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    • 3. 发明授权
    • Heterojunction bipolar transistor (HBT) fabrication using a selectively deposited silicon germanium (SiGe)
    • 使用选择性沉积的硅锗(SiGe)的异质结双极晶体管(HBT)
    • US06531369B1
    • 2003-03-11
    • US10075700
    • 2002-02-14
    • Cengiz S. OzkanAbderrahmane Salmi
    • Cengiz S. OzkanAbderrahmane Salmi
    • H01L21331
    • H01L29/66242H01L29/7378
    • A Heterojunction Bipolar Transistor (HBT) is provided where the SiGe base region is formed through selective deposition, after the formation of the base electrode layer and the emitter window. A sacrificial oxide layer is deposited between the collector and base electrode. The contact to the SiGe base is made at an extrinsic area, underneath the base electrode, after removal of the sacrificial oxide. The SiGe is covered with a temporary oxide layer during further processes, and this protective layer is removed immediately before the deposition of the emitter material. The selective deposition of the SiGe at a relatively late stage of the fabrication process helps insure that the film remains free of the stresses which can degrade electron mobility. A process of fabricating the above-described HBT device is also provided.
    • 提供了异相结双极晶体管(HBT),其中在形成基极电极层和发射极窗之后,通过选择性沉积形成SiGe基区。 牺牲氧化层沉积在集电极和基极之间。 在除去牺牲氧化物之后,在基极下方的外部区域进行与SiGe基体的接触。 SiGe在进一步的工艺期间被覆盖有临时氧化物层,并且在保护层在沉积发射体材料之前立即被去除。 在制造工艺的相对较晚的阶段,SiGe的选择性沉积有助于确保膜保持没有可能降低电子迁移率的应力。 还提供了制造上述HBT器件的工艺。
    • 4. 发明授权
    • Heterojunction bipolar transistor (HBT) with three-dimensional base contact
    • 具有三维基极接触的异质结双极晶体管(HBT)
    • US06437376B1
    • 2002-08-20
    • US09516993
    • 2000-03-01
    • Cengiz S. Ozkan
    • Cengiz S. Ozkan
    • H01L31072
    • H01L29/66242H01L29/1004H01L29/42304H01L29/7378
    • A Heterojunction Bipolar Transistor (HBT) is provided which is formed by selectively depositing silicon germanium (SiGe) in a base region subsequent to the deposition of the base electrodes. Vertical bridging structures of SiGe are formed in the intrinsic area of the base to connect to the base electrode. During the formation of the dielectric sidewall defining the emitter space the SiGe base region is protected with a thin coat of oxide formed in a high-pressure low-temperature oxidation (HIPOX) process. Prior to the emitter silicon deposition the HIPOX is removed. A method for forming an HBT with a vertical bridging structure, as described above, is also provided.
    • 提供了异相结双极晶体管(HBT),其通过在基极沉积之后的基极区域中选择性地沉积硅锗(SiGe)而形成。 SiGe的垂直桥接结构形成在基极的本征区域中以连接到基极。 在形成限定发射极空间的电介质侧壁的形成期间,SiGe基极区域用在高压低温氧化(HIPOX)工艺中形成的薄氧化物保护。 在发射极硅沉积之前,将HIPOX除去。 还提供了如上所述形成具有垂直桥接结构的HBT的方法。