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1. 发明授权

US5557214A Micro beam probe semiconductor test interface 失效
标题翻译：微光束探头半导体测试接口
公开(公告)号：US5557214A
公开(公告)日：1996-09-17
申请号：US384001
申请日：1995-02-06
申请人： C. Kenneth Barnett
发明人： C. Kenneth Barnett
IPC分类号： G01R1/073 , G01R1/73 , H01R43/00
CPC分类号： G01R1/073 , Y10T29/49222
摘要： Apparatus is disclosed for interfacing a semiconductor test circuit and a semiconductor device under test, wherein the interface is a silicon structure test probe having conductor paths which extend along cantilevered parallelogram micro beams having contact bumps on the free ends of the beams arranged in a pattern which registers with a test pad pattern on the semiconductor device under test. The parallelogram beams provide test pad contact with substantially no scrubbing action. The silicon structure provides testing over wide environmental ranges because the test probe structure reacts to environmental conditions in the same way as the silicon semiconductor device under test. A method for fabricating the silicon structure test probe is disclosed which includes fabrication in the silicon structure of semiconductor circuit drivers and receivers for the conducting paths.
摘要翻译：公开了用于连接半导体测试电路和被测半导体器件的装置，其中该界面是具有导体路径的硅结构测试探针，该导体路径沿悬臂式平行四边形微梁延伸，该微梁在以图案布置的图案中布置的梁的自由端上具有接触凸块在测试的半导体器件上注册测试焊盘图案。平行四边形梁提供测试垫接触，基本上没有擦洗作用。硅结构提供了在宽环境范围内的测试，因为测试探针结构以与测试的硅半导体器件相同的方式对环境条件起反应。公开了一种用于制造硅结构测试探针的方法，其包括在用于导电路径的半导体电路驱动器和接收器的硅结构中制造。

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