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    • 6. 发明授权
    • Cleaning process
    • 清洁过程
    • US08080114B2
    • 2011-12-20
    • US11499542
    • 2006-08-04
    • Gap Su HanKi Pung YooJong Sung LimYoung Hoon Kwon
    • Gap Su HanKi Pung YooJong Sung LimYoung Hoon Kwon
    • B08B7/00B08B7/04
    • G03F7/427B08B3/00B08B7/0021
    • Provided is a cleaning process which is simplified and in which a time required for the cleaning process is reduced and which has an excellent cleaning effect. The cleaning process comprises loading a wafer in a high pressure cleaner, injecting high-purity gaseous carbon dioxide (CO2) having low pressure into the high pressure cleaner, injecting CO2 having lower pressure than supercritical cleaning pressure into the high pressure cleaner, cleaning the wafer by injecting a supercritical homogeneous transparent phase mixture in which a cleaning additive and supercritical CO2 are mixed, into the high pressure cleaner under a supercritical cleaning pressure, rinsing the wafer by injecting a supercritical rinsing mixture in which a rinsing additive and supercritical CO2 are mixed, into the high pressure cleaner, and separating CO2 from a mixture discharged from the high pressure cleaner.
    • 提供了一种简化的清洁处理,其中清洁处理所需的时间减少并且具有优异的清洁效果。 清洁过程包括将晶片装载在高压清洁器中,将具有低压清洁的高纯度二氧化碳(CO 2)注入高压清洁器中,将低于超临界清洗压力的二氧化碳注入高压清洁器中,清洗晶片 通过将超临界均相透明相混合物(其中将清洁添加剂和超临界CO 2混合)注入到超临界清洗压力下的高压清洗器中,通过注入混合有漂洗添加剂和超临界CO 2的超临界冲洗混合物冲洗晶片, 进入高压清洁器,并从高压清洗机排出的混合物中分离出二氧化碳。
    • 8. 发明申请
    • Cleaning apparatus and high pressure cleaner for use therein
    • 用于其中的清洁设备和高压清洁剂
    • US20070169794A1
    • 2007-07-26
    • US11499546
    • 2006-08-04
    • Gap Su HanKi Pung YooJong Sung LimYoung Hoon Kwon
    • Gap Su HanKi Pung YooJong Sung LimYoung Hoon Kwon
    • B08B3/00
    • H01L21/67023G03F7/422H01L21/02071H01L21/02101H01L21/31133
    • A cleaning apparatus in which a cleaning process is simplified, a time required for the cleaning process is reduced and which has an excellent cleaning effect, and a high pressure cleaner for use therein are provided. The cleaning apparatus comprises a liquid carbon dioxide (CO2) supply source and a gaseous CO2 supply source, a high pressure pump changing CO2 supplied from the liquid CO2 supply source to CO2 having high pressure, a cleaning additive supply source and a rinsing additive supply source, a homogeneous transparent phase mixer forming a supercritical homogeneous transparent phase mixture by mixing a cleaning additive supplied from the cleaning additive supply source and supercritical CO2 supplied from the liquid CO2 supply source, or forming a supercritical rinsing mixture by mixing a rinsing additive supplied from the rinsing additive supply source and supercritical CO2 supplied from the liquid CO2 supply source, a high pressure cleaner cleaning using the supercritical homogeneous transparent phase mixture supplied from the homogeneous transparent phase mixer and performing rinsing using the supercritical rinsing mixture supplied from the homogeneous transparent phase mixer, a separator separating gaseous CO2 from a mixture discharged from the high pressure cleaner, and a CO2 condenser condensing the separated CO2.
    • 其中清洁过程简化的清洁装置,清洁过程所需的时间减少并具有优良的清洁效果,并且提供了一种用于其中的高压清洁器。 清洁装置包括液体二氧化碳(CO 2/2)供应源和气态CO 2 2供应源,高压泵改变CO 2 2 < 从液体CO 2 H 2供应源供应至具有高压的CO 2,清洁添加剂供应源和漂洗添加剂供应源,形成超临界均相的均匀透明相混合物 通过混合从清洁添加剂供应源供应的清洁添加剂和从液体CO 2 2供应源提供的超临界CO 2,或通过混合形成超临界漂洗混合物来形成透明相混合物 从洗涤添加剂供应源和从液体CO 2 2供应源供应的超临界CO 2提供的漂洗添加剂,使用提供的超临界均相透明相混合物的高压清洁剂清洁 从均匀的透明相混合器中进行漂洗 从均匀的透明相混合器提供的超临界冲洗混合物,从高压清洁器排出的混合物中分离出气态CO 2的分离器和冷凝分离的CO 2 CO 2