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    • 1. 发明授权
    • Apparatus for configuring performance of field programmable gate arrays and associated methods
    • 用于配置现场可编程门阵列性能和相关方法的装置
    • US08461869B1
    • 2013-06-11
    • US13214147
    • 2011-08-19
    • Irfan RahimAndy L. LeeBruce B. PedersenJeffrey T. WattMao DuRichard G. Cliff
    • Irfan RahimAndy L. LeeBruce B. PedersenJeffrey T. WattMao DuRichard G. Cliff
    • H03K19/003
    • H03K19/003H03K19/17784
    • An apparatus includes a temperature sensor, a voltage regulator, and a field programmable gate array (FPGA). The temperature sensor and the voltage regulator are adapted, respectively, to provide a temperature signal, and to provide at least one output voltage. The FPGA includes at least one circuit adapted to receive the at least one output voltage of the voltage regulator, and a set of monitor circuits adapted to provide indications of process and temperature for the at least one circuit. The FPGA further includes a controller adapted to derive a body-bias signal and a voltage-level signal from the temperature signal, from the indications of process and temperature for the at least one circuit, and from the at least one output voltage of the voltage regulator. The controller is further adapted to provide the body-bias signal to at least one transistor in the at least one circuit, and to provide the voltage-level signal to the voltage regulator.
    • 一种装置包括温度传感器,电压调节器和现场可编程门阵列(FPGA)。 温度传感器和电压调节器分别适于提供温度信号,并提供至少一个输出电压。 FPGA包括适于接收电压调节器的至少一个输出电压的至少一个电路,以及适于提供至少一个电路的过程和温度指示的一组监视器电路。 FPGA还包括控制器,其适于从温度信号,从至少一个电路的处理和温度指示以及电压的至少一个输出电压导出体偏置信号和电压电平信号 调节器 所述控制器还适于将所述体偏置信号提供给所述至少一个电路中的至少一个晶体管,并且向所述电压调节器提供所述电压电平信号。
    • 4. 发明授权
    • Volatile memory elements with soft error upset immunity for programmable logic device integrated circuits
    • 具有可编程逻辑器件集成电路的软错误不稳定性的易失性存储元件
    • US07352610B1
    • 2008-04-01
    • US11295815
    • 2005-12-06
    • Bruce B. PedersenIrfan RahimJeffrey T Watt
    • Bruce B. PedersenIrfan RahimJeffrey T Watt
    • G11C11/00
    • G11C11/4125
    • Memory elements are provided that are immune to soft error upset events when subjected to high-energy atomic particle strikes. The memory elements have nonlinear high-impedance two-terminal elements that restrict the flow of discharge currents during a particle strike. By lengthening the switching speed of the memory elements, the presence of the nonlinear high-impedance two-terminal elements prevents the states of the memory elements from flipping during discharge transients. The nonlinear high-impedance two-terminal elements may be formed from polysilicon p-n junction diodes, Schottky diodes, and other semiconductor structures. Data loading circuitry is provided to ensure that memory element arrays using the nonlinear high-impedance two-terminal elements can be loaded rapidly.
    • 提供存储元件,当受到高能原子粒子撞击时,可以免受软错误不安事件的影响。 存储器元件具有非线性高阻抗二端元件,其限制了粒子撞击期间放电电流的流动。 通过延长存储元件的切换速度,非线性高阻抗二端元件的存在防止存储元件的状态在放电瞬变期间翻转。 非线性高阻抗二端元件可以由多晶硅p-n结二极管,肖特基二极管和其它半导体结构形成。 提供数据加载电路以确保使用非线性高阻抗二端元件的存储元件阵列可以快速加载。
    • 6. 发明授权
    • Programmable integrated circuit with thin-oxide passgates
    • 可编程集成电路与薄氧化物通风门
    • US08633731B1
    • 2014-01-21
    • US13206401
    • 2011-08-09
    • Irfan RahimMao DuJeffrey Xiaoqi TungJun LiuQi Xiang
    • Irfan RahimMao DuJeffrey Xiaoqi TungJun LiuQi Xiang
    • G06F7/38
    • H03K19/1733G11C8/16G11C11/419
    • Integrated circuits such as programmable integrated circuits may have configuration random-access memory elements. The configuration random-access memory elements may be loaded with configuration data to customize programmable circuitry on the integrated circuits. Each memory element may have a bistable element that is powered using a positive power supply voltage and a negative power supply voltage. Programmable transistors in the programmable circuitry may have gates coupled to outputs of the bistable elements. The programmable transistors may have gate insulators that are thinner than gate insulators in the transistors of the bistable elements and may have threshold voltages of about zero volts. During operation, some of the configuration random-access memory elements may supply negative voltages to their associated programmable transistors so that the programmable transistors are provided with gate-source voltages of less than zero volts.
