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    • 6. 发明授权
    • Method for heat treating PTC devices
    • PTC器件热处理方法
    • US06582647B1
    • 2003-06-24
    • US09408645
    • 1999-09-30
    • Tom J. HallMichael J. Weber
    • Tom J. HallMichael J. Weber
    • B29C7100
    • H01C17/232H01C7/028
    • The present invention provides a method for heat treating a polymer PTC composition to increase the peak resistivity of the composition making it especially well suited for high voltage applications. A polymer PTC composition having a melting point temperature Tmp is provided. The temperature of the polymer PTC composition is increased at a rate, r1, to a temperature greater than Tmp. The temperature of polymer PTC composition is held at the temperature greater than Tmp for a predetermined period of time. Then the temperature of the polymer PTC composition is decreased to a temperature less than Tmp at a rate, r2, wherein r2 is greater than r1.
    • 本发明提供了一种用于热处理聚合物PTC组合物以提高组合物的峰值电阻率的方法,使其特别适用于高电压应用。 提供了具有熔点温度Tmp的聚合物PTC组合物。 聚合物PTC组合物的温度以r1的速率增加到大于Tmp的温度。 聚合物PTC组合物的温度在大于Tmp的温度下保持预定的时间。 然后,聚合物PTC组合物的温度以r2的速度降低到小于Tmp的温度,其中r2大于r1。