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1. 发明申请

US20100103674A1 LED LAMP HAVING A VAPOR CHAMBER FOR DISSIPATING HEAT GENERATED BY LEDS OF THE LED LAMP 失效
标题翻译： LED灯具，用于散发由LED灯产生的热量的蒸发室
公开(公告)号：US20100103674A1
公开(公告)日：2010-04-29
申请号：US12422300
申请日：2009-04-13
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , CHI-YUAN LAI
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , CHI-YUAN LAI
IPC分类号： F21S4/00 , F21V29/00
CPC分类号： F21V29/70 , F21V29/004 , F21V29/51 , F21V29/75 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.
摘要翻译： LED灯包括灯壳体，由金属制成的散热器并安装在灯壳的底侧，多个LED模块和蒸汽室，其底表面连接到散热器的顶表面，具有其上附接有LED模块的顶表面，工作液体被密封在蒸气室中。蒸气室在其中限定了一个密封室，工作液体是相变液体，并被密封在密封室中。多个肋布置在蒸气室中，用于加强蒸气室的完整性，并且肋将密封室分成多个连通空间。

2. 发明申请

US20090225518A1 HEAT SINK AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20090225518A1
公开(公告)日：2009-09-10
申请号：US12202393
申请日：2008-09-01
申请人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
发明人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
IPC分类号： H05K7/20 , B23P6/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F3/02 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
摘要翻译：用于冷却电子部件的散热器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板下板形成从其向下突出的突起。突起的底面被研磨成平坦和平滑的，由此底部表面可以紧密接触电子部件。一种用于制造散热器的方法，包括：铣削从下板向下冲压的突起的底面，由此底表面可以平坦和平滑，足以与电子元件紧密接触，并且将上板依次焊接在下板和分别在下板和上板上的多个翅片。

3. 发明申请

US20090151898A1 HEAT SINK 审中-公开
标题翻译：散热器
公开(公告)号：US20090151898A1
公开(公告)日：2009-06-18
申请号：US11959328
申请日：2007-12-18
申请人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
发明人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
IPC分类号： F28F7/02
CPC分类号： F28D15/0233 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof.
摘要翻译：用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板。下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。热管在其中心位置处彼此并置，并且在其两个相对的端部位置彼此部分间隔开。

4. 发明申请

US20110255285A1 ILLUMINATION DEVICE WITH HEAT DISSIPATION STRUCTURES 失效
标题翻译：具有散热结构的照明装置
公开(公告)号：US20110255285A1
公开(公告)日：2011-10-20
申请号：US12824208
申请日：2010-06-27
申请人： CHENG-TIEN LAI , CHI-YUAN LAI , ZHI-YONG ZHOU
发明人： CHENG-TIEN LAI , CHI-YUAN LAI , ZHI-YONG ZHOU
IPC分类号： F21V29/00
CPC分类号： F21V29/83 , F21V29/507 , F21V29/745 , F21V29/80 , F21Y2105/10 , F21Y2115/10 , H05K1/0203 , H05K2201/09063 , H05K2201/10106
摘要： An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.
摘要翻译：示例性照明装置包括外壳，容纳在外壳中的半导体光源以及与外壳接合并覆盖半导体光源的外壳。由半导体光源产生的光可以穿过信封突出并且离开照明装置。半导体光源包括彼此独立的多个光源模块。在每个光源模块中限定多个空气通道，用于穿过其中的空气将半导体光源产生的热量散发到环境空气中。

5. 发明申请

US20090151921A1 HEAT SINK HAVING LOCKING DEVICE 审中-公开
标题翻译：具有锁定装置的散热器
公开(公告)号：US20090151921A1
公开(公告)日：2009-06-18
申请号：US11959438
申请日：2007-12-18
申请人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
发明人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
IPC分类号： F28F3/00
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.
摘要翻译：用于冷却电子部件的散热适配器包括下板，固定在下板上的上板和夹在下板与上板之间的多个热管。下板包括面板，从面板的两个相对侧向上延伸的一对侧壁和分别从侧壁向上延伸的多个凸缘。上板限定对应于凸缘的多个切口。凸缘装配到切口中以将上板定位在下板上，由此下板和上板机械连接在一起。

