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    • 1. 发明申请
    • VAPOR CHAMBER
    • 蒸气室
    • US20090166005A1
    • 2009-07-02
    • US11967069
    • 2007-12-29
    • CHENG-TIEN LAIZHI-YONG ZHOUQIAO-LI DING
    • CHENG-TIEN LAIZHI-YONG ZHOUQIAO-LI DING
    • F28D15/04H01L23/427
    • F28D15/046H01L23/427H01L2924/0002H01L2924/00
    • A vapor chamber includes a base (100) and a cover (200). The cover is mounted on the base with a hermetically sealed cavity (102) defined between the base and the cover. A working fluid is contained in the cavity. A first wick structure (220) is spread on an inner surface (201) of the cover. A second wick structure (221) is disposed in the cavity. A third wick structure (110) is spread on an inner surface (101) of the base, and the second wick structure extends between the first wick structure and the third wick structure. A first vapor space (300) is defined in the cavity and surrounds the second wick structure. A second vapor space (400) is defined in the second wick structure and communicated with the first vapor space.
    • 蒸气室包括基座(100)和盖子(200)。 盖子安装在基座上,并具有限定在基座和盖子之间的气密密封腔(102)。 工作流体包含在空腔中。 第一芯结构(220)分散在盖的内表面(201)上。 第二芯结构(221)设置在空腔中。 第三芯结构(110)分散在基座的内表面(101)上,第二芯结构在第一芯结构和第三芯结构之间延伸。 第一蒸气空间(300)被限定在空腔中并且围绕第二芯结构。 第二蒸汽空间(400)被限定在第二吸芯结构中并且与第一蒸气空间连通。
    • 2. 发明申请
    • MEMORY MODULE ASSEMBLY INCLUDING A CLAMP FOR MOUNTING HEAT SINKS THEREON
    • 存储器模块组件,其中包括用于安装散热器的钳子
    • US20070263359A1
    • 2007-11-15
    • US11308839
    • 2006-05-12
    • CHENG-TIEN LAIZHI-YONG ZHOUQIAO-LI DING
    • CHENG-TIEN LAIZHI-YONG ZHOUQIAO-LI DING
    • H05K7/20
    • H01L23/4093H01L23/3672H01L2924/0002H01L2924/00
    • A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.
    • 存储模块组件包括其上具有主要发热电子部件(52)的印刷电路板(10),安装在印刷电路板的相对侧上的第一和第二散热器(20),(30)和夹具 40)将第一,第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极(24)。 第二散热器包括设置在其中并与其热连接的热管(36)。 夹具包括连接部分(42)和一对弹性按压部分(44)。 夹具将第二散热器弹性地压向主发热电子部件,并且第一散热器经由第一散热器的定位极与第二散热器接合,第一散热器的定位极延伸并与第二散热器接合。
    • 6. 发明申请
    • MINIATURE LIQUID COOLING DEVICE HAVING AN INTEGRAL PUMP
    • 具有整体泵的微型液体冷却装置
    • US20080104992A1
    • 2008-05-08
    • US11556618
    • 2006-11-03
    • CHENG-TIEN LAIZHI-YONG ZHOUQIAO-LI DING
    • CHENG-TIEN LAIZHI-YONG ZHOUQIAO-LI DING
    • F25D17/02
    • H01L23/473H01L2924/0002H01L2924/00
    • A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.
    • 液体冷却装置包括具有外壁,附接到外壁的底端的底部基座和附接到外壁的顶端的顶盖的壳体。 壳体在其中限定了容纳空间,用于在其中容纳叶轮。 密封室限定在外壳中并与接收空间隔离。 马达驱动单元被容纳在密封室中并且与叶轮磁力相互作用以驱动叶轮旋转。 马达驱动单元包括具有定子和与定子电连接的印刷电路板的马达。 顶盖覆盖电动机驱动单元并与印刷电路板上的电子部件热接触,用于在电动机驱动单元操作时散发由电子部件产生的热量。