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1. 发明申请

US20110320237A1 Meeting Calendar Optimization 审中-公开
标题翻译：会议日历优化
公开(公告)号：US20110320237A1
公开(公告)日：2011-12-29
申请号：US12821755
申请日：2010-06-23
申请人： Brian S. Beaman , Mark K. Hoffmeyer , Joseph C. Diepenbrock , John L. Colbert , Roger S. Krabbenhoft , Sandra J. Shirk/Heath , William L. Brodsky
发明人： Brian S. Beaman , Mark K. Hoffmeyer , Joseph C. Diepenbrock , John L. Colbert , Roger S. Krabbenhoft , Sandra J. Shirk/Heath , William L. Brodsky
IPC分类号： G06Q10/00
CPC分类号： G06Q10/06314
摘要： A method, a computer program product, and an apparatus is provided for scheduling meetings which includes (1) evaluating a set of proposed meetings, (2) creating a number of calendars, each calendar containing schedule date for the proposed meetings, (3) ranking each calendar according to a calendar evaluation criteria and providing the ranking data with the calendar, and (4) displaying several of the calendars and their respective ranking data.
摘要翻译：提供了一种方法，计算机程序产品和装置，用于安排会议，其包括（1）评估一组拟议的会议，（2）创建多个日历，每个日历包含所提出的会议的日程安排日期;（3）根据日历评估标准对每个日历进行排序，并将日历的排名数据提供给日历，以及（4）显示若干个日历及其各自的排名数据。

2. 发明申请

US20080318455A1 BACKPLANE CONNECTOR WITH HIGH DENSITY BROADSIDE DIFFERENTIAL SIGNALING CONDUCTORS 审中-公开
标题翻译：带高密度双面差分信号导通器的背板连接器
公开(公告)号：US20080318455A1
公开(公告)日：2008-12-25
申请号：US11767890
申请日：2007-06-25
申请人： Brian S. Beaman , William L. Brodsky , Joseph C. Diepenbrock , Mark K. Hoffmeyer , Amanda E. Mikhail
发明人： Brian S. Beaman , William L. Brodsky , Joseph C. Diepenbrock , Mark K. Hoffmeyer , Amanda E. Mikhail
IPC分类号： H01R4/66
CPC分类号： H01R13/514 , H01R12/716 , H01R13/6471 , H01R13/6586
摘要： Embodiments of the present invention address deficiencies of the art in respect to backplane connectivity and provide a backplane connector for high density broadside differential signaling. In an embodiment of the invention, a backplane connector can be provided. The backplane connector can include a signal header assembly and a signal receptacle assembly. The signal header assembly can include pairs of differential signaling conductors arranged in columns for broadside signaling. Comparably, the signal receptacle assembly can include pairs of conductor receptacles arranged in columns to receive corresponding ones of the pairs of the differential signaling conductors. Finally, a surface mount (SMT) lead can be provided for each of the conductor receptacles and each of the signaling conductors
摘要翻译：本发明的实施例解决了本领域在背板连接方面的缺陷，并提供了用于高密度宽边差分信令的背板连接器。在本发明的一个实施例中，可以提供背板连接器。背板连接器可以包括信号头组件和信号插座组件。信号头组件可以包括布置成用于宽边信号的列的差分信号导体对。可比较地，信号插座组件可以包括成对布置成列的导体插座，以接收差分信号导体对中的相应对。最后，可以为每个导体插座和每个信号导体提供表面贴装（SMT）导线

3. 发明申请

US20110287638A1 LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE 失效
标题翻译：用于区域阵列设备的大规模混合插座
公开(公告)号：US20110287638A1
公开(公告)日：2011-11-24
申请号：US12783451
申请日：2010-05-19
申请人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
发明人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
IPC分类号： H01R12/16
CPC分类号： H05K7/1069 , H01L23/4006 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.
摘要翻译：公开了一种用于对准用于区域阵列装置的插座壳体段的装置。每个插座壳体段至少包括第一表面和第二表面，其中第二表面与第一表面相对。每个插座壳体段的第二表面为区域阵列器件的一部分提供电连接。插座接触垫设置在多个插座壳体段的第一表面上。插座接触焊盘对应于设置在衬底上的衬底接触焊盘。一个或多个对准结构设置在插座壳体段之间的空间处。每个对准结构联接到插座壳体段中的至少两个。一个或多个对准结构保持每个插座壳体段的预定对准，使得在表面安装连接过程期间，插座接触垫与衬底接触垫对准。