6. 发明申请

US20090166000A1 HEAT SINK WITH HEAT PIPES 有权
标题翻译：加热管与热管
公开(公告)号：US20090166000A1
公开(公告)日：2009-07-02
申请号：US11964919
申请日：2007-12-27
申请人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
发明人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
IPC分类号： F28F1/12
CPC分类号： F28F1/126 , F28D15/0233 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.
摘要翻译：用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板。下板包括接触热管的面板，从面板向上延伸并与热管分离的两个侧壁，以及两个从两个侧壁相反延伸并焊接在上板上的凸缘。热管是S形并列并且从头到尾直接接触。

7. 发明申请

US20090159252A1 HEAT SINK HAVING BUMPS FOR POSITIONING HEAT PIPES THEREIN 审中-公开
标题翻译：具有用于定位其热管的热源的散热器
公开(公告)号：US20090159252A1
公开(公告)日：2009-06-25
申请号：US11961363
申请日：2007-12-20
申请人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
发明人： CHI-YUAN LAI , ZHI-YONG ZHOU , CHENG-TIEN LAI
IPC分类号： F28F1/10 , F28F7/00
CPC分类号： F28D15/0275 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a plurality of bumps projecting upwardly therefrom, which sandwich the heat pipes therebetween to position the heat pipes on the lower plate, wherein some of the heat pipes are bent and sandwiched between two bumps at each bended position, and some of the heat pipes are straight and located near one bump at each end portion thereof.
摘要翻译：用于冷却电子部件的散热适配器包括分别固定在上板和下板上的下板，上板，上翅片组和下翅片组，以及夹在上板和下板之间的多个热管下板。下板形成从其向上突出的多个凸起，其将热管夹在其间以将热管定位在下板上，其中一些热管弯曲并夹在每个弯曲位置的两个凸块之间，热管是直的并且位于其每个端部处的一个凸起附近。

8. 发明申请

US20080104992A1 MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP 失效
标题翻译：具有整体泵的微型液体冷却装置
公开(公告)号：US20080104992A1
公开(公告)日：2008-05-08
申请号：US11556618
申请日：2006-11-03
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F25D17/02
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.
摘要翻译：液体冷却装置包括具有外壁，附接到外壁的底端的底部基座和附接到外壁的顶端的顶盖的壳体。壳体在其中限定了容纳空间，用于在其中容纳叶轮。密封室限定在外壳中并与接收空间隔离。马达驱动单元被容纳在密封室中并且与叶轮磁力相互作用以驱动叶轮旋转。马达驱动单元包括具有定子和与定子电连接的印刷电路板的马达。顶盖覆盖电动机驱动单元并与印刷电路板上的电子部件热接触，用于在电动机驱动单元操作时散发由电子部件产生的热量。

9. 发明申请

US20070263360A1 MEMORY MODULE ASSEMBLY INCLUDING A CLIP FOR MOUNTING A HEAT SINK THEREON 失效
标题翻译：存储模块组件，其中包括用于安装散热片的夹子
公开(公告)号：US20070263360A1
公开(公告)日：2007-11-15
申请号：US11308848
申请日：2006-05-15
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.
摘要翻译：存储器模块组件包括其上具有发热电子部件（32）的印刷电路板（30），散热器（10）和用于将散热器固定到发热电子部件上的夹子（20）。散热器包括基座（12）和布置在基座上的多个翅片（14）。在散热器中限定多个凹部。夹子包括靠在印刷电路板的表面上的主体（22）和从主体延伸的弹性钩（24）。钩子被容纳在凹部中并将散热器的基座弹性地压向发热电子部件，由此夹子将散热器和印刷电路板夹在一起。

10. 发明申请

US20090166003A1 HEAT SPREADER WITH VAPOR CHAMBER 失效
标题翻译：带蒸气室的散热器
公开(公告)号：US20090166003A1
公开(公告)日：2009-07-02
申请号：US11964912
申请日：2007-12-27
申请人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
发明人： CHENG-TIEN LAI , ZHI-YONG ZHOU , QIAO-LI DING
IPC分类号： F28D15/04
CPC分类号： F28D15/0233 , F28D15/046 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein.
摘要翻译：用于冷却电子部件的散热器包括限定室的下板，固定在下板上以密封室的上板，夹在上板之间的第一芯芯层和第二芯芯层，以及包含在其中的工作液体房间。第一灯芯层和第二灯芯层分别限定多个孔，其包括彼此连通的直角三角形，锐角三角形和菱形孔，用于在其中容纳工作液体。

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