日：2006-10-12
申请号：US11387801
申请日：2006-03-24
申请人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
发明人： Chang-Yong Park , Kyung-Du Kim , Kwang-Ho Chun , Byung-Man Kim , Yong-Hyun Kim , Hyun-Jong Oh
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L25/105 , H01L25/50 , H01L2224/16 , H01L2225/1058 , H01L2225/1094 , H01L2924/15331 , H05K3/3463 , H05K3/3484 , H05K2201/10992 , Y02P70/613
摘要： A lower-melting-point solder having a lower melting point than solder balls is used to bond the solder balls with a module substrate. The lower-melting-point solder has a melting point lower than the solder balls. A bonding temperature is at a temperature between the melting point of the lower-melting-point solder and the melting point of the solder balls.
摘要翻译：使用熔点低于焊料球的低熔点焊料用于将焊球与模块基板结合。低熔点焊料的熔点低于焊料球。接合温度处于低熔点焊料的熔点和焊料球的熔点之间的温度。

3. 发明授权

US07518873B2 Heat spreader, semiconductor package module and memory module having the heat spreader 有权
标题翻译：散热器，半导体封装模块和具有散热器的存储模块
公开(公告)号：US07518873B2
公开(公告)日：2009-04-14
申请号：US11481179
申请日：2006-07-06
申请人： Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
发明人： Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.
摘要翻译：散热器包括散热板和压力夹。散热板将热量从热源辐射出来。压力夹将散热板固定在热源上。压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。脊柱布置在散热板上。一个或多个肋从脊部延伸并接触热源。钩部分从脊柱延伸并由热源支撑。压力夹还包括将脊柱连接到钩部件的安装部件。在脊柱和散热板之间形成弯曲空间。散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

4. 发明申请

US20070008703A1 Heat spreader, semiconductor package module and memory module having the heat spreader 有权
标题翻译：散热器，半导体封装模块和具有散热器的存储模块
公开(公告)号：US20070008703A1
公开(公告)日：2007-01-11
申请号：US11481179
申请日：2006-07-06
申请人： Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
发明人： Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.
摘要翻译：散热器包括散热板和压力夹。散热板将热量从热源辐射出来。压力夹将散热板固定在热源上。压力夹包括一个脊柱（按压部分），一个或多个肋和钩部件。脊柱布置在散热板上。一个或多个肋从脊部延伸并接触热源。钩部分从脊柱延伸并由热源支撑。压力夹还包括将脊柱连接到钩部件的安装部件。在脊柱和散热板之间形成弯曲空间。散热器可以用例如一触式方式附接到印刷电路板（PCB），使得存储器模块的组装过程可以自动化。

5. 发明申请

US20070161224A1 Semiconductor module and method of forming a semiconductor module 审中-公开
公开(公告)号：US20070161224A1
公开(公告)日：2007-07-12
申请号：US11723086
申请日：2007-03-16
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L21/44
CPC分类号： H05K3/303 , H01L2224/13 , H01L2224/16225 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

6. 发明申请

US20060231949A1 Semiconductor module and method of forming a semiconductor module 有权
标题翻译：半导体模块和形成半导体模块的方法
公开(公告)号：US20060231949A1
公开(公告)日：2006-10-19
申请号：US11246303
申请日：2005-10-11
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/49811 , H01L23/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1403 , H01L2224/141 , H01L2224/16 , H01L2224/81192 , H01L2924/00014 , H01L2924/01079 , H05K3/303 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要翻译：在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

7. 发明申请

US20080157389A1 SEMICONDUCTOR PACKAGE AND MODULE PRINTED CIRCUIT BOARD FOR MOUNTING THE SAME 有权
标题翻译：半导体封装和模块印刷电路板，用于安装它们
公开(公告)号：US20080157389A1
公开(公告)日：2008-07-03
申请号：US11968035
申请日：2007-12-31
申请人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
发明人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
IPC分类号： H01L23/48 , H05K7/02
CPC分类号： H05K1/111 , H01L2924/0002 , H05K3/3452 , H05K2201/0367 , H05K2201/09381 , H05K2201/094 , H05K2201/09845 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.
摘要翻译：提供了用于安装它的半导体封装和模块印刷电路板（PCB）。半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

8. 发明授权

US07215026B2 Semiconductor module and method of forming a semiconductor module 有权
标题翻译：半导体模块和形成半导体模块的方法
公开(公告)号：US07215026B2
公开(公告)日：2007-05-08
申请号：US11246303
申请日：2005-10-11
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L23/12
CPC分类号： H01L23/49811 , H01L23/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1403 , H01L2224/141 , H01L2224/16 , H01L2224/81192 , H01L2924/00014 , H01L2924/01079 , H05K3/303 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.
摘要翻译：在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

9. 发明授权

US07675176B2 Semiconductor package and module printed circuit board for mounting the same 有权
标题翻译：半导体封装和模块印刷电路板用于安装
公开(公告)号：US07675176B2
公开(公告)日：2010-03-09
申请号：US11968035
申请日：2007-12-31
申请人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
发明人： Chang-Yong Park , Kwang-Ho Chun , Dong-Chun Lee , Yong-Hyun Kim
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H05K1/111 , H01L2924/0002 , H05K3/3452 , H05K2201/0367 , H05K2201/09381 , H05K2201/094 , H05K2201/09845 , H05K2201/0989 , H05K2201/099 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.
摘要翻译：提供了用于安装它的半导体封装和模块印刷电路板（PCB）。半导体封装和模块PCB中的每一个包括衬底，设置在衬底的第一区域中的第一类型衬垫结构以及设置在封装衬底的第二区域中的第二类型衬垫结构。第一型焊盘包括设置在封装衬底上的第一导电焊盘和涂覆在封装衬底上的第一绝缘层。第一绝缘层具有第一开口，通过该第一开口，第一导电焊盘的侧壁的一部分被暴露，并且部分覆盖第一导电焊盘。第二类型衬垫包括涂覆在封装衬底上以具有第二开口的第二绝缘层和设置在第二开口中的封装衬底上的具有暴露侧壁的第二导电焊盘。在这种结构中，半导体封装和模块PCB可以具有优异的耐物理和热应力，以增强结构可靠性。

10. 发明申请

US20070069378A1 Semiconductor module and method of forming a semiconductor module 审中-公开
公开(公告)号：US20070069378A1
公开(公告)日：2007-03-29
申请号：US11604678
申请日：2006-11-28
申请人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
发明人： Chang-Yong Park , Byung-Man Kim , Dong-Chun Lee , Yong-Hyun Kim , Kwang-Seop Kim , Dong-Woo Shin , Kwang-Ho Chun
IPC分类号： H01L23/48
CPC分类号： H05K3/303 , H01L2224/13 , H01L2224/16225 , H05K3/3457 , H05K2201/09781 , H05K2201/10734 , H05K2201/2036 , Y02P70/613
摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

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