4. 发明授权

US08267701B2 Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing 失效
标题翻译：对准结构具有框架结构和桥接连接以联接和对准插座壳体的段
公开(公告)号：US08267701B2
公开(公告)日：2012-09-18
申请号：US12783451
申请日：2010-05-19
申请人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
发明人： Brian S. Beaman , William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer , Yuet-Ying Yu
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/4006 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： An apparatus is disclosed for aligning socket housing segments for an area array device. Each socket housing segment includes at least a first surface and a second surface, with the second surface opposite the first surface. The second surface of each socket housing segment provides electrical connections for a portion of the area array device. Socket contact pads are disposed on the first surfaces of the plurality of socket housing segments. The socket contact pads correspond to substrate contact pads disposed on a substrate. One or more alignment structures are disposed at a space between the socket housing segments. Each alignment structure is coupled to at least two of the socket housing segments. The one or more alignment structures maintain a predetermined alignment of each socket housing segment so that the socket contact pads align with the substrate contact pads during a surface mount connection process.
摘要翻译：公开了一种用于对准用于区域阵列装置的插座壳体段的装置。每个插座壳体段至少包括第一表面和第二表面，其中第二表面与第一表面相对。每个插座壳体段的第二表面为区域阵列器件的一部分提供电连接。插座接触垫设置在多个插座壳体段的第一表面上。插座接触焊盘对应于设置在衬底上的衬底接触焊盘。一个或多个对准结构设置在插座壳体段之间的空间处。每个对准结构联接到插座壳体段中的至少两个。一个或多个对准结构保持每个插座壳体段的预定对准，使得在表面安装连接过程期间，插座接触垫与衬底接触垫对准。

5. 发明授权

US07985095B2 Implementing enhanced connector guide block structures for robust SMT assembly 失效
标题翻译：实现强大的SMT组装的增强连接器导块结构
公开(公告)号：US07985095B2
公开(公告)日：2011-07-26
申请号：US12499913
申请日：2009-07-09
申请人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
发明人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
IPC分类号： H01R13/58
CPC分类号： H05K3/305 , H01R12/7041 , H01R12/7047 , H05K3/301 , H05K2201/09781 , H05K2201/10189 , H05K2201/10409 , H05K2201/2027 , H05K2203/167 , Y02P70/613 , Y10S439/947
摘要： A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured.
摘要翻译：一种方法和增强的连接器引导块结构实现坚固的连接器组件，其包括坚固的表面贴装技术（SMT）连接器组件。连接器引导块包括印刷线路板（PWB）配合面，其包括设置在用于接收安装螺钉的安装部分内的至少一个安装螺钉孔。连接器引导块通过将相应的非接合螺钉穿过PWB中的对准的开口插入到引导块安装孔中而与印刷线路板（PWB）组装，并且在引导块下面的PWB的上表面限定间隙安装部分。间隙填充有非导电底层填充材料并固化。另一个连接器引导块结构包括上连接器引导块部分和下连接器引导块部分，在引导块部分之间填充有选定的非导电底部填充材料并固化的间隙。

6. 发明申请

US20110008994A1 IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST SMT ASSEMBLY 失效
标题翻译：实现强化SMT组装的增强连接器指南块结构
公开(公告)号：US20110008994A1
公开(公告)日：2011-01-13
申请号：US12499913
申请日：2009-07-09
申请人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
发明人： William L. Brodsky , John L. Colbert , Mark K. Hoffmeyer
IPC分类号： H01R13/58 , H05K3/00
CPC分类号： H05K3/305 , H01R12/7041 , H01R12/7047 , H05K3/301 , H05K2201/09781 , H05K2201/10189 , H05K2201/10409 , H05K2201/2027 , H05K2203/167 , Y02P70/613 , Y10S439/947
摘要： A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured.
摘要翻译：一种方法和增强的连接器引导块结构实现坚固的连接器组件，其包括坚固的表面贴装技术（SMT）连接器组件。连接器引导块包括印刷线路板（PWB）配合面，其包括设置在用于接收安装螺钉的安装部分内的至少一个安装螺钉孔。连接器引导块通过将相应的非接合螺钉穿过PWB中的对准的开口插入到引导块安装孔中而与印刷线路板（PWB）组装，并且在引导块下方的PWB的上表面限定间隙安装部分。间隙填充有非导电底层填充材料并固化。另一个连接器引导块结构包括上连接器引导块部分和下连接器引导块部分，在引导块部分之间填充有选定的非导电底部填充材料并固化的间隙。

