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    • 1. 发明授权
    • Design and method for plating PCI express (PCIE) edge connector
    • PCI Express(PCIE)边缘连接器的设计和方法
    • US07534145B1
    • 2009-05-19
    • US11636301
    • 2006-12-07
    • Bruce MichaudPeter AmmannGeorge Sorenson
    • Bruce MichaudPeter AmmannGeorge Sorenson
    • H01R24/00
    • H05K3/242H05K1/117H05K3/0052H05K2201/094
    • Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.
    • 描述了用于电镀PCI Express边缘连接器的方法和装置的实施例。 在一个实施例中,使用具有连接器的印刷电路板来电镀其中形成的一个或多个连接器。 印刷电路板包括具有一个或多个层的衬底和形成在一个或多个层上的多个连接器,其中至少一个连接器包括至少一个短针和至少一个额外的针。 在制造之后,至少一个额外的销延伸超出印刷电路板的外部形状。 印刷电路板还包括形成在一个或多个层上的连接电路,其中连接电路被配置为至少在电镀所述短销期间将短销与额外的引脚电连接。
    • 2. 发明授权
    • Design and method for plating PCI Express (PCIE) edge connector
    • PCI Express(PCIE)边缘连接器的设计和方法
    • US07341490B2
    • 2008-03-11
    • US11671909
    • 2007-02-06
    • Bruce MichaudPeter AmmannGeorge Sorensen
    • Bruce MichaudPeter AmmannGeorge Sorensen
    • H01R24/00
    • H05K3/242H05K1/117H05K3/0052H05K2201/094
    • Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.
    • 描述了用于电镀PCI Express边缘连接器的方法和装置的实施例。 在一个实施例中,使用具有连接器的印刷电路板来电镀其中形成的一个或多个连接器。 印刷电路板包括具有一个或多个层的衬底和形成在一个或多个层上的多个连接器,其中至少一个连接器包括至少一个短针和至少一个额外的针。 在制造之后,至少一个额外的销延伸超出印刷电路板的外部形状。 印刷电路板还包括形成在一个或多个层上的连接电路,其中连接电路被配置为至少在电镀所述短销期间将短销与额外的引脚电连接。
    • 3. 发明授权
    • Design and method for plating PCI express (PCIE) edge connector
    • PCI Express(PCIE)边缘连接器的设计和方法
    • US07192312B2
    • 2007-03-20
    • US10836576
    • 2004-04-30
    • Bruce MichaudPeter AmmannGeorge Sorensen
    • Bruce MichaudPeter AmmannGeorge Sorensen
    • H01R24/00
    • H05K3/242H05K1/117H05K3/0052H05K2201/094
    • Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.
    • 描述了用于电镀PCI Express边缘连接器的方法和装置的实施例。 在一个实施例中,使用具有连接器的印刷电路板来电镀其中形成的一个或多个连接器。 印刷电路板包括具有一个或多个层的衬底和形成在一个或多个层上的多个连接器,其中至少一个连接器包括至少一个短针和至少一个额外的针。 在制造之后,至少一个额外的销延伸超出印刷电路板的外部形状。 印刷电路板还包括形成在一个或多个层上的连接电路,其中连接电路被配置为至少在电镀所述短销期间将短销与额外的引脚电连接。
    • 4. 发明申请
    • DESIGN AND METHOD FOR PLATING PCI EXPRESS (PCIE) EDGE CONNECTOR
    • PCI EXPRESS(PCIE)边缘连接器的设计和方法
    • US20070128911A1
    • 2007-06-07
    • US11671909
    • 2007-02-06
    • Bruce MichaudPeter AmmannGeorge Sorensen
    • Bruce MichaudPeter AmmannGeorge Sorensen
    • H01R13/15H01R13/62
    • H05K3/242H05K1/117H05K3/0052H05K2201/094
    • Embodiments of methods and apparatus for plating a PCI Express edge connector are described. In one embodiment, a printed circuit board having connectors is employed for electroplating one or more of the connectors formed thereon. The printed circuit board comprises a substrate having one or more layers, and a plurality of connectors formed on one or more of the layers, wherein at least one connector includes at least one short pin and at least one extra pin. The at least one extra pin extends beyond an outer shape of the printed circuit board after fabrication. The printed circuit board also includes connection circuitry formed on one or more of the layers, wherein the connection circuitry is configured to electrically connect the short pin with the extra pin at least during electroplating of said short pin.
    • 描述了用于电镀PCI Express边缘连接器的方法和装置的实施例。 在一个实施例中,使用具有连接器的印刷电路板来电镀其中形成的一个或多个连接器。 印刷电路板包括具有一个或多个层的衬底和形成在一个或多个层上的多个连接器,其中至少一个连接器包括至少一个短针和至少一个额外的针。 在制造之后,至少一个额外的销延伸超出印刷电路板的外部形状。 印刷电路板还包括形成在一个或多个层上的连接电路,其中连接电路被配置为至少在电镀所述短销期间将短销与额外的引脚电连接。