    • 诸如可编程集成电路的集成电路可以具有配置随机存取存储器元件。 配置随机存取存储器元件可以被加载配置数据以定制集成电路上的可编程电路。 每个存储元件可以具有使用正电源电压和负电源电压供电的双稳态元件。 可编程电路中的可编程晶体管可以具有耦合到双稳态元件的输出的栅极。 可编程晶体管可以具有比双稳态元件的晶体管中的栅极绝缘体更薄的栅极绝缘体,并且可以具有约零伏特的阈值电压。 在操作期间,一些配置随机存取存储器元件可以向其相关联的可编程晶体管提供负电压,使得可编程晶体管具有小于零伏的栅极 - 源极电压。
    • 7. 发明授权
    • Memory elements with relay devices
    • 具有中继设备的存储器元件
    • US08611137B2
    • 2013-12-17
    • US13304226
    • 2011-11-23
    • Lin-Shih LiuMark T. ChanYanzhong XuIrfan RahimJeffrey T. Watt
    • Lin-Shih LiuMark T. ChanYanzhong XuIrfan RahimJeffrey T. Watt
    • G11C11/00
    • G11C11/52B82Y10/00G11C13/025G11C23/00H01H1/0094H01H1/20H01H59/0009H01L27/101H01L27/11
    • Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
    • 提供具有存储元件的集成电路。 集成电路可以包括形成在具有互补金属氧化物半导体(CMOS)器件的第一部分中的逻辑电路,并且可以包括形成在具有纳米机电(NEM)器件的第二部分中的存储器元件和相关联的存储器电路的至少一部分, 中继设备 NEM和CMOS器件可以通过介电堆叠中的通孔互连。 第一和第二部分中的装置可以接收相应的电源电压。 在一个合适的布置中,存储器元件可以包括提供非易失性存储特性和软错误失真(SEU)抗扰性的两个继电器开关。 在另一种合适的布置中,存储元件可以包括第一和第二交叉耦合反相电路。 第一反相电路可以包括继电器开关,而第二反相电路仅包括CMOS晶体管。 以这种方式配置的存储器元件可用于提供易失性存储特性和SEU抗扰度。
    • 8. 发明授权
    • Configuration random access memory
    • 配置随机存取存储器
    • US08030962B2
    • 2011-10-04
    • US12868575
    • 2010-08-25
    • Irfan RahimAndy L. LeeMyron Wai WongWilliam Bradley VestJeffrey T. Watt
    • Irfan RahimAndy L. LeeMyron Wai WongWilliam Bradley VestJeffrey T. Watt
    • H03K19/173
    • H03K19/1776G11C11/401G11C11/404G11C14/00H03K19/1778
    • Integrated circuits such as programmable logic device integrated circuits are provided that have configuration random-access memory elements. The configuration random-access memory elements are loaded with configuration data to customize programmable logic on the integrated circuits. Each memory element has a capacitor that stores data for that memory element. A pair of cross-coupled inverters are connected to the capacitor. The inverters ensure that the memory elements produce output control signals with voltages than range from one power supply rail to another. Each configuration random-access memory element may have a clear transistor. The capacitor may be formed in a dielectric layer that lies above the transistors of the inverters, the address transistor, and the clear transistor. The inverters may be powered with an elevated power supply voltage.