7. 发明授权

US5910644A Universal surface finish for DCA, SMT and pad on pad interconnections 失效
标题翻译： DCA，SMT和焊盘互连焊盘的通用表面光洁度
公开(公告)号：US5910644A
公开(公告)日：1999-06-08
申请号：US873060
申请日：1997-06-11
申请人： Dale E. Goodman , Mark K. Hoffmeyer , Roger S. Krabbenhoft
发明人： Dale E. Goodman , Mark K. Hoffmeyer , Roger S. Krabbenhoft
IPC分类号： H05K3/24 , H05K1/16
CPC分类号： H05K3/244 , H01L2224/45147 , H01L2224/49171 , H01L2924/19105
摘要： A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale). The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.
摘要翻译：公开了一种印刷电路连接器端子焊盘涂覆技术，其作为单个通用焊盘表面，其支持多种电连接实践，包括引线键合，焊接和耐磨，焊盘机械连接。三板表面处理包括镍的初始扩散涂层; 硬质耐磨贵金属或半贵金属的中间层，提供衬垫连接器可靠性的焊盘，并提供冶金稳定的焊点和引线接口; 和最后的软金涂层。中间层可以是公称厚度为35微英寸的纯钯或由钴，镍，铁或这些掺杂剂的组合硬化的金层，以实现200至250（Knoop量程）的硬度。通过单个掩蔽步骤而不是选择性掩蔽，电镀和剥离操作的顺序来实现对多个附接过程的常见表面处理的使用。在印刷电路环境中，掩模由最终的覆盖物提供，封装，密封和电绝缘在电路板应用中，或者在柔性的情况下，粘合剂涂覆的柔性覆盖物覆盖并密封铜导体元件同时暴露导体端子焊盘。

8. 发明申请

US20130295797A1 IMPLEMENTING HYBRID MOLDED SOLDER-EMBEDDED PIN CONTACTS AND CONNECTORS 有权
标题翻译：实现混合模制焊接嵌件的PIN联系人和连接器
公开(公告)号：US20130295797A1
公开(公告)日：2013-11-07
申请号：US13463185
申请日：2012-05-03
申请人： Mark K. Hoffmeyer
发明人： Mark K. Hoffmeyer
IPC分类号： H01R13/02 , H01R43/16
CPC分类号： H01R12/58 , H01R43/0256 , H01R43/16
摘要： A method and structures for implementing hybrid molded solder-embedded pin contacts and connectors. An injection molded solder (IMS) mold cavity receives a Pin-In-Hole (PIH) connector pin. A lead-free solder is injection molded into the IMS mold cavity embedding and surrounding the PIH connector pin and forming a predefined molded solder shape defined by the PIH connector pin and the IMS mold cavity.
摘要翻译：一种用于实现混合模制焊料嵌入式针式触头和连接器的方法和结构。注射成型焊料（IMS）模腔容纳针孔（PIH）连接器针。将无铅焊料注射到IMS模腔中，嵌入并围绕PIH连接器引脚，并形成由PIH连接器引脚和IMS模腔定义的预定义模制焊接形状。

9. 发明授权

US6127731A Capped solder bumps which form an interconnection with a tailored reflow melting point 有权
标题翻译：形成与定制回流熔点相互连接的凸起的焊料凸块
公开(公告)号：US6127731A
公开(公告)日：2000-10-03
申请号：US266586
申请日：1999-03-11
申请人： Mark K. Hoffmeyer
发明人： Mark K. Hoffmeyer
IPC分类号： H01L21/60 , H01L23/485 , H05K3/34 , H01L21/44 , H01L23/48
CPC分类号： H01L24/13 , H01L24/11 , H05K3/3436 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/131 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/30107 , H05K2203/0435 , H05K3/3463 , Y02P70/613
摘要： The melting point of the solder forming a controlled collapse chip connection is tailored by forming a thin metal cap of a metal such as palladium or silver on a solder bump. When the solder bump is melted during reflow, the metal cap dissolves into the solder. Because the resulting alloy has a higher melting point than the solder, subsequent reflow processing does not melt the chip join structure.
摘要翻译：形成受控崩溃芯片连接的焊料的熔点通过在焊料凸块上形成诸如钯或银之类的金属的薄金属盖而被定制。当回焊焊料凸起熔化时，金属帽溶解到焊料中。由于所得合金的熔点高于焊料，所以后续的回流处理不会熔化芯片接合结构。

10. 发明授权

US5632438A Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization 失效
标题翻译：直接芯片连接工艺和铝线接线铜电路设备
公开(公告)号：US5632438A
公开(公告)日：1997-05-27
申请号：US541256
申请日：1995-10-12
申请人： Mark K. Hoffmeyer , Gregg A. Knotts , Connie J. Mathison
发明人： Mark K. Hoffmeyer , Gregg A. Knotts , Connie J. Mathison
IPC分类号： H01L21/48 , H01L21/60 , H01L21/603
CPC分类号： H01L24/85 , H01L21/4864 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8501 , H01L2224/85011 , H01L24/45 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/14 , H01L2924/181
摘要： A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.
摘要翻译：提供了用于铜电路上的铝线接合的直接芯片附接工艺和装置。在至少一个集成电路芯片附着到载体上之后，将含有柠檬酸和草酸的添加剂的含水清洗溶液施加到载体和附着的集成电路芯片上。然后将去离子水冲洗物施加到载体和附接的集成电路芯片上，然后干燥一段固定的时间。执行由载体承载的铜电路的下一次引线接合。

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