    • 提供了诸如可编程逻辑器件集成电路的集成电路,其具有配置随机存取存储器元件。 配置随机存取存储器元件装载有配置数据以在集成电路上定制可编程逻辑。 每个存储器元件具有存储该存储器元件的数据的电容器。 一对交叉耦合的反相器连接到电容器。 逆变器确保存储元件产生的输出控制信号的电压低于从一个电源轨到另一个电源的范围。 每个配置随机存取存储器元件可以具有透明晶体管。 电容器可以形成在位于反相器,地址晶体管和透明晶体管的晶体管之上的电介质层中。 逆变器可以用升高的电源电压供电。
    • 9. 发明授权
    • Integrated circuit well isolation structures
    • 集成电路阱隔离结构
    • US07902611B1
    • 2011-03-08
    • US11998016
    • 2007-11-27
    • Irfan RahimBradley JensenPeter J. McElheny
    • Irfan RahimBradley JensenPeter J. McElheny
    • H01L21/70H01L23/52H01L29/00
    • H01L27/0928H01L21/76224H01L21/765H01L21/823878H01L21/823892
    • An integrated circuit is provided with transistor body regions that may be independently biased. Some of the bodies may be forward body biased to lower threshold voltages and increase transistor switching speed. Some of the bodies may be reverse body biased to increase threshold voltages and decrease leakage current. The integrated circuit may be formed on a silicon substrate. Body bias isolation structures may be formed in the silicon substrate to isolate the bodies from each other. Body bias isolation structures may be formed from shallow trench isolation trenches. Doped regions may be formed at the bottom of the trenches using ion implantation. Oxide may be used to fill the trenches above the doped region. A deep well may be formed under the body regions. The deep well may contact the doped regions that are formed at the bottom of the trenches.
    • 集成电路设置有可独立偏置的晶体管本体区域。 一些物体可能被向前偏置,以降低阈值电压并增加晶体管切换速度。 一些物体可能被反向体偏置以增加阈值电压并减小漏电流。 集成电路可以形成在硅衬底上。 可以在硅衬底中形成体偏置隔离结构以将体彼此隔离。 体偏置隔离结构可以由浅沟槽隔离沟槽形成。 可以使用离子注入在沟槽的底部形成掺杂区域。 氧化物可用于填充掺杂区域上方的沟槽。 可以在身体区域下方形成深井。 深阱可以接触形成在沟槽底部的掺杂区域。
    • 10. 发明授权
    • On-chip voltage regulator using feedback on process/product parameters
    • 片上电压调节器,使用过程/产品参数反馈
    • US07639033B2
    • 2009-12-29
    • US11638846
    • 2006-12-13
    • Irfan RahimPeter McElhenyJohn Costello
    • Irfan RahimPeter McElhenyJohn Costello
    • G01R31/00G01R31/28
    • G11C5/147H03K19/177
    • The present invention optimizes the performance of integrated circuits by adjusting the circuit operating voltage using feedback on process/product parameters. To determine a desired value for the operating voltage of an integrated circuit, a preferred embodiment provides for on-wafer probing of one or more reference circuit structures to measure at least one electrical or operational parameter of the one or more reference circuit structures; determining an adjusted value for the operating voltage based on the measured parameter; and establishing the adjusted value as the desired value for the operating voltage. The reference circuit structures may comprise process control monitor structures or structures in other integrated circuits fabricated in the same production run. In an alternative embodiment, the one or more parameters are directly measured from the integrated circuit whose operating voltage is being adjusted.
    • 本发明通过使用对过程/产品参数的反馈来调节电路工作电压来优化集成电路的性能。 为了确定集成电路的工作电压的期望值,优选实施例提供一个或多个参考电路结构的片上探测,以测量一个或多个参考电路结构的至少一个电或操作参数; 基于所测量的参数确定所述工作电压的调整值; 并将调整后的值建立为工作电压的期望值。 参考电路结构可以包括在相同生产运行中制造的其它集成电路中的过程控制监视器结构或结构。 在替代实施例中,一个或多个参数是直接从其工作电压正被调整的集成电路测量的。